JPH0570190U - Power supply cooling structure - Google Patents
Power supply cooling structureInfo
- Publication number
- JPH0570190U JPH0570190U JP722492U JP722492U JPH0570190U JP H0570190 U JPH0570190 U JP H0570190U JP 722492 U JP722492 U JP 722492U JP 722492 U JP722492 U JP 722492U JP H0570190 U JPH0570190 U JP H0570190U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- supply device
- base plate
- heat
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Abstract
(57)【要約】
【目的】 電源装置全体を大型にすることなく、しかも
冷却機能に優れた電源装置の冷却構造を提供する。
【構成】 電気部品１を収納する電源装置本体３に熱導
電性に優れた電源ベースプレート11を設ける。そして、
この電源ベースプレート11内に冷却液の注入口13及び排
出口14を有する流路12を設ける。
【効果】 電源装置本体３から発生する熱が電源ベース
プレート11に伝わると、この熱が流路12内を流れる冷却
液によって強制的に放熱される。このため、ヒートシン
ク等を用いずに、電源装置本体内の温度上昇を抑制でき
る。
(57) [Abstract] [Purpose] To provide a cooling structure for a power supply device, which has an excellent cooling function without increasing the size of the entire power supply device. [Structure] A power supply base plate 11 having excellent thermal conductivity is provided in a power supply device main body 3 which houses an electric component 1. And
A flow path 12 having an inlet 13 and an outlet 14 for cooling liquid is provided in the power source base plate 11. [Effect] When the heat generated from the power supply device body 3 is transmitted to the power supply base plate 11, this heat is forcibly dissipated by the cooling liquid flowing in the flow path 12. Therefore, it is possible to suppress the temperature rise in the power supply device body without using a heat sink or the like.
Description
【０００１】[0001]
本考案は電源装置の冷却構造に関し、特に、インバータ回路，チョッパ回路等 の電力変換手段を備えた電源装置の冷却構造に関する。 The present invention relates to a cooling structure for a power supply device, and more particularly to a cooling structure for a power supply device provided with power conversion means such as an inverter circuit and a chopper circuit.
【０００２】[0002]
一般に、電力変換手段等を備えた電源装置の冷却構造は、例えば実公昭５７− ２４０７７号公報に開示されるように、放熱フィンを形成したヒートシンクによ って装置内部からの熱を外方へ放散させる、いわゆる空冷式の冷却構造が公知で ある。 Generally, a cooling structure of a power supply device including a power conversion means or the like, as disclosed in, for example, Japanese Utility Model Publication No. 57-24077, heats the inside of the device to the outside by means of a heat sink having a radiation fin. A so-called air-cooling type cooling structure for dissipating is known.
【０００３】 図２は、従来例におけるコンダクション冷却（熱伝導冷却）タイプの電源装置 を示している。図中、１は周知の電源回路からなるトランス、整流ダイオード、 平滑コンデンサ、パワートランジスタ等の電気部品であり、これら電気部品１は アルミニウム或いはプラスチック等の箱形状のシャーシ２により収納されて電源 装置本体３を構成している。なお、４は外部との電気的接続を行うために設けら れた端子である。前記電源装置本体３の一側には、その全面にわたって熱伝導性 に優れたアルミニウム製の電源ベースプレート５が接触するように設けられてお り、さらに、この電源ベースプレート５の外側全面には、放熱フィンを形成した アルミニウム製のヒートシンク６が密着して設けられる。そして、電源装置本体 ３からの熱は電源ベースプレート５を伝わってヒートシンク６に達し、このヒー トシンク６の熱が放熱フィンを流れる空気によって強制的に冷却されて、電源装 置本体３内の温度上昇を抑制するというものである。FIG. 2 shows a conventional cooling (heat conduction cooling) type power supply device. In the figure, reference numeral 1 is an electric component such as a transformer, a rectifying diode, a smoothing capacitor, a power transistor, etc., which is a well-known power supply circuit, and these electric components 1 are housed in a box-shaped chassis 2 made of aluminum, plastic, or the like, and the main body of the power supply device. Make up three. Reference numeral 4 is a terminal provided for making an electrical connection with the outside. A power supply base plate 5 made of aluminum having excellent heat conductivity is provided on one side of the power supply device main body 3 so as to be in contact with the entire surface thereof. A heat sink 6 made of aluminum and having fins is closely attached. Then, the heat from the power supply device body 3 reaches the heat sink 6 through the power supply base plate 5, and the heat of the heat sink 6 is forcibly cooled by the air flowing through the heat radiation fins, so that the temperature inside the power supply device body 3 rises. Is to suppress.
【０００４】[0004]
上記従来技術において、ヒートシンク６の冷却機能を高めるために、このヒー トシンク６を電源装置本体３の一面に設け、しかも、フィンの部分をできるだけ 大きく形成して空気に対する接触面積を増やすようにしている。このため、電源 装置全体がヒートシンク６によって大型化し、限られた収納スペースに納まりき れない等といった問題点を有していた。 In the above-mentioned conventional technology, in order to enhance the cooling function of the heat sink 6, the heat sink 6 is provided on one surface of the power supply main body 3, and the fin portion is formed as large as possible to increase the contact area with air. .. For this reason, the entire power supply device is increased in size by the heat sink 6, and there is a problem that it cannot be stored in a limited storage space.
【０００５】 そこで、本考案は上記問題点を解決して、電源装置全体を大型にすることなく 、しかも冷却機能に優れた電源装置の冷却構造を提供することを目的とする。Therefore, an object of the present invention is to solve the above-mentioned problems and to provide a cooling structure for a power supply device, which has an excellent cooling function without increasing the size of the entire power supply device.
【０００６】[0006]
本考案は電気部品を収納する電源装置本体に熱導電性の電源ベースプレートを 設け、この電源ベースプレート内に冷却液を流入及び排出する流路を設けたもの である。 According to the present invention, a heat-conducting power supply base plate is provided in a power supply device body that houses electric parts, and a flow path for inflowing and discharging a cooling liquid is provided in the power supply base plate.
【０００７】[0007]
上記構成により、電源装置本体から発生する熱が電源ベースプレートに伝わる と、この熱が流路内を流れる冷却液によって強制的に放熱され、電源装置本体内 の温度上昇を抑制する。 With the above configuration, when the heat generated from the power supply device main body is transferred to the power supply base plate, this heat is forcibly dissipated by the cooling liquid flowing in the flow path, and the temperature rise in the power supply device main body is suppressed.
【０００８】[0008]
以下、本考案の一実施例につき、図１を参照して説明する。なお、前記従来例 における図２と同一部分には同一符号を付し、その共通する箇所の詳細な説明は 省略する。同図において、電源ベースプレート11の外側には従来例のようなヒー トシンクは設けられておらず、代わりに、管状に形成された流路12が電源ベース プレート11内を蛇行しながら、電源装置本体３の一面に対向して設けられている 。そして、電源ベースプレート11の一側には流路12の注入口13及び排出口14がそ れぞれ設けられ、注入口13から流入される冷却液が排出口14から排出されるよう に構成される。 An embodiment of the present invention will be described below with reference to FIG. The same parts as those in FIG. 2 in the conventional example are designated by the same reference numerals, and detailed description of the common parts will be omitted. In the figure, a heat sink unlike the conventional example is not provided outside the power supply base plate 11, but instead, the tubular flow path 12 meanders in the power supply base plate 11 while the power supply device main body is being formed. It is provided so as to face one surface of No. 3. An inlet 13 and an outlet 14 of the flow path 12 are provided on one side of the power supply base plate 11, and the cooling liquid flowing from the inlet 13 is discharged from the outlet 14. It
【０００９】 つぎに、上記構成に付きその作用を説明する。予め定められた端子４に所定の 入力電圧を印加すると、電源装置本体３が作動するとともに、この電源装置本体 ３内からの熱が外方に放散し、先ず熱伝導性の電源ベースプレート11から伝わる 。このとき、図示しない循環装置などによって、流路12の注入口13より排出口14 に冷却液を循環制御させることにより、電源装置本体３から電源ベースプレート 11に伝導された熱は、流路12内を流れる冷却液によって強制的に放熱され、電源 装置本体３の温度上昇が抑制される。Next, the operation of the above configuration will be described. When a predetermined input voltage is applied to the predetermined terminal 4, the power supply main body 3 is activated and the heat from the power supply main body 3 is dissipated to the outside, and is first transferred from the heat conductive power supply base plate 11. .. At this time, the heat conducted from the power supply main body 3 to the power supply base plate 11 is controlled in the flow passage 12 by controlling the circulation of the cooling liquid from the inlet 13 of the flow passage 12 to the discharge outlet 14 by a circulation device (not shown). Cooling liquid flowing through the device forcibly dissipates heat and suppresses the temperature rise of the power supply device body 3.
【００１０】 以上のように上記実施例によれば、電気部品１を収納する電源装置本体３に熱 導電性に優れた電源ベースプレート11を設け、この電源ベースプレート11内に冷 却液を流入及び排出する流路12を設けただけの構成で、流路12内を流れる冷却液 によって良好な冷却機能を維持できるとともに、従来例のように大型のヒートシ ンク等を用いることなく、電源装置全体の小形化を図ることも可能となる。As described above, according to the above-described embodiment, the power supply main body 3 accommodating the electric component 1 is provided with the power supply base plate 11 having excellent thermal conductivity, and the cooling liquid flows in and out of the power supply base plate 11. With the configuration that only the flow passage 12 is provided, a good cooling function can be maintained by the cooling liquid flowing in the flow passage 12, and a compact power supply unit can be used without using a large heat sink unlike the conventional example. It is also possible to achieve this.
【００１１】 なお、本考案は上記実施例に限定されるものではなく、本考案の要旨の範囲に おいて種々の変形実施が可能である。例えば、電源ベースプレート内に設けられ る流路の配置は実施例のような蛇行状に限らず、電源装置本体の電気部品の配置 あるいは形状等を考慮して適宜変形可能である。また、電源ベースプレートの材 質はアルミニウムに限らず、熱伝導性に優れた他の材料を用いることもできる。The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. For example, the arrangement of the flow paths provided in the power supply base plate is not limited to the meandering shape as in the embodiment, but may be appropriately modified in consideration of the arrangement or shape of the electric parts of the power supply device main body. Further, the material of the power supply base plate is not limited to aluminum, and other material having excellent thermal conductivity can be used.
【００１２】[0012]
本考案は電気部品を収納する電源装置本体に熱導電性の電源ベースプレートを 設け、この電源ベースプレート内に冷却液を流入及び排出する流路を設けたもの であり、電源装置全体を大型にすることなく、しかも冷却機能に優れた電源装置 の冷却構造を提供できる。 According to the present invention, a heat-conducting power supply base plate is provided in the power supply unit body that houses electrical components, and a flow path for inflowing and discharging the cooling liquid is provided in the power supply base plate. It is possible to provide a cooling structure for a power supply device that is excellent in cooling function.
【図１】本考案の一実施例を示す電源装置の斜視図であ
る。FIG. 1 is a perspective view of a power supply device according to an embodiment of the present invention.
【図２】従来例を示す電源装置の斜視図である。FIG. 2 is a perspective view of a conventional power supply device.
３ 電源装置本体 11 電源ベースプレート 12 流路 3 Power supply unit 11 Power supply base plate 12 Flow path
Claims (1)
電性の電源ベースプレートを設け、この電源ベースプレ
ート内に冷却液を流入及び排出する流路を設けたことを
特徴とする電源装置の冷却構造。1. A cooling structure for a power supply device, characterized in that a heat conductive power supply base plate is provided in a power supply device main body for accommodating electrical parts, and a flow path for inflowing and discharging a cooling liquid is provided in the power supply base plate. ..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP722492U JPH0570190U (en) | 1992-02-20 | 1992-02-20 | Power supply cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP722492U JPH0570190U (en) | 1992-02-20 | 1992-02-20 | Power supply cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0570190U true JPH0570190U (en) | 1993-09-21 |
Family
ID=11660030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP722492U Pending JPH0570190U (en) | 1992-02-20 | 1992-02-20 | Power supply cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0570190U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009119235A1 (en) * | 2008-03-25 | 2009-10-01 | 株式会社小松製作所 | Capacitor module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55153359A (en) * | 1979-05-18 | 1980-11-29 | Toshiba Corp | Cooling device for semiconductor rectifying element |
| JPS63128793A (en) * | 1986-11-19 | 1988-06-01 | 石川島播磨重工業株式会社 | Method of improving heat absorption capability of cold plate |
| JPH02184061A (en) * | 1989-01-11 | 1990-07-18 | Nec Corp | Temperature detecting structure of integrated circuit package |
-
1992
- 1992-02-20 JP JP722492U patent/JPH0570190U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55153359A (en) * | 1979-05-18 | 1980-11-29 | Toshiba Corp | Cooling device for semiconductor rectifying element |
| JPS63128793A (en) * | 1986-11-19 | 1988-06-01 | 石川島播磨重工業株式会社 | Method of improving heat absorption capability of cold plate |
| JPH02184061A (en) * | 1989-01-11 | 1990-07-18 | Nec Corp | Temperature detecting structure of integrated circuit package |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009119235A1 (en) * | 2008-03-25 | 2009-10-01 | 株式会社小松製作所 | Capacitor module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19980525 |