JPH0219780B2 - - Google Patents
Info
- Publication number
- JPH0219780B2 JPH0219780B2 JP57121242A JP12124282A JPH0219780B2 JP H0219780 B2 JPH0219780 B2 JP H0219780B2 JP 57121242 A JP57121242 A JP 57121242A JP 12124282 A JP12124282 A JP 12124282A JP H0219780 B2 JPH0219780 B2 JP H0219780B2
- Authority
- JP
- Japan
- Prior art keywords
- paper
- resin
- coated
- phenolic resin
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 17
- 239000005011 phenolic resin Substances 0.000 claims description 15
- 238000013508 migration Methods 0.000 claims description 11
- 230000005012 migration Effects 0.000 claims description 11
- 229920001568 phenolic resin Polymers 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 239000003063 flame retardant Substances 0.000 claims description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000000123 paper Substances 0.000 description 31
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 239000002655 kraft paper Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- -1 octylphenol Chemical compound 0.000 description 2
- VIHUMJGEWQPWOT-UHFFFAOYSA-N 1,2,3-tribromo-4-(3-bromophenoxy)benzene Chemical compound BrC1=CC=CC(OC=2C(=C(Br)C(Br)=CC=2)Br)=C1 VIHUMJGEWQPWOT-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
本発明は印刷回路板において基板表面に施され
る銀ジヤンパー印刷回路等で問題となる耐金属マ
イグレーシヨン性に優れた銅張積層板の製法に関
する。
紙基材フエノール樹脂銅張積層板は比較的安価
なため民生用電子機器に多量に使用されている
が、その用途も多様化しかつきびしい使われ方を
されている。その用途の一つとして片面銅張積層
板において銅箔回路のみではなく、その裏面の基
板側に銀ジヤンパー線等の印刷回路を施す例もあ
る。このような回路に長時間印加電圧をかけると
銀ジヤンパー間に銀のマイグレーシヨンが発生
し、パターンシヨートの問題が起り、その改良検
討が急がれている。
本発明はこれらの問題点を解決すべくなされた
もので、積層板用原紙に水溶性フエノール樹脂を
含浸、加熱乾燥後、さらに可塑性フエノール樹脂
または難燃性フエノール樹脂を含浸、加熱乾燥さ
せた二度塗り加工紙を、他の加工紙を重ね合わせ
て成る基材の一方側の面に、銅箔を該基材の反対
側の面にそれぞれ配置し、加熱加圧して得られる
基板表面の耐金属マイグレーシヨン性に優れた銅
張積層板の製造法を提供するものである。
本発明に使用される積層板用原紙とはクラフト
紙、コツトンリンター紙である。
本発明に使用される下塗り樹脂としてはフエノ
ールとホルマリンもしくはホルムアルデヒドとを
アミン触媒下で常法によつて反応させた水溶性フ
エノール樹脂が挙げられる。また上塗り樹脂とし
ては、フエノール、クレゾール、ブチルフエノー
ル、オクチルフエノール、ノニルフエノール等を
酸性触媒下で桐油と反応させた反応物に、ホルマ
リンまたはホルムアルデヒドをアミン触媒で常法
により合成した油変性フエノール樹脂が用いられ
る。また難燃性フエノール樹脂としてはテトラブ
ロモジフエニルエーテル、テトラブロモビスフエ
ノールＡ等の臭素系難燃剤、トリフエニルホスフ
エート、クレジルジフエニルホスフエート等のリ
ン系難燃剤、ヘキサメチレンテトラミン等のチツ
素系難燃剤等を所定量上記油変性フエノール樹脂
に添加したものである。
次に加工紙の製造方法としては、まず積層板用
原紙であるクラフト紙もしくはリンター紙に対し
約10〜20％程度のレジンコンテントで水溶性フエ
ノール樹脂を含浸塗布し、加熱乾燥し下塗り加工
紙を製造し、その上に油変性フエノール樹脂もし
くは難燃性フエノール樹脂を原紙に対し50〜55％
のレジンコンテントになるように含浸塗布し加熱
乾燥して二度塗り加工紙を得る。
この加工紙１枚を他の加工紙を複数枚重ね合わ
せて成る基材の一方の側の面に、銅箔を基材の二
度塗り加工紙の反対側の面にそれぞれ配置し、常
法により加熱加圧成形して基板面での耐金属マイ
グレーシヨン性の優れた銅張積層板を得る。
以下に実施例を挙げて本発明を説明する。
実施例 １
水溶性フエノール樹脂を樹脂量が20％になるよ
うに10ミルスクラフト原紙に塗布含浸乾燥し下塗
り加工紙を得た。その下塗り加工紙に油変性フエ
ノール樹脂をクラフト原紙に対し樹脂量が50％に
なるように塗布含浸乾燥し二度塗り加工紙を得
た。
次に10ミルスクラフト紙に油変性フエノール樹
脂を樹脂量が50％になるように塗布含浸乾燥し、
一度塗り加工紙を得た。
二度塗り加工紙１枚を、一度塗り加工紙７枚を
積み重ねた基材の一方の側に重ねる（図参照）。
基材の二度塗り加工紙の反対側の面に接着剤付銅
箔を重ねた後、蒸気プレスにて加熱加圧成形し銅
張積層板を得た。
実施例 ２
実施例１において二度塗り加工紙に用いる油変
性フエノール樹脂の代りに難燃性フエノール樹脂
を用いた以外、他は実施例１と全く同様にして銅
張積層板を得た。
比較例 １
10ミルスクラフト原紙に油変性フエノール樹脂
を樹脂量が50％になるように塗布含浸乾燥し一度
塗り加工紙を得た。この加工紙を８枚積み重ねた
後、その上に接着剤付銅箔を施した後、蒸気プレ
スにて加熱加圧成形し、銅張積層板を得た。
比較例 ２
比較例１において油変性フエノール樹脂の代り
に難燃性フエノール樹脂を用いた以外はすべて同
じようにして銅張積層板を得た。
実施例、比較例で製造した銅張積層板を各々
200×150mmに切断後、基板面に所定の金属マイグ
レーシヨンパターンを銀ペイントにて印刷し、
160℃×１時間加熱し、金属マイグレーシヨン試
験の試験片を作成した。
このパターンに50V直流電圧を負荷し、40℃×
95％RHの雰囲気中に放置し、銀パターン表面を
顕微鏡（50倍）にて随時目視観察し、耐金属マイ
グレーシヨン性の評価を下表に示す。その結果、
実施例１、２は比較例１、２に比べ優れたマイグ
レーシヨン特性を示した。
The present invention relates to a method for manufacturing a copper-clad laminate that has excellent metal migration resistance, which is a problem in silver jumper printed circuits and the like applied to the surface of a printed circuit board. Paper-based phenolic resin copper-clad laminates are relatively inexpensive and are used in large quantities in consumer electronic devices, but their applications are diversifying and they are used in difficult ways. As one of its uses, in addition to a copper foil circuit in a single-sided copper-clad laminate, there is also an example in which a printed circuit such as a silver jumper wire is provided on the back side of the board. When a voltage is applied to such a circuit for a long time, silver migration occurs between the silver jumpers, causing a pattern shorting problem, and there is an urgent need to investigate improvements to this problem. The present invention was made to solve these problems, and the base paper for laminates is impregnated with a water-soluble phenolic resin, heated and dried, and then further impregnated with a plastic phenolic resin or flame-retardant phenolic resin and heated and dried. The resistance of the substrate surface obtained by placing multi-coating processed paper on one side of a base material made by stacking other processed papers and placing copper foil on the opposite side of the base material and applying heat and pressure. The present invention provides a method for manufacturing a copper-clad laminate with excellent metal migration properties. The base paper for laminated boards used in the present invention is kraft paper or cotton linter paper. The undercoat resin used in the present invention includes a water-soluble phenol resin prepared by reacting phenol with formalin or formaldehyde in the presence of an amine catalyst in a conventional manner. The top coating resin is an oil-modified phenol resin synthesized by a conventional method using a reaction product such as phenol, cresol, butylphenol, octylphenol, nonylphenol, etc., reacted with tung oil under an acidic catalyst, and formalin or formaldehyde using an amine catalyst. used. Examples of flame-retardant phenolic resins include bromine-based flame retardants such as tetrabromodiphenyl ether and tetrabromobisphenol A, phosphorus-based flame retardants such as triphenyl phosphate and cresyl diphenyl phosphate, and chisels such as hexamethylenetetramine. A predetermined amount of a base flame retardant or the like is added to the oil-modified phenolic resin. Next, as a manufacturing method for processed paper, first, kraft paper or linter paper, which is the base paper for laminates, is impregnated and coated with a water-soluble phenol resin with a resin content of about 10 to 20%, and then heated and dried to form an undercoated processed paper. 50 to 55% of the base paper is coated with oil-modified phenolic resin or flame-retardant phenolic resin.
The paper is impregnated and coated to a resin content of 100%, and heated and dried to obtain a double-coated paper. One sheet of processed paper is placed on one side of a base material made by overlapping multiple sheets of other processed paper, and copper foil is placed on the opposite side of the two-coated processed paper. A copper-clad laminate with excellent metal migration resistance on the substrate surface is obtained by heat-pressing molding. The present invention will be explained below with reference to Examples. Example 1 A water-soluble phenol resin was coated on 10 mils Kraft base paper so that the amount of resin was 20%, impregnated and dried to obtain an undercoated paper. The undercoated paper was coated with oil-modified phenolic resin so that the amount of resin was 50% of the kraft base paper, and then dried to obtain a double-coated paper. Next, apply oil-modified phenolic resin to 10 mils kraft paper so that the resin amount is 50%, impregnate it, and dry.
Once coated, processed paper was obtained. Lay one sheet of double-coated paper on one side of a stack of seven sheets of single-coated paper (see diagram).
An adhesive-coated copper foil was layered on the opposite side of the double-coated processed paper as a base material, and then heated and pressure-molded using a steam press to obtain a copper-clad laminate. Example 2 A copper-clad laminate was obtained in the same manner as in Example 1, except that a flame-retardant phenolic resin was used instead of the oil-modified phenolic resin used in the double-coated paper. Comparative Example 1 An oil-modified phenolic resin was coated on 10 mils Kraft base paper so that the amount of resin was 50%, and the impregnation was dried to obtain a coated paper. After stacking eight sheets of this processed paper, adhesive-coated copper foil was applied thereon, and then heated and pressure-molded using a steam press to obtain a copper-clad laminate. Comparative Example 2 A copper-clad laminate was obtained in the same manner as in Comparative Example 1 except that a flame-retardant phenolic resin was used instead of the oil-modified phenolic resin. The copper-clad laminates manufactured in Examples and Comparative Examples were each
After cutting to 200 x 150 mm, a predetermined metal migration pattern is printed on the board surface using silver paint.
It was heated at 160°C for 1 hour to prepare a test piece for metal migration test. Load this pattern with 50V DC voltage and
The silver pattern surface was left in an atmosphere of 95% RH and visually observed at any time using a microscope (50x magnification), and the metal migration resistance was evaluated as shown in the table below. the result,
Examples 1 and 2 exhibited superior migration characteristics compared to Comparative Examples 1 and 2.
【表】
△ 銀マイグレーシヨンの発生あり、
しかしシヨートしていない
× 銀マイグレーシヨンの発生あり、
シヨート
[Table] △ Silver migration occurs,
but not shot
× Silver migration occurs,
shoot
図は実施例１における本発明の銅張積層板の断
面図である。
１……接着剤付銅箔、２……一度塗り加工紙、
３……二度塗り加工紙。
The figure is a cross-sectional view of the copper-clad laminate of the present invention in Example 1. 1... Copper foil with adhesive, 2... Single coated paper,
3...Double coated paper.
Claims (1)
ノール樹脂を含浸し加熱乾燥させた後、上塗り樹
脂として可塑性フエノール樹脂または難燃性フエ
ノール樹脂を含浸して加熱乾燥させた二度塗り加
工紙を、他の加工紙を重ね合わせて成る基材の一
方側の面に、銅箔を該基材の二度塗り加工紙の反
対側の面にそれぞれ配置し、加熱加圧成形するこ
とを特徴とする基材表面の耐金属マイグレーシヨ
ン性に優れた銅箔積層板の製造法。1 Double-coated processed paper obtained by impregnating a base paper for laminates with a water-soluble phenolic resin as an undercoat resin and heating and drying it, then impregnating a plastic phenolic resin or a flame-retardant phenolic resin as a topcoat resin and drying it by heating, etc. A substrate characterized in that a copper foil is placed on one side of a base material made by stacking two coated processed papers, and a copper foil is placed on the opposite side of the two-coated processed paper, and then heated and press-formed. A method for manufacturing copper foil laminates with excellent metal migration resistance on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12124282A JPS5912845A (en) | 1982-07-14 | 1982-07-14 | Manufacture of copper lined laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12124282A JPS5912845A (en) | 1982-07-14 | 1982-07-14 | Manufacture of copper lined laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5912845A JPS5912845A (en) | 1984-01-23 |
| JPH0219780B2 true JPH0219780B2 (en) | 1990-05-07 |
Family
ID=14806415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12124282A Granted JPS5912845A (en) | 1982-07-14 | 1982-07-14 | Manufacture of copper lined laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5912845A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01144428A (en) * | 1987-11-30 | 1989-06-06 | Shin Kobe Electric Mach Co Ltd | Production of laminated board of paper substrate and phenolic resin |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236912A (en) * | 1975-09-18 | 1977-03-22 | Mitsubishi Electric Corp | Narrow band television system |
| JPS5316839A (en) * | 1976-07-12 | 1978-02-16 | Mitsubishi Electric Corp | Gas insulated switchgear |
-
1982
- 1982-07-14 JP JP12124282A patent/JPS5912845A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236912A (en) * | 1975-09-18 | 1977-03-22 | Mitsubishi Electric Corp | Narrow band television system |
| JPS5316839A (en) * | 1976-07-12 | 1978-02-16 | Mitsubishi Electric Corp | Gas insulated switchgear |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5912845A (en) | 1984-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4410388A (en) | Production of metal clad laminates | |
| JPH0219780B2 (en) | ||
| JPH0219779B2 (en) | ||
| JPH1134273A (en) | Manufacture of laminate | |
| JPH0375031B2 (en) | ||
| JPS61261043A (en) | Manufacture of metallic foil lined laminated board | |
| JPS6054860B2 (en) | Copper-clad phenolic resin laminate | |
| JPH0715019B2 (en) | Tracking resistance Copper-clad phenolic resin laminate | |
| JPH0538789A (en) | Manufacture of prepreg and laminated board for silver through-hole printed wiring board | |
| JPH0225379B2 (en) | ||
| JPS63205229A (en) | Manufacture of thermo-setting resin laminated board | |
| JPH04316390A (en) | One-side copper-plated laminated board | |
| JPH0382195A (en) | Electric laminated board | |
| JPH04142338A (en) | Preparation of laminated sheet | |
| JPS61183325A (en) | Laminated sheet and its production | |
| JPH0976262A (en) | Preparation of paper base copper-clad laminate | |
| JPS61261044A (en) | Manufacture of metallic foil lined laminated board | |
| JPH08230106A (en) | Manufacture of copper foil-clad laminate | |
| JPH0231105B2 (en) | ||
| JPS61261042A (en) | Metallic foil lined laminated board | |
| JPS61209233A (en) | Production of laminated sheet | |
| JPS6115826B2 (en) | ||
| JPS60226531A (en) | Thermosetting resin composition for laminated sheet | |
| JPS61209232A (en) | Production of laminated sheet | |
| JPS60174647A (en) | Paper base-material epoxy resin laminated board |