JPH02183545A - Manufacture of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To reduce the residual amount of air at the time of resin encapsulation, prevent the disconnection of a metal thin wire and the deterioration of humidity resistance, and improve reliability by spreading precoating resin on the whole surface of the electronic parts mounting surface of a film circuit substrate. CONSTITUTION:On a film circuit substrate 2 composed of ceramic and the like and having leads, electronic parts 1A, 1B composed of semiconductor pellets, resistors, etc., are mounted: then the whole part of the electronic parts mounting surface is coated with precoating resin 3 composed of phenol system resin, silicon system resin, etc. After the film circuit substrate 2 is set in a cap 6 composed of resin and the like, the surface is sealed with sealing resin 5. As a result, the whole surface of the film circuit substrate 2 on which the electronic parts 1A, 1B are mounted is coated with precoating resin 3, so that the residual amount of air becomes very small. Thereby, the disconnection of a metal thin wire and the deterioration of humidity resistance are excluded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a hybrid integrated circuit, and more particularly to a method for applying a precoat resin.

[Conventional technology]

In the conventional method for manufacturing a hybrid integrated circuit, first, as shown in FIG. 2(a), an electronic component IA consisting of a semiconductor pellet, a resistor, etc. is placed on the surface of a membrane circuit board 2 made of ceramic or the like to which leads 4 are fixed. After mounting the IB, a precoat resin 3 as a protective film is applied onto the electronic component IA such as a semiconductor pellet.

Next, as shown in FIG. 2(b), the membrane circuit board 2 with the electronic components sealed with the precoat resin 3 is set in the case 6, and then the membrane circuit board 2, etc. is sealed with the sealing resin 5. Completed hybrid integrated circuit.

[Problem to be solved by the invention]

However, in the conventional pre-coating method described above, the pre-coating resin is applied only to some electronic components.
Irregularities are formed on the component mounting surface of the membrane circuit board 2, as shown in FIG.
As shown in b), when the sealing resin 5 is filled, air 7 remains in the uneven portion.

For this reason, the precoat resin 3 is pushed by the expansion of the air 7, causing the thin metal wires of the semiconductor pellet sealed inside to break, and the sealing resin becoming thinner, resulting in a decrease in moisture resistance.

[Means to solve the problem]

The method for manufacturing a hybrid integrated circuit of the present invention includes a step of mounting an electronic component on a film circuit board having leads and then sealing the electronic component with a precoat resin, and a film having the electronic component sealed with the precoat resin. A method for manufacturing a hybrid integrated circuit comprising the steps of setting a circuit board in a cap and sealing it with a sealing resin, in which a precoat resin is applied to the entire electronic component mounting surface of the membrane circuit board.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are cross-sectional views of a membrane circuit board for explaining one embodiment of the present invention.

First, as shown in FIG. 1(a), electronic components IA, 1.8 made of semiconductor pellets, resistors, etc. are mounted on a membrane circuit board 2 made of ceramic or the like having leads 4. A precoat resin 3 made of phenolic resin, silicone resin, etc. is applied to the entire surface.

Next, as shown in FIG. 1(b), the membrane circuit board 2 is set in a cab 6 made of resin or the like as in the conventional case, and its surface is sealed with a sealing resin 5.

As described above, according to this embodiment, the electronic component IA.

Since the surface of the membrane circuit board 2 on which the IB is mounted is entirely covered with the precoat resin 3, when it is sealed with the sealing resin 5, the amount of residual air is extremely small. Therefore, the thin metal wire will not break or the moisture resistance will decrease.

〔Effect of the invention〕

As explained above, the present invention has the effect of reducing the amount of air remaining during resin encapsulation by applying precoat resin to the entire surface of the electronic component mounting surface of the membrane circuit board. Therefore, the reliability of the hybrid integrated circuit can be improved because there is no disconnection of the thin metal wires or a decrease in moisture resistance.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) are cross-sectional views of a membrane circuit board for explaining one embodiment of the present invention, and FIG. 2(a) is a sectional view of a membrane circuit board. (b) is a sectional view of a membrane circuit board for explaining a conventional example. LA, IB...Electronic components, 2...Membrane circuit board, 3.
... Precoat resin, 4... Lead, 5... Sealing resin, 6... Case, 7... Air. 3: Pre-coated resin, case diagram 1

Claims (1)

[Claims] A process of mounting electronic components on a membrane circuit board with leads and then sealing the electronic components with pre-coat resin, and setting the membrane circuit board with electronic components sealed with pre-coat resin in a cap and sealing. A method for manufacturing a hybrid integrated circuit comprising a step of sealing with a resin, the method comprising applying a pre-coat resin to the entire surface of the electronic component mounting surface of the membrane circuit board.