JPH02184061A - Temperature detecting structure of integrated circuit package - Google Patents
Temperature detecting structure of integrated circuit packageInfo
- Publication number
- JPH02184061A JPH02184061A JP512889A JP512889A JPH02184061A JP H02184061 A JPH02184061 A JP H02184061A JP 512889 A JP512889 A JP 512889A JP 512889 A JP512889 A JP 512889A JP H02184061 A JPH02184061 A JP H02184061A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- temperature
- circuit element
- temperature sensor
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003507 refrigerant Substances 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 9
- AOSZTAHDEDLTLQ-AZKQZHLXSA-N (1S,2S,4R,8S,9S,11S,12R,13S,19S)-6-[(3-chlorophenyl)methyl]-12,19-difluoro-11-hydroxy-8-(2-hydroxyacetyl)-9,13-dimethyl-6-azapentacyclo[10.8.0.02,9.04,8.013,18]icosa-14,17-dien-16-one Chemical compound C([C@@H]1C[C@H]2[C@H]3[C@]([C@]4(C=CC(=O)C=C4[C@@H](F)C3)C)(F)[C@@H](O)C[C@@]2([C@@]1(C1)C(=O)CO)C)N1CC1=CC=CC(Cl)=C1 AOSZTAHDEDLTLQ-AZKQZHLXSA-N 0.000 abstract description 5
- 229940126657 Compound 17 Drugs 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000002474 experimental method Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、大型の情報処理装置等の電子機器を構成する
集積回路パッケージの温度検出構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a temperature detection structure for an integrated circuit package constituting an electronic device such as a large information processing device.
情報処理装置等の電子装置では多数の集積回路素子を搭
載した基板を複数枚、架に実装し、架に取り付けたファ
ンにより強制空冷を行い、その排気温度を観測し、排気
温度が規定値以上になると、集積回路素子の破壊を防ぐ
為に、装置への給電を停止する等の処置を行うのが一般
的である。In electronic devices such as information processing equipment, multiple boards with many integrated circuit elements are mounted on a rack, forced air cooling is performed using a fan attached to the rack, and the exhaust temperature is monitored to ensure that the exhaust temperature is above a specified value. When this happens, it is common to take measures such as stopping the power supply to the device in order to prevent damage to the integrated circuit element.
近年、素子の大規模集積化、実装の高密度化に伴い、架
内の発熱密度が極度に高くなっており、これらを使用し
た装置では液体冷却方式を採用した集積回路パッケージ
を使用している。この方式ではＡ積回路パッケージ毎に
温度センサを用意し、集積回路パッケージの温度を検出
し、温度が規定以上になると、給電を停止する等の保護
処置を行っている。In recent years, with the large-scale integration of devices and the increasing density of packaging, the density of heat generation inside racks has become extremely high, and devices that use these devices use integrated circuit packages that use a liquid cooling method. . In this method, a temperature sensor is provided for each A-product circuit package to detect the temperature of the integrated circuit package, and when the temperature exceeds a specified value, protective measures such as stopping power supply are taken.
従来の集積回路パッケージの温度検出構造を第４図を参
照して説明する。A conventional temperature detection structure for an integrated circuit package will be explained with reference to FIG.
すなわち配線基板３０１上の集積回路パッケージ３０２
に細い通し溝３０３を用意する。この溝３０３に、温度
センサ３０４をセンサ出力を伝える為のフレキシブルプ
リント板３０５に接続し、又センサ出力を外部へ伝える
為の接続用コネクタ３０６をフレキシブルプリント板３
０５の補強板３０６に接続したサブアッセンブリ（第５
図にサブアッセンブリのみの斜視図を示す）を挿入固定
する。That is, the integrated circuit package 302 on the wiring board 301
A thin through groove 303 is prepared. A temperature sensor 304 is connected to the flexible printed board 305 for transmitting the sensor output to this groove 303, and a connector 306 for transmitting the sensor output to the outside is connected to the flexible printed board 305.
The subassembly (5th
(The figure shows a perspective view of only the subassembly) and fix it.
この集積回路パッケージ３０２に、冷媒の供給口３０８
．排出口３０９を持つ冷却器３１０を固定用ネジ３１１
を用いて密着させ、供給口３０８゜排出口３０９の間に
冷媒を循環させることにより集積回路パッケージ３０２
を冷却し、接続用コネクタ３０６にセンサ信号取り出し
用のケーブル・コネクタ３１２を接続し、信号を取り出
すことにより集積回路パッケージ３０２の温度を検出監
視し必要な保護処置を行っていた。A refrigerant supply port 308 is provided in the integrated circuit package 302.
．． Screws 311 for fixing the cooler 310 with the discharge port 309
The integrated circuit package 302 is brought into close contact with the integrated circuit package 302 using
A cable connector 312 for taking out a sensor signal is connected to the connecting connector 306, and the temperature of the integrated circuit package 302 is detected and monitored by taking out the signal and necessary protective measures are taken.
上述した従来の集積回路パッケージ温度検出構造ではフ
レキシブルプリント板３０５の一部、補強板３０７、接
続用コネクタ３０６、すなわちセンサ出力の信号経路の
一部が４Ａ積回路パッケージ３０２より部分的に飛び出
ることになる。このような飛び出し部分があると、集積
回路パッケージ３０２の着脱持ち運び時等に、この飛び
出し部分が何かにぶつかり、上記信号経路の構成部品に
損傷を生じるという問題点があった。In the conventional integrated circuit package temperature detection structure described above, a part of the flexible printed board 305, the reinforcing plate 307, the connection connector 306, that is, a part of the sensor output signal path partially protrudes from the 4A integrated circuit package 302. Become. If there is such a protruding portion, there is a problem in that when the integrated circuit package 302 is being attached/detached and carried, the protruding portion may hit something, causing damage to the components of the signal path.
又、信号取り出し用のケーブル・コネクタ３１２を接続
用コネクタ３０６に接続したまま集積回路パッケージ３
０２の取りはすしを行い、上記信号経路の構成部品及び
ケーブル・コネクタ３１２に損傷を与えることもあると
いう問題点もあった。Moreover, the integrated circuit package 3 is connected to the cable connector 312 for signal extraction to the connection connector 306.
There is also a problem in that removing the cable connector 312 may cause damage to the components of the signal path and the cable connector 312.
さらに冷却器３１０を集積回路パッケージに密着させる
時、ケーブル・コネクタ３１２のケーブルを間にはさん
だまま密着させ前記ケーブルを切ることもあるという欠
点もあった。Furthermore, when the cooler 310 is closely attached to the integrated circuit package, there is a problem in that the cable of the cable connector 312 is stuck between them and the cable may be cut.
また、従来の温度検出構造においては温度センサを１個
しか使用しておらず、センサ故障時は温度検出が不可能
となり、交換等の処置を直ちに行う必要があった。Further, in the conventional temperature detection structure, only one temperature sensor is used, and when the sensor fails, temperature detection becomes impossible and measures such as replacement must be taken immediately.
本発明の集積回路パッケージの温度検出構造は、チップ
キャリアに収められた複数個の集積回路素子を搭載した
配線基板と、前記集積回路素子と微小間隙を保って対向
し冷媒と熱交換を行う冷却器と、前記集積回路素子のチ
ップキャリアと同一の部品高さを持ち前記配線基板に搭
載されたケースに温度センサを内蔵した温度検出器と、
前記冷却器と前記集積回路素子および前記温度検出器と
の微小間隙に設けた熱伝導媒体とを含んで構成される。The temperature detection structure of the integrated circuit package of the present invention includes a wiring board mounted with a plurality of integrated circuit elements housed in a chip carrier, and a cooling device that faces the integrated circuit elements with a small gap and exchanges heat with a refrigerant. a temperature sensor having a built-in temperature sensor in a case mounted on the wiring board and having the same component height as the chip carrier of the integrated circuit element;
The device includes the cooler, and a thermally conductive medium provided in a minute gap between the integrated circuit element and the temperature sensor.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す縦断面図である。■は
チップキャリアに搭載された集積回路素子、２は温度検
出器で第２図に示すように２個の温度センサ３ａ、３ｂ
のリード４をケース５のバッド６にはんだ付けし温度セ
ンサ３ａ、３ｂとケース５との間にクツション材７をは
さんでキャップ８をケース５に取り付ける。このとき温
度センサ３ａ、３ｂはキャップ８に熱伝導性接着剤で接
着される。９は複数個の集積回路素子１と温度検出器２
の１個を搭載する配線基板であり、集積回路素子１が搭
載された面と反対の面には多数の入出力ビン１０が設け
られ外部との信号接続、電源供給を行い、また配線基板
９の外周を囲むように基板枠１１を固着する。FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention. 2 is an integrated circuit element mounted on a chip carrier, 2 is a temperature detector, and two temperature sensors 3a and 3b are shown in FIG.
The lead 4 is soldered to the pad 6 of the case 5, the cushion material 7 is sandwiched between the temperature sensors 3a, 3b and the case 5, and the cap 8 is attached to the case 5. At this time, the temperature sensors 3a and 3b are bonded to the cap 8 with a thermally conductive adhesive. 9 is a plurality of integrated circuit elements 1 and a temperature detector 2;
This is a wiring board on which one of the following is mounted, and a large number of input/output bins 10 are provided on the surface opposite to the surface on which the integrated circuit element 1 is mounted, and signal connections with the outside and power supply are made. A board frame 11 is fixed so as to surround the outer periphery of the board.
１２は冷却器で液体冷媒の入口１３．出口１４および内
部の冷媒流路１５を有する。冷却器１２は集積回路素子
１の上面に対向し微小な間隙を保つよう基板枠１１にネ
ジ１６にて固定される。冷却器１２と集積回路素子１と
の微小間隙にはペースト状の熱伝導性コンパウンド１７
を充填する。12 is a cooler with a liquid refrigerant inlet 13. It has an outlet 14 and an internal refrigerant flow path 15. The cooler 12 faces the top surface of the integrated circuit element 1 and is fixed to the substrate frame 11 with screws 16 so as to maintain a small gap. A paste-like thermally conductive compound 17 is placed in the minute gap between the cooler 12 and the integrated circuit element 1.
Fill it.
なお、本実施例では液冷方式を採用した場合を述べるが
、空冷とする場合は冷却器１２を例えばフィンを設けた
ヒートシンクとすればよい。In this embodiment, a case will be described in which a liquid cooling system is adopted, but if air cooling is used, the cooler 12 may be, for example, a heat sink provided with fins.
集積回路１で発生した熱は熱伝導性コンパウンド１７を
介して冷却器１２へと伝わり冷媒流路１５内を流れる液
体冷媒へと排熱される。このとき冷却器１２の集積回路
素子１との対向面の温度は集積回路素子１内のＰ−Ｎ接
合の温度に対し、ある一定の温度差を持つ。したがって
計算または実験によりこの温度差を求めれば冷却器１２
の集積回路素子１との対向面の温度を測定することによ
り集積回路素子１のＰ−Ｎ接合の温度を算出することが
できる。The heat generated in the integrated circuit 1 is transmitted to the cooler 12 via the thermally conductive compound 17 and is dissipated into the liquid refrigerant flowing in the refrigerant flow path 15 . At this time, the temperature of the surface of the cooler 12 facing the integrated circuit element 1 has a certain temperature difference with respect to the temperature of the PN junction within the integrated circuit element 1. Therefore, if this temperature difference is determined by calculation or experiment, the cooler 12
By measuring the temperature of the surface facing the integrated circuit element 1, the temperature of the PN junction of the integrated circuit element 1 can be calculated.
温度検出器２のケース５は集積回路素子１と同じ部品高
さをもつよう設計されており、ケース５の上面と冷却器
１２との微小間隙には熱伝導性コンパウンド１７を充填
しである。また温度センサ３ａ、３ｂは冷却器２のキャ
ップ８に熱伝導性接着剤で接着されているため、集積回
路パッケージが熱的に平衡状態にあれば温度センサ３ａ
、３ｂにより冷却器１２の集積回路素子１との対向面の
温度を測定できる。The case 5 of the temperature sensor 2 is designed to have the same component height as the integrated circuit element 1, and the minute gap between the upper surface of the case 5 and the cooler 12 is filled with a thermally conductive compound 17. Furthermore, since the temperature sensors 3a and 3b are bonded to the cap 8 of the cooler 2 with a thermally conductive adhesive, if the integrated circuit package is in a thermally balanced state, the temperature sensors 3a and 3b
, 3b, the temperature of the surface of the cooler 12 facing the integrated circuit element 1 can be measured.
温度センサ３ａ、３ｂによる温度の測定は、第３図に示
すように温度センサ３ａ、３ｂの出力をケース５を経由
して配線基板９に接続し、入出力ビン１０からコネクタ
１８を介して外部回路１９に入力するようにし、集積回
路素子１のＰ−Ｎ接合が許容最高温度に達したときの冷
却器１２の集積回路素子１との対向面の温度を温度セン
サ３ａ。To measure the temperature using the temperature sensors 3a and 3b, as shown in FIG. The temperature sensor 3a inputs the temperature of the surface of the cooler 12 facing the integrated circuit element 1 when the P-N junction of the integrated circuit element 1 reaches the maximum allowable temperature to the circuit 19.
３ｂが検知したときに集積回路素子１への電源供給を停
止するよう外部回路１つを構成することにより集積回路
素子１の保護機構を構成することができる。A protection mechanism for the integrated circuit element 1 can be constructed by configuring one external circuit to stop power supply to the integrated circuit element 1 when the detection signal 3b is detected.
外部回路１９は温度検出部２０．制御部２１を有し、通
常温度センサ３ａにより温度検出を行うが、温度センサ
３ａが異常、例えば集積回路パッケージの通常の使用状
態ではあり得ない温度を検出した場合は制御部２１によ
り切り換え回路２２を操作して温度センサ３ｂに切り換
えて温度を検出するよう構成されている。これにより１
個のセンサが故障した場合でも温度検出機能が保たれる
ので温度検出系の信頼度を上げることができる。The external circuit 19 includes a temperature detection section 20. The temperature sensor 3a normally detects the temperature, but if the temperature sensor 3a detects an abnormality, for example, a temperature that cannot occur under normal usage conditions of the integrated circuit package, the control unit 21 switches the switching circuit 22 to the temperature sensor 3a. It is configured to detect the temperature by operating the temperature sensor 3b and switching to the temperature sensor 3b. This results in 1
Since the temperature detection function is maintained even if one sensor fails, the reliability of the temperature detection system can be increased.
したがって集積回路素子が正常であるにもかかわらず温
度センサが故障したために集積回路パッケージの交換を
要する場合は極めて少ない。Therefore, there are very few cases where the integrated circuit package needs to be replaced due to a failure of the temperature sensor even though the integrated circuit element is normal.
温度検出器２からの信号は他の集積回路素子１の信号と
同様に配線基板９に設けられた入出力ビンにより外部へ
接続されるので温度検出のために専用のコネクタ等を設
ける必要がない、したがって集積回路パッケージの着脱
は温度検出信号の接続を全く意識せずに行うことができ
、また集積回路パッケージからの突出部も存在せず運搬
時等に損傷を与えることがない。Since the signal from the temperature detector 2 is connected to the outside through the input/output bin provided on the wiring board 9 in the same way as the signals from other integrated circuit elements 1, there is no need to provide a dedicated connector etc. for temperature detection. Therefore, the integrated circuit package can be attached and detached without being aware of the connection of the temperature detection signal, and there is no protruding part from the integrated circuit package, so there is no damage during transportation.
以上説明したように本発明は、温度センサを他の集積回
路素子と同一の部品高さを持つケースに内蔵した温度検
出器を他の集積回路素子と同様に配線基板上に搭載し、
温度センサからの信号を他の集積回路素子と同じくケー
スから配線基板に接続して配線基板に設けた入出力ビン
により外部に接続する方式とし、その温度センサで集積
回路素子を冷却するために集積回路素子の上面に対向し
て取り付けられる冷却器の表面温度を検出する構成とし
たことにより、集積回路パッケージの着脱時に温度検出
構造専用のコネクタを操作する必要がなく、部品の突起
がないため取扱いミスによる温度センサ信号系の損傷を
防ぐことができるという効果がある。As explained above, the present invention includes a temperature sensor built in a case having the same component height as other integrated circuit elements, and a temperature sensor mounted on a wiring board like other integrated circuit elements.
The signal from the temperature sensor is connected from the case to the wiring board like other integrated circuit elements, and connected to the outside through input/output bins provided on the wiring board. By adopting a configuration that detects the surface temperature of the cooler mounted opposite to the top surface of the circuit element, there is no need to operate the connector dedicated to the temperature detection structure when attaching or detaching the integrated circuit package, and there are no protrusions on the parts, making it easy to handle. This has the effect of preventing damage to the temperature sensor signal system due to mistakes.
第１図は本発明の一実施例を示す縦断面図、第２図は第
１図に示す温度検出器２の構造を示す斜視図、第３図は
第２図に示す温度センサ３ａ、３ｂの信号系統を示すブ
ロック図、第４図および第５図はそれぞれ従来の集積回
路パッケージの温度検出構造を示す分解斜視図およびフ
レキシブルプリント板３０５等のサブアッセンブリの斜
視図である。
１・・・集積回路素子、２・・・温度検出器、３・・・
温度センサ、４・・・リード、５・・・ケース、６・・
・パッド、７・・・クツション材、８・・・キャップ、
９・・・配線基板、１０・・・入出力ビン、１１・・・
枠、１２・・・冷却器、１３・・・冷媒入口、１４・・
・冷媒出口、１５・・・冷媒流路、１６・・・ネジ、１
７・・・熱伝導性コンパウンド、３０１・・・配線基板
、３０２・・・集積回路パッケージ、３０３・・・通し
溝、３０４・・・温度センサ、３０５・・・フレキシブ
ルプリント板、３０６・・・接続用コネクタ、３０７・
・・補強板、３０８・・・供給口、３０９・・・排出口
、３１０・・・冷却器、３１１・・・固定用ネジ、３１
２・・・ケーブルコネクタ。FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, FIG. 2 is a perspective view showing the structure of the temperature detector 2 shown in FIG. 1, and FIG. 3 is a temperature sensor 3a, 3b shown in FIG. FIGS. 4 and 5 are an exploded perspective view showing a temperature detection structure of a conventional integrated circuit package and a perspective view of a subassembly such as a flexible printed board 305, respectively. 1... integrated circuit element, 2... temperature detector, 3...
Temperature sensor, 4...Lead, 5...Case, 6...
・Pad, 7... Cushion material, 8... Cap,
9... Wiring board, 10... Input/output bin, 11...
Frame, 12...Cooler, 13...Refrigerant inlet, 14...
・Refrigerant outlet, 15... Refrigerant flow path, 16... Screw, 1
7... Thermal conductive compound, 301... Wiring board, 302... Integrated circuit package, 303... Through groove, 304... Temperature sensor, 305... Flexible printed board, 306... Connection connector, 307・
... Reinforcement plate, 308 ... Supply port, 309 ... Discharge port, 310 ... Cooler, 311 ... Fixing screw, 31
2...Cable connector.
Claims (1)
載した配線基板と、前記集積回路素子と微小間隙を保っ
て対向し冷媒と熱交換を行う冷却器と、前記集積回路素
子のチップキャリアと同一の部品高さを持ち前記配線基
板に搭載されたケースに温度センサを内蔵した温度検出
器と、前記冷却器と前記集積回路素子および前記温度検
出器との微小間隙に設けた熱伝導媒体とを含むことを特
徴とする集積回路パッケージの温度検出構造。a wiring board on which a plurality of integrated circuit elements housed in a chip carrier are mounted; a cooler that faces the integrated circuit elements with a minute gap and exchanges heat with a refrigerant; and a cooler that is identical to the chip carrier of the integrated circuit elements. a temperature sensor with a built-in temperature sensor in a case mounted on the wiring board, and a heat conduction medium provided in a minute gap between the cooler, the integrated circuit element, and the temperature sensor. A temperature sensing structure for an integrated circuit package, comprising:
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP512889A JPH0770674B2 (en) | 1989-01-11 | 1989-01-11 | Integrated circuit package temperature sensing structure |
| US07/397,233 US4975766A (en) | 1988-08-26 | 1989-08-23 | Structure for temperature detection in a package |
| CA000609414A CA1303239C (en) | 1988-08-26 | 1989-08-25 | Structure for temperature detection in a package |
| EP89115708A EP0359007B1 (en) | 1988-08-26 | 1989-08-25 | Structure for temperature detection in integrated circuit package |
| DE89115708T DE68907300T2 (en) | 1988-08-26 | 1989-08-25 | Device for temperature detection in an arrangement of integrated circuits. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP512889A JPH0770674B2 (en) | 1989-01-11 | 1989-01-11 | Integrated circuit package temperature sensing structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02184061A true JPH02184061A (en) | 1990-07-18 |
| JPH0770674B2 JPH0770674B2 (en) | 1995-07-31 |
Family
ID=11602679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP512889A Expired - Lifetime JPH0770674B2 (en) | 1988-08-26 | 1989-01-11 | Integrated circuit package temperature sensing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770674B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0570190U (en) * | 1992-02-20 | 1993-09-21 | ネミック・ラムダ株式会社 | Power supply cooling structure |
| US6945054B1 (en) | 2002-10-04 | 2005-09-20 | Richard S. Norman | Method and apparatus for cooling microelectronic complexes including multiple discrete functional modules |
| JP2010195219A (en) * | 2009-02-25 | 2010-09-09 | Nsk Ltd | Electric power steering device |
| JP2014107359A (en) * | 2012-11-26 | 2014-06-09 | Mitsubishi Electric Corp | Electric motor, pump including the same, heat pump device, and air conditioner |
-
1989
- 1989-01-11 JP JP512889A patent/JPH0770674B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0570190U (en) * | 1992-02-20 | 1993-09-21 | ネミック・ラムダ株式会社 | Power supply cooling structure |
| US6945054B1 (en) | 2002-10-04 | 2005-09-20 | Richard S. Norman | Method and apparatus for cooling microelectronic complexes including multiple discrete functional modules |
| JP2010195219A (en) * | 2009-02-25 | 2010-09-09 | Nsk Ltd | Electric power steering device |
| JP2014107359A (en) * | 2012-11-26 | 2014-06-09 | Mitsubishi Electric Corp | Electric motor, pump including the same, heat pump device, and air conditioner |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0770674B2 (en) | 1995-07-31 |
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