JPH04240753A - Temperature detecting structure for integrated circuit package and temperature sensor carrier - Google Patents

Abstract

PURPOSE:To prevent damage of a temperature sensor signal system due to a handling mistake by providing a pad connected to a bump of a board of A temperature sensor carrier in a recess formed on the board of the carrier through the leads of a temperature sensor and inner wirings, and transmitting the signal of the sensor to a circuit board through the bump. CONSTITUTION:A recess is provided on a board 6 of a temperature sensor carrier 1, and a temperature sensor 3 is adhered with a thermal conductive adhesive. A pad 2 is provided in the recess, and connected to the lead 8 of the sensor 3 by soldering of Au/Sn (80/20wt%), etc. Further, a plurality of bumps 7 are provided on the lower surface of the board 6, and connected to the pads 2 though the inner wirings 9 of the board 6. Further, thermal conductive compound 17 is filled in a microscopic gap between the upper surface of the carrier 1 and a cooler 12. The output of the sensor 3 is transmitted to a circuit board 18 through the wirings 9 and the bumps 7, and input from input/output pins 10 to an external circuit.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature detection structure for measuring the temperature of an integrated circuit package constituting an electronic device such as a large information processing device, and a temperature sensor carrier used therein.

0002

[Prior Art] In electronic equipment such as information processing equipment, multiple boards carrying a large number of integrated circuit elements are mounted on a rack, forced air cooling is performed using a fan attached to the rack, and the temperature of the exhaust air is monitored. When the temperature exceeds a specified value, it is common to take measures such as stopping power supply to the device to prevent damage to the integrated circuit elements.

[0003] In recent years, with the large-scale integration of devices and the increasing density of packaging, the density of heat generation inside racks has become extremely high. are doing. In this method, a temperature sensor is provided for each integrated circuit package to detect the temperature of the integrated circuit package, and when the temperature exceeds a specified value, protective processing such as stopping power supply is performed.

A conventional temperature detection structure for an integrated circuit package will be explained with reference to FIG.

That is, a narrow through groove 303 is prepared in the integrated circuit package 302 on the wiring board 301 . This groove 3
In 2003, a subassembly (Fig. 4 shows a perspective view of only the subassembly)
Insert and fix.

A cooler 310 having a refrigerant supply port 308 and a refrigerant discharge port 309 is tightly attached to the integrated circuit package 302 using fixing screws 311, and the refrigerant is circulated between the supply port 308 and the discharge port 309. to cool the integrated circuit package 302, connect the cable connector 312 for sensor signal extraction to the connection connector 306,
By extracting the signal, the temperature of the integrated circuit package 302 is detected and monitored, and necessary protective measures are taken.

[0007]

[Problems to be Solved by the Invention] In the conventional integrated circuit package temperature detection structure described above, a part of the flexible printed board 305, the reinforcing plate 307, and the connecting connector 306
That is, a portion of the signal path of the sensor output partially protrudes from the integrated circuit package 302. If there is a protruding part like this, the integrated circuit package 302
This protruding part may hit when you put on or take off the
There is a problem in that the component parts of the signal path are damaged.

[0008] Also, cable connector 3 for signal extraction
There is also a problem in that the integrated circuit package 302 is removed while the cable connector 312 is connected to the connector 306, which may damage the components of the signal path and the cable connector 312.

Furthermore, when the cooler 310 is closely attached to the integrated circuit package 302, there is a drawback that the cable of the cable connector 312 is sandwiched between the cooler 310 and the integrated circuit package 302, and the cable may be cut.

0010

[Means for Solving the Problems] A temperature detection structure for an integrated circuit package of the present invention thermally connects a wiring board on which an integrated circuit element is mounted and an upper surface of the integrated circuit element to cool the integrated circuit element. a temperature sensor carrier substrate mounted on the wiring board and whose upper surface is thermally connected to the cooler; a temperature sensor fixed to a recess provided in the substrate of the temperature sensor carrier; a pad provided in the recess and connected to a temperature sensor lead and a bump on the substrate of the temperature sensor carrier by internal wiring, and transmits a signal from the temperature sensor to the wiring board via the bump on the substrate of the temperature sensor carrier. The signal is further transmitted to the outside via input/output pins of the wiring board.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are a longitudinal sectional view and a top view showing a temperature sensor carrier according to an embodiment of the present invention. The substrate 6 of the temperature sensor carrier 1 shown in FIG. Further, a pad 2 is provided in the recess 5 and is connected to a lead 8 of the temperature sensor 3. The connection method between pad 2 and lead 8 is Au/Sn.
(80/20wt%) or the like, but a gold-gold thermocompression method may also be used. A plurality of bumps 7 are provided on the lower surface of the substrate 6 and are connected to the pads 2 via internal wiring 9 of the substrate 6.

FIG. 2 is a longitudinal sectional view of an integrated circuit package in which the temperature sensor carrier 1 shown in FIG. 1 is mounted. 19 is an integrated circuit element mounted on a chip carrier.

Reference numeral 18 denotes a wiring board on which a plurality of integrated circuit elements 19 and the temperature sensor carrier 1 are mounted, and a large number of input/output pins 10 are provided on the surface opposite to the surface on which the integrated circuit elements 19 are mounted. Connect external signals and supply power.
Further, the substrate frame 11 is fixed so as to surround the outer periphery. 12 is a cooler having an inlet 13 and an outlet 14 for liquid refrigerant, and an internal refrigerant flow path 15. The cooler 12 faces the upper surface of the integrated circuit element 19 and is fixed to the substrate frame 11 with screws 16 so as to maintain a small gap. The minute gap between the cooler 12 and the integrated circuit element 19 is filled with a paste-like thermally conductive compound 17. In this embodiment, a case will be described in which a liquid cooling method is adopted, but if air cooling is used, a heat sink provided with fins, for example, may be attached instead of the cooler 12.

The heat generated by the integrated circuit element 19 is transferred to the cooler 12 via the thermally conductive compound 17 and is dissipated into the liquid refrigerant flowing in the refrigerant flow path 15. At this time, the temperature of the surface of the cooler 12 facing the integrated circuit element 19 has a certain temperature difference from the temperature of the PN junction within the integrated circuit element 19. Therefore, if this temperature difference is determined by calculation or experiment, the temperature of the PN junction of the integrated circuit element 19 can be calculated by measuring the temperature of the surface of the cooler 12 facing the integrated circuit element 19.

The temperature sensor carrier 1 is designed to have the same component height as other integrated circuit elements 19, and a minute gap between the top surface of the temperature sensor carrier 1 and the cooler 12 is filled with a thermally conductive compound 17. It has been done. Furthermore, as shown in FIG. 1, the temperature sensor 3 is bonded to the recess 5 of the substrate 6 with a thermally conductive adhesive 4, so that if the integrated circuit package is in a thermally balanced state, the temperature sensor 3 will cause the temperature sensor 3 to The temperature of the surface facing the integrated circuit element 19 can be measured.

The output of the temperature sensor 3 is transmitted to the wiring board 18 via the internal wiring 9 and bumps 7, and is inputted to the external circuit from the input/output pin 10.
By configuring the external circuit so that the power supply to the integrated circuit element 19 is stopped when the temperature sensor 3 detects the temperature of the surface facing the integrated circuit element 19 of the cooler 12 when the junction reaches the maximum allowable temperature. A protection mechanism for the integrated circuit element 19 can be configured.

Since the signal from the temperature sensor carrier 1 is connected to the outside through the input/output pin 10 provided on the wiring board 18 like the signals from other integrated circuit elements 19, a dedicated connector or the like is provided for temperature detection. There's no need. Therefore, the integrated circuit package can be attached and detached without being aware of the connection of the temperature detection signal. Furthermore, since there is no protrusion from the integrated circuit package, there is no possibility of damage during transportation.

[0019]

As explained above, the temperature detection structure of the integrated circuit package of the present invention is highly reliable because it does not require sealing using a cap, etc., and the manufacturing process is simple. There is no need to operate a connector dedicated to the temperature sensor when attaching or detaching the circuit package, and since there are no protrusions on the parts, it is possible to realize a temperature detection structure that will not damage the temperature sensor signal system due to handling errors.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a temperature sensor carrier according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of an integrated circuit package in which the temperature sensor carrier shown in FIG. 1 is mounted.

FIG. 3 is a perspective view showing a temperature detection structure of a conventional integrated circuit package.

4 is a perspective view of a subassembly including temperature sensor 304 of FIG. 3. FIG.

[Explanation of symbols]

1 Temperature sensor carrier 2 Pad 3, 304 Temperature sensor 4 Adhesive 5 Recess 6 Board 7 Bump 8 Lead 9 Internal wiring 10 Input/output pin 11 Frame 12, 310 Cooler 13 Refrigerant inlet 14 Refrigerant outlet 15 Refrigerant flow path 16 Screw 17 Heat Conductive compound 18, 301 Wiring board 19 Integrated circuit 302 Integrated circuit package 303 Through groove 305 Flexible printed board 306
Connection connector 307 Reinforcement plate 308 Supply port 309 Discharge port 311 Fixing screw 302 Cable connector

Claims (2)

[Claims] [Claim 1] A wiring board on which an integrated circuit element is mounted;
a cooler thermally coupled to an upper surface of the integrated circuit element to cool the integrated circuit element; a substrate of a temperature sensor carrier mounted on the wiring board and having an upper surface thermally coupled to the cooler; a temperature sensor fixed to a recess provided in a substrate of a temperature sensor carrier; and a pad provided in the recess connected to a lead of the temperature sensor and a bump of the substrate of the temperature sensor carrier through internal wiring; A temperature detection structure for an integrated circuit package, characterized in that a signal from a temperature sensor is transmitted to the wiring board via a bump on the substrate of the temperature sensor carrier, and further transmitted to the outside via an input/output pin of the wiring board. 2. A temperature sensor comprising: a substrate having a pad formed in a recess and connecting the pad and a bump via internal wiring; and a temperature sensor having the pad and a lead connected and fixed to the recess. sensor carrier.