JPH0219965Y2 - - Google Patents
Info
- Publication number
- JPH0219965Y2 JPH0219965Y2 JP1985018217U JP1821785U JPH0219965Y2 JP H0219965 Y2 JPH0219965 Y2 JP H0219965Y2 JP 1985018217 U JP1985018217 U JP 1985018217U JP 1821785 U JP1821785 U JP 1821785U JP H0219965 Y2 JPH0219965 Y2 JP H0219965Y2
- Authority
- JP
- Japan
- Prior art keywords
- loop
- wire
- bonding
- height
- loop detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 30
- 230000002950 deficient Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985018217U JPH0219965Y2 (US20020095090A1-20020718-M00002.png) | 1985-02-12 | 1985-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985018217U JPH0219965Y2 (US20020095090A1-20020718-M00002.png) | 1985-02-12 | 1985-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61136538U JPS61136538U (US20020095090A1-20020718-M00002.png) | 1986-08-25 |
| JPH0219965Y2 true JPH0219965Y2 (US20020095090A1-20020718-M00002.png) | 1990-05-31 |
Family
ID=30506644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985018217U Expired JPH0219965Y2 (US20020095090A1-20020718-M00002.png) | 1985-02-12 | 1985-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0219965Y2 (US20020095090A1-20020718-M00002.png) |
-
1985
- 1985-02-12 JP JP1985018217U patent/JPH0219965Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61136538U (US20020095090A1-20020718-M00002.png) | 1986-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5084959A (en) | Chip mounting apparatus | |
| US4347964A (en) | Wire bonding apparatus | |
| IE49684B1 (en) | Systems for bonding pellets,for example semiconductor chips,to supports | |
| JPH0367338B2 (US20020095090A1-20020718-M00002.png) | ||
| JPH0219965Y2 (US20020095090A1-20020718-M00002.png) | ||
| US5040293A (en) | Bonding method | |
| JP2598192B2 (ja) | 半導体製造装置 | |
| JPH0238450Y2 (US20020095090A1-20020718-M00002.png) | ||
| JPH05308086A (ja) | 半導体製造装置 | |
| JP2864161B2 (ja) | 位置決め制御方法 | |
| JP2534912B2 (ja) | ワイヤボンディング装置 | |
| JPH07302806A (ja) | リードフレームの位置決め装置 | |
| JP2685137B2 (ja) | ワイヤボンダ | |
| JPS61148828A (ja) | ワイヤボンデイングの検査方法 | |
| JP2977953B2 (ja) | ワイヤボンディング方法 | |
| JPS62150831A (ja) | ワイヤボンダ | |
| JPH0124931Y2 (US20020095090A1-20020718-M00002.png) | ||
| JPS613417A (ja) | ボンデイング方法 | |
| JPS61119054A (ja) | 自動ワイヤボンデイング装置 | |
| JPH0110930Y2 (US20020095090A1-20020718-M00002.png) | ||
| JPS62104126A (ja) | ワイヤボンデイング方法 | |
| JPH0462944A (ja) | インナーリードボンディング方法 | |
| JPH04730A (ja) | ワイヤボンディング装置 | |
| JPS63236340A (ja) | ワイヤボンデイング装置 | |
| JPH0438135B2 (US20020095090A1-20020718-M00002.png) |
