JPH02183975A - Printing mask - Google Patents
Printing maskInfo
- Publication number
- JPH02183975A JPH02183975A JP161589A JP161589A JPH02183975A JP H02183975 A JPH02183975 A JP H02183975A JP 161589 A JP161589 A JP 161589A JP 161589 A JP161589 A JP 161589A JP H02183975 A JPH02183975 A JP H02183975A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- mask
- substrate
- soldering
- soldering pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 239000006071 cream Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 abstract description 25
- 230000007261 regionalization Effects 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子回路などが形成される基板上に、半導
体装置などの部品実装用のクリーム半田を印刷するため
の印刷マスクに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] This invention relates to a printing mask for printing cream solder for mounting components such as semiconductor devices onto a substrate on which electronic circuits and the like are formed. .
基板上に回路パターンを印刷し、半導体装置などを実装
して回路を構成するようなとき、回路が複雑であると基
板を多層構造にして各層間に配線を設けた多層配線構造
にすることがある。その場合、基板の厚さは厚くなるが
、一方、基板が装着される電気機器のスペースなどの都
合から基板を薄くシなければならないこともあり、その
時は。When constructing a circuit by printing a circuit pattern on a board and mounting semiconductor devices, etc., if the circuit is complex, it may be necessary to make the board a multilayer structure and create a multilayer wiring structure with wiring between each layer. be. In that case, the thickness of the board becomes thicker, but on the other hand, there are times when it is necessary to make the board thinner due to reasons such as space for the electrical equipment on which the board is mounted.
回路が複雑な部分だけ多層配線構造にして、他の部分の
基板の厚さは薄くする。第３図は上記に例示したような
、厚い部分と薄い部分がある基板にクリーム半田を付着
させて半田付パターンを形成するための従来の方法を示
す斜視図である。図において、（υは基板で、厚い部分
＋２１と薄い部分（３１から成っていて、その境界には
段差（４Ａ）があり、また、表面には図示しないプリン
ト配線が形成されている。（５）は基板ｔｌＪ上の図示
しないプリント配線上にクリーム半田を付着させて形成
した半田付パターン、（６）は内部にクリーム半田（図
示せず）を貯溜して一定量づ＼吐出できるクリーム半田
吐出装置である。Use a multilayer wiring structure only in areas where the circuit is complex, and reduce the thickness of the board in other areas. FIG. 3 is a perspective view showing a conventional method for forming a soldering pattern by applying cream solder to a substrate having thick and thin parts, as exemplified above. In the figure, (υ is the board, which consists of a thick part +21 and a thin part (31), there is a step (4A) at the boundary, and printed wiring (not shown) is formed on the surface. (5 ) is a soldering pattern formed by adhering cream solder to printed wiring (not shown) on the board tlJ, and (6) is a cream solder discharger that stores cream solder (not shown) inside and can discharge it in a fixed amount. It is a device.
次に動作について説明する。段差（４Ａ）のある基板（
υに半田付パターン（５）を形成する場合は、従来から
単一平面に対して行われている印刷方法は採用できず、
第３図に示すような方法で行われる。Next, the operation will be explained. A board with a step (4A) (
When forming the soldering pattern (5) on υ, the conventional printing method used on a single plane cannot be used;
This is done in the manner shown in FIG.
まず、クリーム半田吐出Ｗ！＋６１にクリーム半田Ｃ図
示せず）を充填した後、これを半田付パターン（５１を
形成すべき所に順次移動させて一定量のクリーム半田（
図示せず）を吐出、付着させて半田付パターン（５）を
形成する。厚い部分（２）にも薄い部分（３）にも同様
にして行う。次に、半田付パターン（５）に合わせて半
導体装置（図示せず）などを搭載し、基板（υ全体を、
搭載されたものを含めてそのま１加熱炉（図示せず）に
入れて加熱することにより、基板（υへの半導体装置（
図示せず）などの半田付実装を行う。First, cream solder discharge W! + 61 is filled with cream solder C (not shown), and then moved sequentially to the place where the soldering pattern (51) is to be formed, and a certain amount of cream solder (
(not shown) is discharged and deposited to form a soldering pattern (5). The process is done in the same manner for both the thick part (2) and the thin part (3). Next, semiconductor devices (not shown) and the like are mounted in accordance with the soldering pattern (5), and the entire board (υ) is
The semiconductor device (semiconductor device (
solder mounting (not shown).
従来の半田付パターンの形成は以上のようにして行われ
ているので、半田付パターンを形成すべき所に、順次、
クリーム半田を付着させねばならず、そのため作業能率
が悪く、また、クリーム半田吐出装置から吐出したクリ
ーム半田を付着させて行うので徽細な半田付パターンは
形成できないなどの問題点があった。Conventional soldering pattern formation is performed as described above, so in order,
Cream solder must be applied, resulting in poor work efficiency, and since the process is performed by applying cream solder discharged from a cream solder dispensing device, there are problems such as the inability to form fine soldering patterns.
この発明は上記のような問題点を解消するためになされ
たもので、段差を有する基板へ半田付パターンを形成す
るときの作業能率を改善し、かつ、微細な半田付パター
ンの形成を可能にすることを目的とする。This invention was made to solve the above-mentioned problems, and it improves work efficiency when forming soldering patterns on boards with steps, and also makes it possible to form fine soldering patterns. The purpose is to
段差を有する基板へ半田付パターンを印刷するために印
刷マスクを互に連なって、かつ段差を有するよう設けら
れた２つのマスクから成るようにしたものである。In order to print a soldering pattern on a substrate having a step, the printing mask is made up of two masks that are connected to each other and are provided so as to have a step.
互に連なって、かつ、段差を有するよう設けられた２つ
のマスクから成る印刷マスクを使用することにより、同
様の段差を有する基板への半田付パターンの形成を印刷
によって行うことができる。By using a printing mask consisting of two masks that are connected to each other and have a step difference, it is possible to form a soldering pattern on a substrate having a similar step difference by printing.
以下、この発明の一実施例を図について説明する。第１
図はこの発明の一実施例による印刷マスクを示す斜視図
であり、図において、（７Ａ）、 （７Ｂ）は第１およ
び第２のマスクで、前者は図において高く、後者は低く
配置され、その境界に段差（４Ｂ）が生じるよう、かつ
、連なって設けられている。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a perspective view showing a printing mask according to an embodiment of the present invention. In the figure, (7A) and (7B) are first and second masks, the former being placed higher in the figure and the latter being lower, They are provided in series so that a step (4B) occurs at the boundary.
＋８）は第１および第２のマスク（７Ａ）、 （７Ｂ）
に形成されたパターン穴で、形成すべき半田付パターン
と同じ形になっている。（９）は第１および第２のマス
クを保持するための枠である。第２図は第１図の印刷マ
スクと共に用いるスキージの一例を示す斜視図で、αＧ
はスキージ、１ｌｌＡ１． （ＩＩＢ）は第１および第
２の板で、これらは連続して成り、その境界に、印刷マ
スクの段差（４Ｂ）と同じ高さの段差（４Ｃ）を有して
いる。+8) are the first and second masks (7A), (7B)
The pattern hole is formed in the same shape as the soldering pattern to be formed. (9) is a frame for holding the first and second masks. FIG. 2 is a perspective view showing an example of a squeegee used with the printing mask shown in FIG.
is a squeegee, 1llA1. (IIB) is the first and second plate, which are continuous and have a step (4C) at the boundary thereof having the same height as the step (4B) of the printing mask.
次に、これらの印刷マスクおよびスキージαＯを用いて
第３図に示すような段差（４Ａ）を有する基板（１１上
に半田付パターン（５１を形成する方法について説明す
る。印刷マスクの段差（４Ｂ）は基板（１）の段差（４
人）と同じ高さにしておく。まず、予め第１および第２
のマスク（７Ａ１． （７Ｂ）上に適息のクリーム半田
Ｃ図示せず）を施しておき、基板ｔυの厚い部分（２）
上に第１のマスク（７人）を、そして薄い部分（３］上
に第２のマスク（７Ｂ）を合わせ、半田付パターン（５
）を形成すべき所にパターン穴（８）が来るよう、基板
（υと印刷マスクの位置決めをして、両者の間に僅かな
隙間をあけて重ね合せる。次に、クリーム半田（図示せ
ず）を施した印刷マスクに第２図のスキージαＯを、第
１の板（ＩＩＡ）が第１のマスク（７Ａ）に、そして第
２の板（１１Ｂ）が第２のマスク（７Ｂ）に当たるよう
にして図示のスキージ移動方向に摺動させると、クリー
ム半田（図示せず）がパターン穴（８１を通して基板（
１１上に流出し、パターン穴（３）の形状に対応した半
田付パターン（５）が基板（１）に印刷される。Next, a method of forming a soldering pattern (51) on a substrate (11) having a step (4A) as shown in FIG. 3 using these print masks and squeegee αO will be described. ) is the step (4) of the board (1)
Keep it at the same height as the person. First, first and second
Apply a mask (7A1. (7B) with a suitable amount of cream solder C (not shown)), and then paste the thick part (2) of the board tυ.
Place the first mask (7 people) on top and the second mask (7B) on the thin part (3), then apply the soldering pattern (5
) Position the substrate (υ) and the printing mask so that the pattern holes (8) are where they should be formed, and place them overlapping each other with a slight gap between them.Next, apply cream solder (not shown). ) onto the printed mask with the squeegee αO shown in Figure 2 so that the first plate (IIA) hits the first mask (7A) and the second plate (11B) hits the second mask (7B). When the squeegee is moved in the direction shown in the figure, the cream solder (not shown) will pass through the pattern hole (81) and pass through the board (
11, and a soldering pattern (5) corresponding to the shape of the pattern hole (3) is printed on the substrate (1).
なお、上記実施例では、スキージＱＧとして段差（４Ｃ
）のあるものを用いたが、段差（４Ｃ）のない長方形状
のもので第１および第２のマスク（７Ａ）、 （７Ｂ）
上を別々に摺動させるようにしてもよいし、あるいは、
ローラ形のものを用いて第１および第２のマスク（７Ａ
１． （７Ｂ）上を別々に転動させるようにしてもよい
。更に、例えば、基板ｔｌＪの厚い部分（２１が中央部
にあって、その両側に薄い部分（３）があるような場合
でも、互に段差（４Ｂ）を有するマスク（７Ａ ）。In the above embodiment, a step (4C) is used as the squeegee QG.
), but rectangular masks without steps (4C) were used for the first and second masks (7A) and (7B).
The upper part may be slid separately, or
The first and second masks (7A
1. (7B) The upper part may be rolled separately. Furthermore, even if, for example, the thick part (21) of the substrate tlJ is in the center and there are thin parts (3) on both sides, the mask (7A) has a step difference (4B).
（７Ｂ）の数を増やすことによって同様に印刷ができる
。Printing can be done in the same way by increasing the number of (7B).
以上のように、この発明によれば、印刷マスクを、互に
連なって、かつ、段差を有するよう設けられた２つのマ
スクで構成したので、このような印刷マスクを使用する
ことにより、段差を有する基板への半田付パターンの形
成を印刷によって行うことができ、そのため、作業能率
が向上し、また、パターン穴に対応した半田付パターン
が得られるので、微細な半田付パターンの形成が可能と
なる効果がある。As described above, according to the present invention, the printing mask is composed of two masks that are connected to each other and have a step, so that by using such a printing mask, the step can be reduced. It is possible to form a soldering pattern on a board with a printed circuit board, which improves work efficiency.Also, since a soldering pattern that corresponds to the pattern hole can be obtained, it is possible to form a fine soldering pattern. There is a certain effect.
第１図はこの発明の一実施例による印刷マスクを示す斜
視図、第２図は第１図の印刷マスクと共に用いるスキー
ジの一例を示す斜視図、第３図は従来の半田付パターン
の形成方法を示す斜視図である。
図において、（υは基板、（２）は厚い部分、（３）は
薄い部分、（４Ａ）、 （４Ｂ）は段差、（７Ａ）、
（７Ｂ）は第１および第２のマスクである。FIG. 1 is a perspective view showing a printing mask according to an embodiment of the present invention, FIG. 2 is a perspective view showing an example of a squeegee used with the printing mask shown in FIG. 1, and FIG. 3 is a conventional method for forming a soldering pattern. FIG. In the figure, (υ is the substrate, (2) is the thick part, (3) is the thin part, (4A), (4B) is the step, (7A),
(7B) are the first and second masks.
Claims (1)
を通してクリーム半田を基板に印刷するものにおいて、
基板の一部に対応する第１のマスク、この第１のマスク
と連なり、かつ、これと段差を有するよう設けられて基
板の他の部分に対応する第２のマスクから成ることを特
徴とする印刷マスク。In a mask having a pattern hole, and printing cream solder onto a board through the pattern hole,
The method is characterized by comprising a first mask corresponding to a part of the substrate, and a second mask continuous with the first mask and provided with a step difference therebetween and corresponding to the other part of the substrate. printing mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP161589A JPH02183975A (en) | 1989-01-07 | 1989-01-07 | Printing mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP161589A JPH02183975A (en) | 1989-01-07 | 1989-01-07 | Printing mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02183975A true JPH02183975A (en) | 1990-07-18 |
Family
ID=11506421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP161589A Pending JPH02183975A (en) | 1989-01-07 | 1989-01-07 | Printing mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02183975A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0915641A1 (en) * | 1997-11-05 | 1999-05-12 | Nec Corporation | Surface mount assembly for electronic components |
-
1989
- 1989-01-07 JP JP161589A patent/JPH02183975A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0915641A1 (en) * | 1997-11-05 | 1999-05-12 | Nec Corporation | Surface mount assembly for electronic components |
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