JPH0218923A - Test board - Google Patents

Test board

Info

Publication number
JPH0218923A
JPH0218923A JP63169604A JP16960488A JPH0218923A JP H0218923 A JPH0218923 A JP H0218923A JP 63169604 A JP63169604 A JP 63169604A JP 16960488 A JP16960488 A JP 16960488A JP H0218923 A JPH0218923 A JP H0218923A
Authority
JP
Japan
Prior art keywords
test board
component
channel
hole
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63169604A
Other languages
Japanese (ja)
Inventor
Sumio Doi
土井　純夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP63169604A priority Critical patent/JPH0218923A/en
Publication of JPH0218923A publication Critical patent/JPH0218923A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the damage of components due to their contact with the outside by providing a channel for housing mounting components. CONSTITUTION:A channel 4 is provided on a test board body 1, the inside face of the channel 4 is made a conductive face and a component 3 such as a chip capacitor are sandwiched between the conductive face 5 and a through hole 2 to attach by soldering. Therefore the conductive face 5 of the side face of the channel 4 is connected with the through hole 2 to use as part of wiring and the component 3 can be mounted without being projected on the surface of the test board body 1. Thereby the damage of the component by coming in contact with the outside is eliminated and reliability is high to be functional.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、テストボードに関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a test board.

〔従来の技術〕[Conventional technology]

第３図（、）（ｂ）は従来のテストボードに部品を実装
したときの上面図及び側面図であり、図において、（１
１ハチストボ一ド本体、＋２１ｕテストボ一ド本体（１
）に設けられたスルーホール、（３）はスルーホール（
２）間に取り付けた部品である。FIG. 3(,)(b) is a top view and a side view when components are mounted on a conventional test board.
1 Hatcherist board main body, +21u test board main body (1
), (3) is a through hole (
2) It is a part installed in between.

次に動作について説明する。テストボード本体＋１１に
部品（３）を取り付けるときには、スルーホール（２）
に部品（３）の端子を挿入した後はんだ付けを施して行
っている。し九がって、実装された部品（３）はテスト
ボード本体１１＋上に突出し念状態になる。Next, the operation will be explained. When installing the component (3) on the test board body +11, use the through hole (2)
After inserting the terminal of component (3), soldering is performed. Then, the mounted component (3) protrudes onto the test board main body 11+ and becomes a state of mind.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のテストボードは以上のように構成されているので
、部品がテストボード本体上に突出しており、外部との
接触等による部品の損傷を引き起こすなどの問題点があ
った。Since the conventional test board is constructed as described above, the parts protrude above the test board body, which causes problems such as damage to the parts due to contact with the outside.

この発明は上記のような問題点を解消するためになされ
たもので、部品をテストボード本体表面より突出して実
装しなくてもよいテストボードを得ることを目的とする
。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a test board in which components do not need to be mounted so as to protrude from the surface of the test board body.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るテストボード本体は、部品実装用の溝を
設けるとともに、溝の側面を導体にして配線の一部とし
て使用するようにもしたものであるＯ 〔作用〕 この発明におけるテストボード本体は、側面が導体とな
っているｓ’を有し、部品をテストボード本体表面より
突出することなく実装できる。The test board main body according to the present invention is provided with a groove for mounting components, and also uses the side surfaces of the groove as a conductor to be used as a part of wiring. , has s' whose side surface is a conductor, allowing components to be mounted without protruding from the surface of the test board body.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第１
図はテストボードに部品を実装したときの上面図であり
、図において、ｔｌｌ［テストボード本体、（２）はス
ルーホール、（３）はスルーホール（２）にはんだ付け
で取り付けられた部品、（４）は部品（３）を取り付け
る念めにテストボード本体＋１１に設けられた溝である
。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a top view when components are mounted on the test board. (4) is a groove provided in the test board main body +11 in order to attach the component (3).

第２図は、＠１図に示すＡ部分を切り取つ之ときの拡大
斜視図である。図において、（５）は溝の内側面に設け
られた導電面である。FIG. 2 is an enlarged perspective view when section A shown in FIG. 1 is cut out. In the figure, (5) is a conductive surface provided on the inner surface of the groove.

次に動作について説明する。Next, the operation will be explained.

上記のように、テストボード本体ｔｌ＋に溝を設け、溝
（４）の内側面を導電面（６１にすることにより、導電
面（６）とスルーホール（２）との間にチップコンデン
サのような部品＋３１　′ｆｔはんだ付けにて取り付け
ることができる。そして、溝（４）側面の導電面（５）
ニスルーホール（２）との間で接続することにより配線
の一部として利用できる。このようにして、テストボー
ド本体（１１表面に突出しないで部品（３）を実装でき
る。As mentioned above, by providing a groove in the test board main body tl+ and making the inner surface of the groove (4) a conductive surface (61), a chip capacitor can be formed between the conductive surface (6) and the through hole (2). The parts can be attached by soldering +31'ft.Then, the conductive surface (5) on the side of the groove (4)
It can be used as part of the wiring by connecting it to the varnished through hole (2). In this way, the component (3) can be mounted without protruding onto the surface of the test board body (11).

なお、上記実施例ではｌｌＩ！（４）を設けたが、テス
トボード本体（り裏面まで突ぎ抜ける空洞であってもよ
い。In addition, in the above example, llI! Although (4) is provided, it may be a cavity that penetrates to the back surface of the test board body.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、テストボード本体の表
面より突出することなく部品を取り付けられる構成にし
たので、外部との接触による部品の損傷がなくなり、信
頼性が高く、かつ機能的なものが得られる効果がある。As described above, according to the present invention, components can be attached without protruding from the surface of the test board main body, so there is no damage to the components due to contact with the outside, and it is highly reliable and functional. There is an effect that can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

＠１図はこの発明の一実施例によるテストボードを示す
上面図、＠２図に第１図に示すＡ部を切り改ったときの
拡大斜視図、第３図（、）　（ｂ）に従来のテストボー
ドを示す上面図及び側面図である。 図ニオいて、１ｌｌｌｄテストボ一ド本体、１２＋１ｄ
スルーホール、（３）は部品、（４）は溝、（５）は導
電面である。 なお、図中、同一符号は同一、又は相当部分を示す。Figure @1 is a top view showing a test board according to an embodiment of the present invention, Figure @2 is an enlarged perspective view of section A shown in Figure 1, and Figure 3 (,) (b) is FIG. 1 is a top view and a side view of a conventional test board. As shown in the figure, 1lllld test board body, 12+1d
A through hole, (3) a component, (4) a groove, and (5) a conductive surface. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] 実装部品を収納するために溝を設けたテストボード。A test board with grooves for storing mounted components.
JP63169604A 1988-07-07 1988-07-07 Test board Pending JPH0218923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63169604A JPH0218923A (en) 1988-07-07 1988-07-07 Test board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63169604A JPH0218923A (en) 1988-07-07 1988-07-07 Test board

Publications (1)

Publication Number Publication Date
JPH0218923A true JPH0218923A (en) 1990-01-23

Family

ID=15889576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63169604A Pending JPH0218923A (en) 1988-07-07 1988-07-07 Test board

Country Status (1)

Country Link
JP (1) JPH0218923A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7281853B2 (en) 2003-12-01 2007-10-16 United Technologies Corporation Bearing material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7281853B2 (en) 2003-12-01 2007-10-16 United Technologies Corporation Bearing material

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