JP2001145366A - Inverter device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the size of an inverter device by improving heat radiation of the device. SOLUTION: An IPM 1 functioning as a reverse converting unit or a forware converting unit in an inverter is mounted on a main circuit printed board 4 through its terminal 1b. Another electronic component is mounted on the board 4. A heat absorbing and heat transferring plate 10 formed of a metal plate is inserted between the mold 1c of the IPM 1 and the board 4, and one end of the plate 10 is connected to cooling fins 5. Thus, even when the mold 1c is heated, this heat is absorbed and blocked off by the board 10 so that the board 4 is not overheated. Thus, the board 4 and the IPM 1 can be approached to be reduced in size, the overhead of the board 4 is eliminated, and its mounting density can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inverter device, and more particularly to an inverter device using an intelligent power module with improved heat radiation. The intelligent power module is an IGBT
A power module with a built-in switching element and peripheral protection / drive circuits.
Abbreviated.

[0002]

2. Description of the Related Art In an inverter device for controlling the speed of an electric motor by changing the voltage and frequency of the AC motor, a main circuit configuration is a forward conversion unit comprising a commercial power supply as a power supply and a diode bridge for converting an AC power supply to a DC power supply. And an inverting section composed of a switching element for converting the converted DC power into an AC variable voltage and variable frequency.

In recent small-capacity inverter devices,
2. Description of the Related Art Each of the forward conversion unit and the inverse conversion unit, or a unit obtained by integrating both of them is configured by IPM. IP
In the inverter device using M, the main circuit wiring is configured by a printed circuit board, and the components of the control unit are also integrally mounted on the printed circuit board of the main circuit wiring, because the main circuit current is small and downsized. In some cases. Even when the components of the control unit are mounted on a printed circuit board different from the printed circuit board of the main circuit wiring, the components of the control unit are often mounted near the IPM for miniaturization.

Here, an example of the structure of an inverter device using IPM will be described with reference to FIG. As shown in FIG. 1, the main circuit component 2 such as the IPM 1 functioning as an inverse converter and an electrolytic capacitor, and the diode module 3 for forward conversion functioning as a forward converter include a main circuit printed circuit board 4.
And are wired together. The main circuit of the inverter device is constituted by such members 1, 2, 3, and 4.

The heat-generating components IPM 1 and the forward conversion diode module 3 are provided with heat radiating plates 1 a, 3 a made of a metal having good heat conductivity such as copper, and these heat radiating plates 1 a, 3 a are provided with cooling fins 5. Closely adhered to. For this reason,
The heat generated in the IPM 1 and the forward conversion diode module 3 is conducted to the cooling fins 5 and radiated. Also, IP
M1 is connected to and mounted on the main circuit printed board 4 via the terminal 1b. This IPM 1 is a heat sink 1a
The portion (circuit portion) excluding the terminal 1b is molded. In FIG. 5, the molded part is indicated by reference numeral “1c”. FIG. 6 shows a commercially available IP.
1 shows a perspective view of an example of M1.

Further, as shown in FIG. 5, electronic components 6 such as a microprocessor, a memory, and an IC for operating and controlling the main circuit as an inverter are mounted on a control printed circuit board 7. It is connected to a circuit printed board 4.

When air cooling is required, the cooling fins 5
The fan 8 is attached to the cooling fin 5 to send air to the cooling fin 5 to promote heat radiation. Further, in consideration of environmental protection, the entire apparatus is often covered with a protective cover 9 in order to prevent foreign substances from entering from outside.

As shown in FIG. 7, the electronic component 6 may be mounted on the main circuit printed circuit board 4 without using the control printed circuit board 7 to form a single printed circuit board. . By doing so, the area of the printed circuit board can be reduced, and the size of the inverter device can be further reduced.

[0009]

Since a main circuit current flows through the IPM 1, heat is generated. Most of the heat generated by the IPM 1 is the switching element (I
GBT, etc.), and most of the heat loss is transferred from the heat sink 1a to the cooling fins 5 and cooled. However, part of the heat loss generated from the IPM 1 is actually
Raise the temperature of c. On the other hand, the manufacturer of the IPM1 considers that the heat generated by the control circuit built in the IPM1 can be ignored, and no measures have been taken to actively dissipate the heat at present. It also contributes to the rise.

Due to these factors, even if the temperature of the heat radiating plate 1a and the switching element of the IPM 1 can be kept at a predetermined temperature by the operation of the cooling fins 5 and the fan 8, the temperature of the mold portion 1c of the IPM 1 rises. As IPM1
The temperature of the space A between (the molded part 1c of) and the main circuit printed board 4 rises. For this reason, the electronic components mounted on the main circuit printed board 4 and the main circuit printed board 4
There is a risk of overheating itself. This phenomenon is remarkable when the protective cover 9 has a closed structure depending on the specifications of the inverter device.

In order to prevent overheating of the main circuit printed circuit board 4 and the like, the main circuit printed circuit board 4 is arranged at a distance from the mold 1c of the IPM 1 whose temperature is rising so as not to be affected by heat. However, there is a problem that the size cannot be reduced.

In view of the above prior art, an object of the present invention is to provide an inverter device that can be downsized without being affected by the heat of the IPM.

[0013]

According to the present invention, there is provided an inverter device having a main circuit formed by mounting an intelligent power module on a printed circuit board. A heat absorbing / heat transfer plate is inserted into the space, and one end of the heat absorbing / heat transfer plate is connected to the cooling body.

Further, according to the configuration of the present invention, in an inverter device in which an intelligent power module is mounted on a printed circuit board to form a main circuit, a heat absorption / heat transfer plate is inserted into a space between the intelligent power module and the printed circuit board. In addition, both ends of the heat absorption / heat transfer plate are connected to a cooling body.

Further, in the configuration of the present invention, the heat absorption / heat transfer plate is formed of a metal plate.

Further, in the configuration of the present invention, the cooling body is a cooling fin.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a side view showing a main part of an inverter device according to a first embodiment of the present invention, and FIG.
FIG. 3 is a plan view showing a main part of the inverter device according to the embodiment, with a main circuit printed board and cooling fins omitted.

As shown in both figures, the cooling plate 1a of the IPM 1 functioning as an inverse conversion unit or a forward conversion unit is in close contact with the cooling fins 5. The IPM 1 is connected to the main circuit printed circuit board 4 via the terminal 1b. In addition, IP
It is possible to configure an inverse transform unit by M1, a forward transform unit by IPM1, or both an inverse transform unit and a forward transform unit by IPM1.

Although not shown, the cooling fins 5 are air-cooled by a fan, and the heat generated in the mold portion 1c of the IPM 1 is transferred to the cooling fins 5 via the heat radiating plate 1a and radiated. Further, main circuit components such as an electrolytic capacitor and, in some cases, electronic components such as a microprocessor for operation control may be mounted on the main circuit printed board 4. When only the inverse conversion unit is configured by the IPM 1 and the forward conversion unit is not configured, a forward conversion diode module that functions as a forward conversion unit is mounted on the main circuit printed board 4.

In the space between the mold section 1c of the IPM 1 and the main circuit printed board 4, a heat absorbing / heat transfer plate 10 made of a metal plate is inserted. One end (the upper side in FIGS. 1 and 2) of the heat absorption / heat transfer plate 10 is connected to a cooling fin 5 which is a cooling body.

Since the heat absorption / heat transfer plate 10 is arranged as described above, even if the temperature of the mold section 1c rises, the radiant heat is absorbed by the heat absorption / heat transfer plate 10, and the main circuit printed board 4 There is no thermal effect on electronic components and the like mounted on the main circuit printed board 4. Heat absorption / heat transfer plate 1
The heat absorbed by 0 is transferred to the cooling fins 5 and cooled. As a result, even if the distance between the main circuit printed board 4 and the IPM 1 (especially, the mold portion 1c) is reduced for miniaturization, the main circuit printed board 4 itself or the main circuit printed board 4 is mounted. Electronic components and the like do not overheat. Thus, the size of the inverter device can be reduced, and the heat dissipation can be improved.

Further, since the heat absorption / heat transfer plate 10 is formed of a metal plate, a magnetic shielding effect can be exhibited. When the magnetic shielding effect is not expected, the heat absorbing / heat transfer plate 10 can be formed of a material other than metal.

FIG. 3 is a side view showing a main part of an inverter device according to a second embodiment of the present invention, and FIG.
FIG. 3 is a plan view showing a main part of the inverter device according to the embodiment, with a main circuit printed board and cooling fins omitted.

In the second embodiment, the heat absorption / heat transfer plate 10
, Ie, one end (upper side in FIGS. 3 and 4) and the other end (lower side in FIGS. 3 and 4) are connected to cooling fins 5 that are cooling bodies. The configuration of other parts is the same as that of the first embodiment. In the small-capacity IPM 1, the terminal arrangement is limited to two sides, and a space is provided in two directions. In this case, both ends of the heat absorption / heat transfer plate 10 are connected to the cooling fins 5. As described above, since both ends of the heat absorption / heat transfer plate 10 are connected to the cooling fins 5, vibration resistance is improved and heat radiation is further improved.

In the above embodiment, the cooling fin is used as the cooling body. However, when an aluminum die-casting case is adopted, this aluminum die-casting case can be used as a cooling body.

[0027]

As described in detail with the above embodiments, in the present invention, a heat absorbing / heat transferring plate is inserted into a space between an intelligent power module and a printed circuit board, and the heat absorbing / heat transferring plate is inserted. Connected to the cooling body, it is possible to prevent overheating of the printed circuit board due to the heat generated by the intelligent power module, and thus to effectively use the limited area of the printed circuit board, Mounting density can be increased. As a result, the size of the device can be reduced.

Further, since only the heat absorbing / heat transfer plate is inserted and arranged, the heat radiation can be improved with a simple structure.

Further, by forming the heat absorption / heat transfer plate with a metal plate, a magnetic shielding effect can be exhibited.
The adverse effects of noise radiation generated by the intelligent power module can be reduced.

Further, by connecting both ends of the heat absorption / heat transfer plate to the cooling body, vibration resistance can be improved and heat radiation can be further improved.

[Brief description of the drawings]

FIG. 1 is a side view showing a main part of an inverter device according to a first embodiment of the present invention.

FIG. 2 is an exemplary plan view showing a main part of the inverter device according to the first embodiment of the present invention;

FIG. 3 is an exemplary side view showing a main part of an inverter device according to a second embodiment of the present invention;

FIG. 4 is an exemplary plan view showing a main part of an inverter device according to a second embodiment of the present invention;

FIG. 5 is a configuration diagram showing an example of a structure of an inverter device using IPM.

FIG. 6 is a perspective view showing an example of a commercially available IPM.

FIG. 7 is a configuration diagram showing an example of the structure of an inverter device using IPM.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IPM 1a Heat sink 1b Terminal 1c Mold part 2 Main circuit component 3 Diode module for forward conversion 3a Heat sink 4 Main circuit printed board 5 Cooling fin 6 Electronic component 7 Control printed board 8 Fan 9 Protective cover 10 Heat absorption / heat transfer plate

Claims (4)

[Claims] 1. An inverter device in which an intelligent power module is mounted on a printed circuit board to form a main circuit, wherein a heat absorption / heat transfer plate is inserted into a space between the intelligent power module and the printed circuit board.
An inverter device wherein one end of a heat transfer plate is connected to a cooling body. 2. An inverter device having a main circuit formed by mounting an intelligent power module on a printed circuit board, wherein a heat absorbing / heat transfer plate is inserted into a space between the intelligent power module and the printed circuit board.
An inverter device wherein both ends of a heat transfer plate are connected to a cooling body. 3. The inverter device according to claim 1, wherein the heat absorption / heat transfer plate is formed of a metal plate. 4. The inverter device according to claim 1, wherein the cooling body is a cooling fin.