JPH02192677A - Microwave circuit earthing method - Google Patents

Abstract

PURPOSE:To make it possible to acquire sufficient earthing at a desired position of a printed plate by inserting a metal pin and penetrating it to a through-hole stopper, contacting an elastic metal contact to a metallic lid, and fixing the other side end of the metal pin projecting in a space between a pattern surface and the metallic lid to the pattern surface. CONSTITUTION:A metal pin 3 in which an elastic metal contact 33 is installed to one end of a metal rod 31 whose diameter is smaller than that of a through- hole 12, and a through-hole stopper 32 is installed at the position at a specific distance from the end of the metal rod 31, is inserted to the through-hole 12 arranged in an earthing pattern from a part-mounting surface and penetrated up to the through-hole stopper 32. While the elastic contact 33 is contacted to a metallic lid 21 at the part-mounting surface side of a printed plate 11, the other end side of the metal pin 3 projecting in a space formed by a pattern surface and a metallic lid 22 is fixed to the pattern surface, and the printed plate 11 is earthed to a metal case 17. As a result, a sufficient earthing can be acquired at a desired position of the printed plate 11.

Description

[Detailed Description of the Invention] [Summary] Regarding the microwave circuit grounding method used for microwave radio equipment with two frequencies up to about 2 GHz, for example, when the microwave circuit is formed on a printed board, In order to ensure sufficient grounding at any location, a printed board with a microwave circuit formed and a through hole between the component mounting surface and the button surface was attached to a metal cap with a metal lid. Store it inside the case.

When the printed board is grounded to the metal case, at least one elastic metal contact portion is provided at one end of the metal rod having a diameter smaller than the diameter of the through hole, and a through hole stopper is provided at a predetermined distance from the end. Insert the attached metal pins into the through-holes provided in the ground pattern from the component mounting surface, pass through the through-hole stoppers, and connect the elastic metal contact portions to the metal lid on the component mounting surface side of the printed board. At the same time, the printed board is grounded to the metal case by fixing the other end of the metal pin protruding into the space formed by the pattern surface and the metal lid to the pattern surface.

[Industrial Application Field] The present invention relates to a microwave circuit grounding method used in a microwave radio device having a frequency up to about 2 Gllz, for example.

Generally, a microwave circuit used at two frequencies within about 2 GHz is formed on a printed circuit board and housed in a metal case with a metal lid. At this time, in order to faithfully bring out the electrical characteristics of the microwave circuit, it is necessary to ensure that sufficient grounding can be achieved at any position on the printed board.

[Prior art] Fig. 4 is an example of a printed board mounting diagram, in which Fig. 4(a) is a sectional view taken along line A-A' in Fig. 4(b), and Fig. 4(b) is a component mounting surface of the printed board. FIG. 4(C) is a perspective view of the pattern surface of the printed board, and FIG. 4(d) is a perspective view of the through hole portion of the pattern surface.

Generally, the printed board 11 is composed of a component mounting surface on which components are mainly mounted and a pattern surface on which a pattern is mainly formed, as shown in FIG. 4(a).

As shown in FIG. 4(b), the component mounting surface is the surface on which components 1 (e.g., hybrid IC,) Rangemetal 1 resistor, coil, etc. are mounted, and part of it has a power supply pattern 16, and the rest has a ground pattern. 15 is formed.

Further, the surface opposite to the component mounting surface is a patterned surface as shown in FIGS. 4(C) and 4(d), and a signal pattern 14 is formed in a part thereof. A ground pattern is formed on the back side of this signal button, and the impedance is 1, for example, 50.
It is Ω. Note that a chip component 13 such as an amplifier is connected to this signal pattern.

Note that the ground pattern on the component mounting surface of the printed board 11 and the ground pattern on the pattern surface are connected via a plurality of through holes 12.

Now, the microwave circuit formed on the printed board as shown in FIGS. 4(a) to 4(d) is shown in FIG. 5(a).

As shown in FIG. 5(b), all or a part of the periphery of the printed circuit board 11 and the inside of the metal case 17 are soldered 18 to bring the printed board and the metal case into contact and to establish grounding. .

At this time, near the center of the printed board "B", the distance from the contact part with the metal case is longer than, for example, the distance from B. Also, as shown in Figure 5 (C), the arrangement of components and the mounting density When the voltage is raised, a signal pattern or a power supply pattern is formed, and there are cases where the ground pattern is almost impossible to remove.

[Problem to be solved by the invention]

Here, the distance between B on the printed board and the contact part of the metal case is short, so sufficient grounding can be achieved, but the distance between B" near the center of the printed board and the contact part of the metal case is long, so B" A potential difference occurs between the contact area and the contact area, resulting in incomplete grounding.

Similarly, when one grounding pattern cannot be obtained, the grounding is also incomplete. In this case, the electrical performance of the microwave circuit cannot be fully exploited.

That is, there is a problem in that it is difficult to obtain sufficient grounding at any arbitrary position on the printed board.

An object of the present invention is to enable sufficient grounding at any position on the printed board when a microwave circuit is formed on the printed board.

[Means to solve problems]

FIG. 1 shows a block diagram of the principle of the present invention.

Reference numeral 3 designates a metal pin having at least one elastic metal contact portion attached to one end of a metal rod having a diameter capable of passing through the through hole, and a through hole stopper attached at a predetermined distance from the one end.

Then, a metal pin is inserted into a through hole provided in the ground pattern on the pattern surface and penetrated to the through hole stopper, and the elastic metal contact portion is brought into contact with the metal lid on the component mounting surface side of the printed board. At the same time, the other end of the metal pin protruding into the space created by the pattern surface and the metal lid is fixed to the pattern surface, thereby grounding the printed board to the metal case.

(Function) In the present invention, at least one elastic metal contact portion 33 is attached to one end of a metal rod 31 having a diameter that can pass through a through hole 12 provided in a printed board, and a through hole stopper 32 is attached at a predetermined distance from the one end. Prepare the metal pin 3.

Then, insert a metal pin into the through hole provided in the ground pattern on the pattern surface and pass it through to the through hole stopper, and bring the elastic metal contact part into contact with the metal lid on the component mounting surface side, and connect it to the pattern surface. The other end of the metal pin protruding into the space created by the metal lid is fixed to the pattern surface.

Thereby, the printed board can be grounded to the metal case at any through-hole location within the grounding pattern.

〔Example〕

FIG. 2 is a block diagram of an embodiment of the present invention, and FIG. 3 is a diagram showing an example of the shape of the elastic metal contact portion in FIG. 2. Note that the same reference numerals indicate the same objects throughout the figures. The operation shown in FIG. 2 will be explained below with reference to FIG. Further, 34 indicates soldering.

First, as shown in FIG. 3(a), a spring material is attached to one end of a metal rod 31 having a diameter smaller than the diameter of the through hole 12 (the inner surface of the hole is covered with a conductive layer) provided in the printed surface. A metal pin is made by attaching a perforated disc having a diameter larger than the diameter of the through hole to a certain rectangular metal piece 331 at a position D from one end as a through hole stopper 32.

Note that the rectangular metal piece 331 mentioned above is the elastic metal contact portion 3.
This is an example of No. 3.

Then, when a metal pin is inserted into any through hole 12 provided in the ground pattern and passed through to the through hole stopper, the other end of the metal pin is inserted into the space created by the pattern surface of the printed board 11 and the metal 1i22. stand out. Therefore, the pattern surface and the other end of the metal pin are soldered to fix the metal pin. In addition, a rectangular metal piece 331
is pressed against the metal lid 21 to make the contact more complete.

As an example of another shape of the metal pin, as shown in FIG. 3(b), the upper part of the elastic contact portion is a metal with four rectangular shapes, and in any case, the contact between the metal pin and the metal M21 is more complete.

That is, when a microwave circuit is formed on a printed board, sufficient grounding can be achieved at any position on the printed board.

This has the effect that sufficient grounding can be achieved at any position on the lint board.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of the principle of the present invention, Fig. 2 is a configuration diagram of an embodiment of the present invention, Fig. 3 is an example of the shape of the metal pin in Fig. 2, Fig. 4 is an example of a printed board mounting diagram, FIG. 5 shows a configuration diagram of a conventional example. In the figure, 3 is a metal pin, 11 is a printed board, 12 is a through hole, 17 is a metal case, and 21 and 22 are metal lids. [Effects of the Invention] As explained in detail above, according to the present invention, a microwave circuit is provided. When is formed on a printed board, calculate to figure 1-ee example of missing ribs. Diagram Ishiba Iku II
5 notes

Claims (1)

[Claims] A printed board (12) on which a microwave circuit is formed and a through hole (12) is provided between the component mounting surface and the pattern surface.
11) into a metal case (21, 22) with a metal lid (21, 22)
17) A metal rod (31) having a diameter smaller than the diameter of the through-hole when the printed board is grounded to the metal case.
At least one resilient metal contact portion (33) at one end and a through-hole stop (33) at a predetermined distance from the one end.
32), respectively, are inserted into the through holes provided in the ground pattern from the component mounting surface and penetrated to the through hole stopper, and the elastic metal contact portions (33) are connected to the printed board. The other end of the metal pin protruding into the space formed by the pattern surface and the metal lid (22) is fixed to the pattern surface. A microwave circuit grounding method characterized in that the printed board is grounded to a metal case.