JPH0217952B2 - - Google Patents
Info
- Publication number
- JPH0217952B2 JPH0217952B2 JP24766884A JP24766884A JPH0217952B2 JP H0217952 B2 JPH0217952 B2 JP H0217952B2 JP 24766884 A JP24766884 A JP 24766884A JP 24766884 A JP24766884 A JP 24766884A JP H0217952 B2 JPH0217952 B2 JP H0217952B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- ceramic
- firing
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 53
- 239000000919 ceramic Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 41
- 238000010304 firing Methods 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000006023 eutectic alloy Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229910052726 zirconium Inorganic materials 0.000 claims description 10
- 230000005496 eutectics Effects 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 6
- 239000011224 oxide ceramic Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims 3
- 239000010949 copper Substances 0.000 description 61
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000005211 surface analysis Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910000505 Al2TiO5 Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24766884A JPS61125195A (ja) | 1984-11-22 | 1984-11-22 | セラミツクス回路板の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24766884A JPS61125195A (ja) | 1984-11-22 | 1984-11-22 | セラミツクス回路板の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61125195A JPS61125195A (ja) | 1986-06-12 |
| JPH0217952B2 true JPH0217952B2 (zh) | 1990-04-24 |
Family
ID=17166883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24766884A Granted JPS61125195A (ja) | 1984-11-22 | 1984-11-22 | セラミツクス回路板の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61125195A (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63254031A (ja) * | 1987-04-10 | 1988-10-20 | 昭和電工株式会社 | 回路基板の製造方法 |
-
1984
- 1984-11-22 JP JP24766884A patent/JPS61125195A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61125195A (ja) | 1986-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5029242A (en) | Glass-ceramic structure and method for making same | |
| EP0660651B1 (en) | Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate | |
| JPH0463838B2 (zh) | ||
| JPH0466688B2 (zh) | ||
| JP4081865B2 (ja) | 導体組成物の製造方法 | |
| JPH0217952B2 (zh) | ||
| JP2000077805A (ja) | 配線基板およびその製造方法 | |
| JPH05191038A (ja) | 金属層を備えたセラミックス基板とその製造方法 | |
| JP2738600B2 (ja) | 回路基板 | |
| JP2000154081A (ja) | セラミックス部品およびその製造方法 | |
| JP2703426B2 (ja) | 回路基板 | |
| JP2001024296A (ja) | セラミック回路基板 | |
| JP3808376B2 (ja) | 配線基板 | |
| JP4721533B2 (ja) | セラミック回路基板 | |
| JP4191860B2 (ja) | セラミック回路基板 | |
| JP2001210948A (ja) | セラミック回路基板 | |
| JP2842707B2 (ja) | 回路基板 | |
| JP2003234552A (ja) | 配線基板 | |
| JP4721534B2 (ja) | セラミック回路基板 | |
| JP2003007923A (ja) | 配線基板 | |
| JP2006196810A (ja) | セラミック回路基板および電子部品モジュール | |
| JP2000022029A (ja) | 配線基板 | |
| JP2001308498A (ja) | 配線基板 | |
| JP2000022294A (ja) | 電子部品回路基板 | |
| JP2000340913A (ja) | セラミック回路基板 |