JPH0245968Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a grounding structure for a housing of a device in which a high frequency circuit is formed.

(b) Background of the Technology For devices in which a high-frequency circuit is formed, not only the casing must have a shield structure, but also each component group installed within the casing must have a shield structure.

FIG. 1 is a partially cutaway perspective view of an example of a device having a high-frequency circuit.
Two printed boards 4 are mounted in parallel.
Between this printed board 4, a high frequency signal is turned on.
A large number of relays 3 that turn off are installed vertically and arranged in a grid pattern. each relay 3
are shielded by being housed in a case, and the upper and lower ends of these terminals respectively pass through holes in the printed board 4 and protrude to the outside.

A cover plate 2 is fixed to the upper and lower surfaces of the casing 1 at a desired distance from the printed board 4, and is configured to shield the parts installed inside the casing 1.
In addition, the terminals of the relays 3 in each row are connected to the terminal board 5.
and each terminal board 5 is connected to the cover plate 2.
It is connected to a lead-out terminal 5a passing through the hole and led out of the cover plate 2. A cable 6 is connected to each lead-out terminal 5a.

The space between the printed board 4 and the cover plate 2 is a shield parallel to the terminal board 5, which is in the shape of an elongated plate, one side edge end surface is in contact with the printed board 4, and the other side edge end surface is in contact with the inner surface of the cover plate 2. Each row of relays 3 is partitioned by a plate 7. The protrusions 3a of the case of each relay 3 fit into the holes of the printed board 4, and the relay 3
At the same time, it is soldered and fixed to the shield plate 7 and connected to earth. The ends of each shield plate 7 are fixed, for example, by soldering, to a pair of support plates 8 made of elongated metal plates that are perpendicular to the shield plate 7 and are mounted between the cover plate 2 and the printed board 4. ing.

These shield plate 7 and support plate 8 must be reliably grounded to the casing 1 via the lid plate 2.

(c) Prior Art and Problems FIG. 2 is a perspective view showing key points of the conventional grounding structure of the casing. Note that the same reference numerals indicate the same objects throughout the figures.

In FIG. 2, at the end of the support plate 8, there is a rectangular support plate protrusion 1 that protrudes toward the cover plate 2 side (in the figure, upward).
0 is formed. Further, a rectangular shield plate protrusion 9 is formed approximately at the center of the shield plate 7 so as to protrude toward the lid plate 2 side. Since the shield plate 7 and the support plate 8 are perpendicular to each other, the angles of the shield plate protrusion 9 and the support plate protrusion 10 in the plan view are at right angles.

The lid plate 2 has shield plate protrusion holes 11 that are rectangular in plan view and correspond to the respective shield plate protrusions 9.
Corresponding to each support plate protrusion 10, a support plate protrusion hole 12, which is rectangular in plan view, is bored. And a hole 11 for the shield plate protrusion and a hole 12 for the support plate protrusion.
A preliminary solder layer 13 is formed on the upper surface of the periphery.

The cover plate 2 configured in this way has a shield plate protrusion 9 in each shield plate protrusion hole 11, and
The support plate protrusion 10 is fitted into the support plate protrusion hole 12 and attached to the housing 1. Thereafter, the tips of the respective protrusions projecting to the outside of the cover plate 2 are fixed to the cover plate 2 with solder.

However, the relative positions of the parallel shield plate protrusions 9 and support plate protrusions 10 are not very accurate from the viewpoint of assembly technology. Therefore, the shield plate protrusion holes 11 and the support plate protrusion holes 12 are made sufficiently larger than the shapes of the respective protrusions so that the cover plate 2 can be easily attached. If the shield plate protrusion holes 11 and the support plate protrusion holes 12 are large as described above, soldering will be incomplete and grounding will be insufficient.

(d) Purpose of the invention The present invention was created in view of the above points, and its purpose is to provide a grounding structure for the casing that has high grounding reliability and allows for easy attachment of the cover plate. .

(e) Structure of the invention In order to achieve the above object, the present invention has a printed board housed in a housing so as to be parallel to the cover plate 2 at a desired interval, as illustrated in FIG. A plurality of shield plates 7 are arranged in a space formed by the cover plate 2 and the printed board, with one side edge end surface in contact with the plane of the printed board and the other side edge end surface in contact with the inner surface of the cover plate 2. , an electronic device having a plurality of support plates 8 arranged perpendicularly to the shield plate 7, one side edge end surface being in contact with the flat surface of the printed board, the other side edge end surface being in contact with the inner surface of the cover plate 2; , the support plate 8
Twist each end 90 degrees so that both ends are parallel to the shield plate 7.

Then, the cover plate 2 of the support plate 8 and the shield plate 7
Support plate protrusions 10A and shield plate protrusions 9A, which are rectangular in plan view and are oriented in the same direction and are parallel to each other, are provided on the side edge surfaces of the respective abutting sides.

On the other hand, support plate protrusion holes 12A and shield plate protrusion holes 11A into which the respective support plate protrusions 10A and shield plate protrusions 9A are closely fitted and connected by soldering,
The enlarged holes 15 arranged in the cover plate 2 and communicating in the directional direction are connected to the support plate protrusion holes 12A, and the enlarged holes 14 communicated in the directional direction are connected to the shield plate protrusion holes 11.
The configuration is the same as in A.

(f) Embodiments of the invention The invention will be described in detail below with reference to illustrated embodiments.

FIG. 3 is a perspective view of an embodiment of the present invention before the cover plate is installed, and FIG. 3 is a perspective view after installation.

In the figure, a support plate protrusion 10A, which is rectangular in plan view and protrudes from the end of the support plate 8, is twisted 90 degrees and is oriented in the same direction as the shield plate protrusion 9A of the shield plate 7.

In the cover plate 2, holes 11A for shield plate protrusions and holes 12A for support plate protrusions, which are rectangular in plan view, are drilled in parallel in parallel, into which the respective shield plate protrusions 9A and support plate protrusions 10A are closely fitted and connected by soldering. has been done. Further, each of the shield plate protrusion holes 11A is provided with an enlarged hole 14 that communicates with one short side of the square hole and is parallel to the long side. Further, each support plate protrusion hole 12A is provided with an enlarged hole 15 that communicates with one short side of the square hole and is parallel to the long side. Each enlarged hole 14, 15 is sufficiently larger than the corresponding shield plate protrusion 9A and support plate protrusion 10A. Also, each enlarged hole 14, 1
5 is formed in the same direction as the shield plate protrusion hole 11A and the support plate protrusion hole 12A.

The lid plate 2 configured as described above is placed on the housing 1 so that each of the shield plate protrusions 9A and the support plate protrusions 10A passes through the corresponding enlarged holes 14 and 15. Thereafter, the cover plate 2 is laterally shifted, and the shield plate protrusion 9A is fitted into the shield plate protrusion hole 11A, and the support plate protrusion 10A is inserted into the support plate protrusion hole 12A and soldered.

In this case, even if the accuracy of the arrangement position of the shield plate protrusion 9A and the support plate protrusion A is slightly poor, by pushing the tips to the left and right with your fingers, they can be easily inserted into the corresponding shield plate protrusion hole 11A and support plate protrusion hole 12A. It can be inserted into.

Since there is almost no gap between each shield plate protrusion hole 11A and each shield plate protrusion 9A, and between each support plate protrusion hole 12A and support plate protrusion 10A, soldering can be performed easily and reliably.

(g) Effects of the device As explained above, the device connects the mounted components to the cover plate through the shield plate and the support plate.
This is a grounding structure for the casing that not only can be reliably attached to the casing, but also has excellent practical effects such as easy attachment of the cover plate.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway perspective view of an example of a device having a high frequency circuit, Fig. 2 is a perspective view showing key points of a conventional case grounding structure, and Fig. 3 is a perspective view of an example of an embodiment of the present invention. 1 is a perspective view before the cover plate is installed, and (b) is a perspective view after it is installed. In the figure, 1 is the housing, 2 is the cover plate, 3 is the relay, 4 is the printed board, 7 is the shield plate, 8 is the support plate, 9, 9
A is a shield plate protrusion, 10, 10A is a support plate protrusion, 11, 11A is a hole for a shield plate protrusion, 12,
12A indicates a hole for a support plate protrusion, and 14 and 15 indicate enlarged holes, respectively.

Claims (1)

[Claims for Utility Model Registration] A printed board is housed in a housing so as to be parallel to the cover plate 2 at a desired interval, and one side edge is placed in the space formed by the cover plate 2 and the printed board. A plurality of shield plates 7 are arranged such that one end surface is in contact with the flat surface of the printed board and the other side edge end surface is in contact with the inner surface of the cover plate 2, and one side edge end surface is in contact with the flat surface of the printed board. In an electronic device, the electronic device has a plurality of support plates 8 arranged perpendicularly to the shield plate 7, the other side edge end surface of which is in contact with the inner surface of the cover plate 2, and wherein both ends of the support plates 8 are arranged perpendicularly to the shield plate 7. By twisting the support plate 8 and the cover plate 2 of the shield plate 7 by 90 degrees,
Protrusions 10A having a rectangular shape in plan view are arranged in parallel and oriented in the same direction on the respective side edge end surfaces on the side that abuts the .
9A, and protrusion holes 12A and 11A into which the respective protrusions 10A and 9A are closely fitted and soldered are arranged in the cover plate 2, and the respective protrusion holes 1
2A and 11A are provided with enlarged holes 15 and 14 so as to communicate with each other in the orientation direction.