JPS62211997A - Monitor for abnormality in cooling of electronic equipment - Google Patents

Monitor for abnormality in cooling of electronic equipment

Info

Publication number
JPS62211997A
JPS62211997A JP61055496A JP5549686A JPS62211997A JP S62211997 A JPS62211997 A JP S62211997A JP 61055496 A JP61055496 A JP 61055496A JP 5549686 A JP5549686 A JP 5549686A JP S62211997 A JPS62211997 A JP S62211997A
Authority
JP
Japan
Prior art keywords
temperature
cooling
circuit
rack
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61055496A
Other languages
Japanese (ja)
Inventor
岡野 實
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61055496A priority Critical patent/JPS62211997A/en
Publication of JPS62211997A publication Critical patent/JPS62211997A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing And Monitoring For Control Systems (AREA)
  • Control Of Temperature (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は電子回路部品を収容する架と冷却用送風機と
を含んで構成される電子機器における冷却系の異常監視
装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an abnormality monitoring device for a cooling system in an electronic device including a rack for housing electronic circuit components and a cooling blower.

〔従来の技術〕[Conventional technology]

電子計算機等の電子機器においては、第3図に示すよう
に筐体1内に架2が収容され、架2に、IC、LSI等
電子回路部品3を搭載した電子回路パッケーゾ4が多数
枚収容され、架2の一方又は両方に架2内に冷却空気を
送る送風機5が実装され、電子回路部品から出る熱を筐
体1外に排出する実装冷却構造が一般的にとられている
In electronic devices such as computers, a rack 2 is housed in a housing 1 as shown in FIG. A cooling structure is generally adopted in which a blower 5 for sending cooling air into the rack 2 is mounted on one or both of the racks 2, and heat emitted from the electronic circuit components is discharged to the outside of the housing 1.

この様な電子機器においては架2内の半導体素子を中心
とした電子回路部品3の温度を、各部品が正常に機能で
きる上限温度以下となる様に、送風機5の選定等の冷却
設計がなされている。
In such electronic equipment, a cooling design such as selection of the blower 5 is made so that the temperature of the electronic circuit components 3, mainly the semiconductor elements in the rack 2, is below the upper limit temperature at which each component can function normally. ing.

この種の実装冷却構造において、例えば送風機5の故障
や、冷却空気通路の遮蔽など、冷却系に異常が発生した
場合、電子回路部品3の冷却が不十分となシ、部品の信
頼度の低下ひいては誤動作熱破壊と云った電子機器の動
作に重大な支障をきたすことになる。
In this type of mounted cooling structure, if an abnormality occurs in the cooling system, such as a failure of the blower 5 or a blockage of the cooling air passage, the electronic circuit components 3 will not be cooled enough, and the reliability of the components will decrease. As a result, this can cause serious problems in the operation of electronic equipment, such as thermal breakdown due to malfunction.

このため、従来の電子機器においては架2の冷却空気排
気口6の近くに、空気温度が規定の温度以上になると、
内蔵スイツチが作動するサーモスタット7を取付けて排
気温度を監視し、サーモスタット7の作動により、警報
を発したり、機器の電源を切断するなどのアラーム回路
8を設けて機器や部品を保護していた。
For this reason, in conventional electronic equipment, when the air temperature exceeds a specified temperature, a
A thermostat 7 that operates with a built-in switch is installed to monitor the exhaust temperature, and an alarm circuit 8 is installed to issue an alarm or turn off the power to the equipment when the thermostat 7 is activated to protect the equipment and parts.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、この従来の冷却異常の監視方法では、排
気温度を検出するサーモスタット7の作動温度が、電子
機器の許容動作温度範囲の上限温度を基準とし、これに
架2内の温度上昇分を考慮して設定されているため、通
常運転時には十分な冷却系異常監視が出来ない欠点を有
している。
However, in this conventional cooling abnormality monitoring method, the operating temperature of the thermostat 7 that detects the exhaust temperature is based on the upper limit temperature of the allowable operating temperature range of the electronic equipment, and the temperature rise inside the rack 2 is taken into account. This has the disadvantage that it is not possible to adequately monitor abnormalities in the cooling system during normal operation.

すなわち、一般に半導体素子等の信頼度は、温度依存性
があり、温度が高い程信頼性が悪くなるという周知の事
実から、通常の電子機器は高信頼度で安定に動作させる
為、機器の許容動作温度範囲の下限温度に近い温度環境
下で動作させることが多い。この為、冷却空気吸入口の
ゴミによる目詰まりや、床下から冷却空気を供給する床
下空調方式での空調機の故障などにより、架2内の送風
機5に対する負荷が重くなり、結果として架2の冷却風
量が減少した場合、架2内の空気温度」二昇は風量に逆
比例して増大するが、吸入空気温度が低い為サーモスタ
ット7め作動温度に至らない場合が多い。例えば架内の
空気温度上昇が10℃の電子機器で吸入温度を機器の許
容動作」二限温度より10℃下げて使用している場合に
は、架内の空気温度上昇が正常風量時より10℃高くな
る即ち風量が1/2にまでならないとサーモスタット7
は作動せず異常は検知されないことになる。
In other words, it is a well-known fact that the reliability of semiconductor devices, etc. is generally temperature dependent, and the higher the temperature, the worse the reliability. It is often operated in a temperature environment close to the lower limit of the operating temperature range. For this reason, the load on the blower 5 inside the rack 2 becomes heavy due to clogging of the cooling air inlet with dust or failure of the air conditioner in the underfloor air conditioning system that supplies cooling air from under the floor. When the cooling air volume decreases, the air temperature inside the rack 2 increases in inverse proportion to the air volume, but because the intake air temperature is low, it often does not reach the operating temperature of the thermostat 7. For example, if an electronic device with an air temperature rise of 10 degrees Celsius is used with the suction temperature 10 degrees lower than the device's allowable operating temperature, the air temperature rise inside the rack will be 10 degrees lower than the normal air flow rate. If the temperature rises, that is, the air volume does not decrease to 1/2, thermostat 7
will not operate and no abnormality will be detected.

このように、排気温度を監視する従来の方法では風量不
足をひきおこす冷却系の異常を早期に検出する事は困難
で、電子機器の信頼度に少ながらず影響を及ぼすと云っ
た欠点を有していた。
As described above, the conventional method of monitoring exhaust gas temperature has the drawback that it is difficult to early detect abnormalities in the cooling system that cause insufficient air volume, and it has a considerable impact on the reliability of electronic equipment. was.

〔問題点を解決するための手段〕[Means for solving problems]

この発明は、」二連した従来の欠点を排した電子機器冷
却系の異常監視装置を提供することにある。
The object of the present invention is to provide an abnormality monitoring device for an electronic equipment cooling system that eliminates the two conventional drawbacks.

この発明によれば、電子部品を収容する架と、冷却用送
風機とを含んで構成される電子機器において、その電子
機器の筐体冷却空気吸入口付近に設けた第1の温度検出
手段と、筐体排気口付近に設けた第2の温度検出手段と
、これら第1と第2の温度検出手段からの検出温度の差
分を検出する回路と、第2の温度検出手段からの塩度及
び前記検出温度差が規定値を越えた場合警報を出すアラ
ーム回路とで構成される。
According to the present invention, in an electronic device including a rack for housing electronic components and a cooling blower, the first temperature detection means provided near the cooling air intake port of the case of the electronic device; a second temperature detection means provided near the exhaust port of the housing; a circuit for detecting the difference between the detected temperatures from the first and second temperature detection means; and a circuit for detecting the difference in temperature detected by the first and second temperature detection means; It consists of an alarm circuit that issues an alarm if the detected temperature difference exceeds a specified value.

〔実施例〕〔Example〕

次に、この発明について図面を参照して説明する。第1
図は、この発明の一実施例を表わす全体の構成図を示す
。第3図に示した従来装置と同様に、多数のIC、LS
I等電子回路部品3を搭載した電子回路パッケージ4が
架2に複数枚実装され、架2に取付けられた冷却用送風
機5を含んで電子機器筺体1が構成されている。この発
明においては架2の冷却空気吸入口90近くに取付けた
第1の温度センサー11と、架2の上部の冷却空気の排
気口6の付近に取付けた第2の温度センサー12と、こ
れら2つの温度センサー11.12が接続される温度検
出回路21及びアラーム回路31とが設けられる。
Next, the present invention will be explained with reference to the drawings. 1st
The figure shows an overall configuration diagram representing one embodiment of the present invention. Similar to the conventional device shown in Figure 3, a large number of ICs, LS
A plurality of electronic circuit packages 4 carrying electronic circuit components 3 such as I are mounted on a rack 2, and an electronic device housing 1 is configured including a cooling blower 5 attached to the rack 2. In this invention, a first temperature sensor 11 is installed near the cooling air intake port 90 of the rack 2, a second temperature sensor 12 is installed near the cooling air exhaust port 6 at the top of the rack 2, and a second temperature sensor 12 is installed near the cooling air intake port 6 of the rack 2. A temperature detection circuit 21 and an alarm circuit 31 to which two temperature sensors 11, 12 are connected are provided.

ここで温度検出回路21は冷却空気の吸入温度1、と排
気温度t2とを検出し、更にこれらの温度差(tztt
)を検出する機能を有し、またアラーム回路31は温度
検出回路21の検出した温度及び温度差が予め設定した
温度、温度差より高い場合警報を発したり、電子機器の
電源を切断したりする機能を有している。
Here, the temperature detection circuit 21 detects the intake temperature 1 of the cooling air and the exhaust temperature t2, and also detects the temperature difference (tztt
), and if the temperature and temperature difference detected by the temperature detection circuit 21 are higher than a preset temperature or temperature difference, the alarm circuit 31 issues an alarm or turns off the power to the electronic device. It has a function.

第2図は、この温度検出回路21及びアラーム回路31
の具体例を示す。温度検出回路21は温度センサー11
.12で測定する吸気温度t1、排気温IIt2f:、
夫々これと比例した所定の電圧T1pT2に変換・増幅
する2つの温度検出部22゜23と、温度検出部22.
23の出力電圧T1+T2を入力として、この差電圧(
T2  Tt)を出力する温度差検出部24とから成る
。またアラーム回路31は、前記出力電圧T2と排気温
度の上限温度に対応した電圧V2とを比較する比較回路
33、同様に差電圧(T2  Tt)と規定の風量が流
れた場合の架2内の温度上昇に対応した電圧VOとを比
較する比較回路32、及びこれらの比較回路32゜33
の出力によシアラームを出す警報回路34とから成って
いる。
FIG. 2 shows this temperature detection circuit 21 and alarm circuit 31.
A specific example is shown below. The temperature detection circuit 21 is the temperature sensor 11
.. Intake air temperature t1, exhaust temperature IIt2f measured at 12:,
Two temperature detecting sections 22 and 23 convert and amplify predetermined voltages T1pT2 proportional to the respective temperature detecting sections 22.
23 output voltage T1+T2 as input, this difference voltage (
T2 Tt). The alarm circuit 31 also includes a comparison circuit 33 that compares the output voltage T2 and a voltage V2 corresponding to the upper limit temperature of the exhaust gas temperature, and a comparison circuit 33 that compares the output voltage T2 with a voltage V2 corresponding to the upper limit temperature of the exhaust gas. Comparison circuit 32 for comparing voltage VO corresponding to temperature rise, and these comparison circuits 32°33
It consists of an alarm circuit 34 which issues an alarm based on the output of the alarm.

冷却系の異常監視の構成をこのようにしたことにより、
架2内の温度及び温度上昇が常時監視できることになり
、送風機5の停止や、冷却空気の流れの極端な低下など
の電子機器の動作上致命的な冷却系異常を検出すること
のみならず、架2内の温度上昇を監視することから冷却
用送風機5の機能低下、筐体吸気口9の目詰まシ、床下
空調方式の場合の冷却空気不足などに起因する架内冷却
空気の風量不足と云った致命的な異常とは云えないが、
電子回路部品の信頼性を悪化させる要因となりうる冷却
系異常も検出できる様になった。
By configuring cooling system abnormality monitoring in this way,
The temperature and temperature rise inside the rack 2 can be constantly monitored, and it is possible to not only detect cooling system abnormalities that are fatal to the operation of electronic equipment, such as the stoppage of the blower 5 or an extreme decrease in the flow of cooling air. By monitoring the temperature rise inside the rack 2, we can detect insufficient cooling air volume in the rack due to a decline in the function of the cooling blower 5, clogging of the housing intake port 9, or a lack of cooling air in the case of underfloor air conditioning. Although it cannot be said that it is a fatal abnormality,
It is now possible to detect cooling system abnormalities that can be a factor in deteriorating the reliability of electronic circuit components.

この実施例では、温度の検出を吸入側6排気側の各1個
所で行なっているが、特に大型の機器などでは複数個所
で検出し、いずれか1つでも異常となれば警報を出す様
にする事が望ましい。
In this embodiment, the temperature is detected at one location each on the intake side and the exhaust side, but especially in large equipment, it may be detected at multiple locations, and if any one of them becomes abnormal, an alarm will be issued. It is desirable to do so.

丑た更に温度及び温度差の規定値との比較をルベルのみ
で行なっているが、各々の比較回路を複数用意して警告
レベルから致命的レベルの警報を出す様にしてもよく、
また警報回路34は、ランプ表示とか、上位のンステム
監視装置等への異常報告など電子機器全体の異常処理法
に合わせればよく、特に限定するものではない。
Furthermore, although the temperature and temperature difference are compared with the specified values only using the Lebel, it is also possible to prepare multiple comparison circuits for each of them and issue warnings ranging from warning level to fatal level.
Further, the alarm circuit 34 is not particularly limited as long as it matches the abnormality handling method of the entire electronic device, such as lamp display or abnormality reporting to a higher system monitoring device or the like.

〔発明の効果〕〔Effect of the invention〕

以上説明したようにこの発明は、架の冷却空気の吸入温
度と排気温度とを検出し、更にはこれの温度差を検出す
る回路を設けたことにより、風量不足を引きおこす冷却
系異常を的確に検出することができ、電子機器を高信頼
度で安定に稼動させることができる効果がある。
As explained above, this invention detects the intake temperature and exhaust temperature of the cooling air of the rack, and furthermore, by providing a circuit that detects the temperature difference between them, it is possible to accurately detect abnormalities in the cooling system that cause insufficient air volume. This has the effect of allowing electronic equipment to operate stably with high reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の冷却系異常監視装置を含む全体の構
成例を示す図、第2図は第1図中の温度検出回路及びア
ラーム回路部分の構成例を示すブロック図、第3図は従
来の装置の全体構成を示す図である。 ■・・・筐体、2・・・架、3・・・電子回路部品、4
・・・電子回路パッケージ、5・・・送風機、6・・・
排気口、7・・・サーモスタット、9・・・冷却空気吸
入口、11゜12・・・温度センサー、21・・・温度
検出回路、22゜23・・・温度検出部、24・・・温
度差検出部、31・・・アラーム回路、32.33・・
・比較回路、34・・・警報回路。 特許出願人  日本電気株式会社 代 理 人   草   野      卓オ 1 図
FIG. 1 is a diagram showing an example of the overall configuration including the cooling system abnormality monitoring device of the present invention, FIG. 2 is a block diagram showing an example of the configuration of the temperature detection circuit and alarm circuit portion in FIG. 1, and FIG. FIG. 1 is a diagram showing the overall configuration of a conventional device. ■... Housing, 2... Frame, 3... Electronic circuit components, 4
...Electronic circuit package, 5...Blower, 6...
Exhaust port, 7... Thermostat, 9... Cooling air intake port, 11° 12... Temperature sensor, 21... Temperature detection circuit, 22° 23... Temperature detection section, 24... Temperature Difference detection section, 31... Alarm circuit, 32.33...
- Comparison circuit, 34... Alarm circuit. Patent applicant: NEC Corporation Representative Takuo Kusano 1 Figure

Claims (1)

【特許請求の範囲】[Claims] (1)電子回路部品を収容する架と、冷却用送風機とを
含んで構成される電子機器において、その電子機器筐体
の冷却空気吸入口付近に設けた第1の温度検出手段と、 上記筐体の排気口付近に設けた第2の温度検出手段と、 これら第1と第2の温度検出手段からの検出温度差を検
出する回路と、 その検出した温度差及び前記第2の温度検出手段からの
温度がそれぞれ規定値を越えた場合警報を発するアラー
ム回路とを具備する事を特徴とした電子機器の冷却異常
監視装置。
(1) In an electronic device that includes a rack for housing electronic circuit components and a cooling blower, a first temperature detection means provided near the cooling air intake port of the electronic device housing; a second temperature detection means provided near the exhaust port of the body; a circuit for detecting the detected temperature difference from the first and second temperature detection means; and a circuit for detecting the detected temperature difference and the second temperature detection means. A cooling abnormality monitoring device for electronic equipment, characterized in that it is equipped with an alarm circuit that issues an alarm when the temperature of each exceeds a specified value.
JP61055496A 1986-03-12 1986-03-12 Monitor for abnormality in cooling of electronic equipment Pending JPS62211997A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61055496A JPS62211997A (en) 1986-03-12 1986-03-12 Monitor for abnormality in cooling of electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61055496A JPS62211997A (en) 1986-03-12 1986-03-12 Monitor for abnormality in cooling of electronic equipment

Publications (1)

Publication Number Publication Date
JPS62211997A true JPS62211997A (en) 1987-09-17

Family

ID=13000247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61055496A Pending JPS62211997A (en) 1986-03-12 1986-03-12 Monitor for abnormality in cooling of electronic equipment

Country Status (1)

Country Link
JP (1) JPS62211997A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0191920U (en) * 1987-12-10 1989-06-16
JPH09113085A (en) * 1995-10-20 1997-05-02 Nec Ibaraki Ltd Cooling fan with buzzer
JP2020071684A (en) * 2018-10-31 2020-05-07 オムロン株式会社 Temperature abnormality detection system, temperature abnormality detection method, and program
JP2021139712A (en) * 2020-03-04 2021-09-16 日鉄テックスエンジ株式会社 Temperature abnormality surveillance method and temperature abnormality surveillance device of electric board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0191920U (en) * 1987-12-10 1989-06-16
JPH09113085A (en) * 1995-10-20 1997-05-02 Nec Ibaraki Ltd Cooling fan with buzzer
JP2020071684A (en) * 2018-10-31 2020-05-07 オムロン株式会社 Temperature abnormality detection system, temperature abnormality detection method, and program
WO2020090261A1 (en) * 2018-10-31 2020-05-07 オムロン株式会社 Temperature abnormality detection system, temperature abnormality detection method, and program
US11867569B2 (en) 2018-10-31 2024-01-09 Omron Corporation Temperature abnormality detection system, temperature abnormality detection method, and computer-readable recording medium
JP2021139712A (en) * 2020-03-04 2021-09-16 日鉄テックスエンジ株式会社 Temperature abnormality surveillance method and temperature abnormality surveillance device of electric board

Similar Documents

Publication Publication Date Title
US6319114B1 (en) Thermal management system
US10824175B2 (en) Air flow measurement using pressure sensors
US20030158697A1 (en) Method and system for monitoring and profiling an integrated circuit die temperature
US4975766A (en) Structure for temperature detection in a package
US10122296B2 (en) Power converter, diagnostic system of power converter, and power converter diagnostic method using current change
JPH04271229A (en) Temperature abnormality detecting system
US20220071053A1 (en) Cooling Device for a Vehicle Electronic Control Unit and Controller for Operating the Same
JP6661054B1 (en) Power converter
JPS62211997A (en) Monitor for abnormality in cooling of electronic equipment
US5079542A (en) Abnormal temperature detector for electronic apparatus
EP0421743B1 (en) Coolant supply apparatus for liquid-cooled electronic device
JP2000134074A (en) Semiconductor module
US9125325B2 (en) Container module with cooling system
JP2780312B2 (en) Error detection circuit
JP2004150777A (en) Malfunction detecting method for peltier cooler
JPH02184061A (en) Temperature detecting structure of integrated circuit package
JPH0675643A (en) Temperature protecting method
JP2021197844A (en) Uninterruptible power device and control method of uninterruptible power device
JPS61250398A (en) Abnormality detection circuit of blower
JPH0232223A (en) Temperature monitoring circuit
JPH06132469A (en) Integrated circuit element and electronic appliance employing same
WO2023228489A1 (en) Operation recording system, vehicle, operation recording method and operation recording program
JPH05276643A (en) Overload detector
JP2604920B2 (en) Cooling abnormality detection circuit for information processing equipment
KR200290678Y1 (en) Sequence controller with built-in detection element