JPH01238303A - Connection structure for microstrip line - Google Patents

Abstract

PURPOSE:To obtain an excellent transmission characteristic by providing a ground pattern connected to a rear face conductor face through a through hole, etc., to the front face of the dielectric board and connecting the ground pattern to the rear face ground conductor face of other dielectric board or the ground pattern formed similarly. CONSTITUTION:Strip patterns 3A, 3B formed to dielectric boards 1A, 1B are connected to a connection conductor 4 by solder 5. Moreover, the same grounding is arranged, the ground patterns 7A, 7B are provided on the front face of the dielectric boards 1A, 1B and they are soldered to attain common grounding. Furthermore, the ground patterns 7A, 7B are connected to the rear face ground conductors 2A, 2B by through holes 8A, 8B. Then the ground patterns 7A, 7B are made lose to the strip patterns 3A, 3B up to a range not giving any high frequency effect. Thus, the same ground is implemented in terms of high frequency, then electric field distribution is continuous and an excellent transmission characteristic is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a connection structure for microstrip lines used in microwave communication devices and the like.

<Prior Art> In devices that handle microwaves, such as microwave communication devices, a substrate having a microstrip line is generally used as a circuit configuring the inside of the device.

An example of this microstrip line is shown in FIG. In the figure, the microstrip line is connected to a dielectric substrate 12.
It consists of a strip pattern 11 formed on the front surface of the substrate, a ground conductor surface 13 formed on the back surface of the same substrate, and a dielectric substrate 12. At this time, the electric lines of force show a continuous electric field distribution from the strip pattern 11 toward the ground conductor, as shown in FIG. are doing.

FIG. 4 shows an example in which the dielectric substrate 12 on which such a microstrip line is formed is connected to another similarly formed dielectric substrate. FIG. 4 is a perspective view showing how two dielectric substrates fixed to the housing 9 are connected.

The strip patterns 11 are electrically connected by connecting the strip patterns 3A and 3B formed on each dielectric substrate 18 and IB to the connection conductor 4 using solder 5. Also, the ground conductor 2 on the back side of the dielectric substrates IA and IB
The connections A and 2B are placed in and in contact with the same metal casing 9 to provide common grounding. Here, the fixing screw 6 fixes the dielectric substrates IA and IB so that they do not shift, and
The back ground conductor surfaces 2A and 2B serve to make complete contact with the metal housing 9.

<Problems to be Solved by the Invention> FIG. 5 shows an enlarged view of the connecting portion of the above microstrip line connecting method. This figure is a drawing seen from the lateral direction of the board.

Here, the following problems can be pointed out in this connection method.

(2) It is clear that the dielectric substrates IA and IB are completely grounded near the set screw 6. However, when looking at the board connection parts other than those mentioned above under magnification, as shown in FIG. A gap may occur, and the grounding state may not be continuous in terms of microwaves. Therefore, as shown in Figure 3 (B), a continuous electric field distribution is no longer established, and the microwave is reflected at that part. As a result, the transmission characteristics were adversely affected.

In order to solve this problem, the distance between the set screws 6 is made as close to the edge of the board as possible.
There are problems such as collision of the screw heads due to bringing the stopper 6 close to the edge and machining accuracy of the screw hole in the board, and there is naturally a limit to how close the stopper 6 can be to the edge.

Also, since the head of the set screw 6 is in contact with the ground, it protrudes with a certain height and width above the board surface, so it can also be moved in the direction approaching the strip pattern 11 (orthogonal direction in the drawing). There is a limit, and it is difficult to completely ensure high frequency common grounding in the vicinity of the strip pattern 11.

■Another method to solve the above problem (■) has been proposed, for example, to solder the entire surface of the board to the metal casing for grounding. It is necessary to raise the temperature to a certain temperature, and if parts and the like are already mounted on the board, the process of changing the melting temperature of the solder used becomes complicated, which is not practical.

The present invention was devised in view of the above circumstances, and an object of the present invention is to provide a microstrip line connection structure that can achieve complete common grounding using a simple method and obtain a continuous electric field distribution.

<Means for Solving the Problems> The microstrip line connection structure according to the present invention is different from the microstrip line in which a strip pattern is formed on the front surface of a dielectric substrate and a ground conductor surface is formed on the back surface of the dielectric substrate. In a structure in which a microstrip line is connected to a dielectric substrate on which a strip pattern is formed on the front surface and a ground conductor surface is formed on the back surface in the same manner as described above, at least one of the dielectric substrates is provided with a ground pattern on its front surface, and the A through hole or the like that penetrates the ground pattern and the ground conductor surface is formed, and through this through hole, solder or a conductive member for connection is used to connect the ground pattern and the ground conductor surface of another dielectric substrate, or similarly. It is characterized in that the formed ground patterns are connected.

In the microstrip line connection structure of the present invention, the ground pattern can be formed up to the edge surface of the board, and the diameter of the through hole can be made sufficiently smaller than the diameter of the hole for the set screw. It is possible to provide it at a position sufficiently close to . Furthermore, in the direction perpendicular to the strip pattern, since there is no protruding part such as a screw head, the ground pattern can be brought close to a range where there is no influence on high frequencies. Therefore, the back ground conductor surfaces of the two dielectric substrates are commonly grounded via the through hole, and substantially the same grounding is possible at the substrate connection end surfaces, so that the grounding state is continuous. Therefore, a continuous electric field distribution can be obtained, resulting in good transmission characteristics.

<Example> A first example of the present invention is shown in FIG. Components similar to those in FIG. 4 are designated by the same reference numerals.

Strip patterns 3A and 3B formed on each dielectric substrate 18 and IB connect connecting conductors 4 with solder 5. Further, in order to obtain the same ground, ground patterns 7A and 7B are provided on the surfaces of the dielectric substrates IA and IB, and these are connected with solder to provide a common ground. In addition, grounding pattern 7A,
7B is a back ground conductor 28 at through holes 8A and 8B,
Connected to 2B. Here, ground patterns 7A and 7B
is strip pattern 3 up to a range that has no effect on high frequencies.
It is possible to approach A and 3B. In this embodiment, the grounding of the two boards is stopped and the warpage of the boards 6 and
Alternatively, since the same high-frequency grounding can be achieved without being affected by the precision of the housing, a continuous electric field distribution can be obtained, and good transmission characteristics can be obtained.

Another embodiment of the invention is shown in FIG. In this embodiment, two dielectric substrates IA and IB are vertically connected. The figure (A) is a front cross-sectional view, and the figure (B) is a plan view.

The strip pattern 3A formed on the dielectric substrate IA and the strip pattern 3B formed on the dielectric substrate IB are connected by solder 5 through the dielectric substrate IA using a connecting pin 10. Further, the dielectric substrates IA and IB are fixed to each other by fixing screws 6 in the conventional manner. In this example, the ground pattern 7B connected by the through hole 8B formed on the front surface of the dielectric substrate IB and the back surface connection conductor of the dielectric substrate IA are commonly grounded by solder. In this example as well, as in the first example, there is no discontinuity in grounding, so a continuous electric field distribution is obtained, and as a result, it is possible to obtain good transmission characteristics.

<Effects of the Invention> As described above, the microstrip line connection structure according to the present invention has a ground pattern connected to the back conductor surface through a through hole or the like on the surface of the dielectric substrate, and the ground pattern is Since the structure is configured so that the connection is made to the back ground conductor surface of the dielectric substrate or a similarly formed ground pattern, the same grounding at high frequencies can be obtained between the two substrates, and when connecting the microstrip line, the substrate It is possible to realize a continuous electric field distribution between the two, and it is possible to achieve the effect that good transmission characteristics can be obtained.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a perspective view showing an embodiment of the present invention, showing a state in which two boards are connected, and FIG. 2 is a perspective view showing another embodiment of the invention. A) is a front sectional view, the same figure (B) is a plan view, the third
The figure shows the structure of a general microstrip line, where (A) is a perspective view, (B) is a diagram showing the electric field distribution in the cross section of the substrate, and Figure 4 is a perspective view showing the conventional technology. figure,
FIG. 5 is an enlarged view of FIG. 4, and is a front sectional view. 18, IB...Dielectric substrate 2A, 2B...Back side connection conductor 38, 3B...Strip pattern 4...Connecting conductor 5...Solder 6...Setting screw 7^, 7B ...Grounding pattern 8A, 8B...Through hole 9...Casing 10...Connection bin 11...Strip pattern 2...Dielectric 13...Back ground conductor 14... Gap Patent Applicant Sharp Corporation Agent Patent Attorney Takaharu Ohnishi Diagram 2 Procedural Amendments June 2, 1986 Mr. Kunio Ogawa, Commissioner of the Patent Office, Nhe.
! . Indication of the case Patent Application No. 066284 filed in 1988 2, Title of the invention Microstrip line connection structure 3, Person making the amendment Relationship to the case Patent applicant address 22-22 Nagaike-cho, Abeno-ku, Osaka Name (504) ) Sharp Corporation Representative Haruo Tsuji 4, Agent Address 1 Dia Palace Tanimachi 2, 5-32 Tanimachi, Higashi-ku, Osaka ('EX06-765-5270) 6,
Target of amendment ■ Column 7 of Detailed Description of Invention 1 of the specification j, Contents of amendment
Correct to j with solder 5.

Claims (1)

[Claims] (1) A microstrip line with a strip pattern on the front surface of a dielectric substrate and a ground conductor surface on the back surface, and a microstrip line with a strip pattern on the front surface and a ground conductor surface on the back surface on a dielectric substrate different from the above dielectric substrate. In a structure for connecting a microstrip line formed with a microstrip line, at least one of the dielectric substrates is provided with a grounding pattern on its surface side, and a through hole or the like is formed that penetrates the grounding pattern and the grounding conductor surface, The micro micro device is characterized in that the ground pattern is connected to a ground conductor surface of another dielectric substrate or a similarly formed ground pattern using solder or a conductive member for connection through the through hole. Strip line connection structure.