JPH021787Y2 - - Google Patents

Info

Publication number

JPH021787Y2

JPH021787Y2 JP1982201724U JP20172482U JPH021787Y2 JP H021787 Y2 JPH021787 Y2 JP H021787Y2 JP 1982201724 U JP1982201724 U JP 1982201724U JP 20172482 U JP20172482 U JP 20172482U JP H021787 Y2 JPH021787 Y2 JP H021787Y2

Authority

JP

Japan

Prior art keywords

contact

plate

movable contact

fixed

coil portion

Prior art date

1982-12-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
• 238000010438 heat treatment Methods 0.000 description 3
• 229910000881 Cu alloy Inorganic materials 0.000 description 2
• 230000037431 insertion Effects 0.000 description 2
• 238000003780 insertion Methods 0.000 description 2
• 238000009413 insulation Methods 0.000 description 2
• 238000007665 sagging Methods 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 229910000906 Bronze Inorganic materials 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
• 229910000639 Spring steel Inorganic materials 0.000 description 1
• 239000010974 bronze Substances 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
• 230000001105 regulatory effect Effects 0.000 description 1
• 238000004804 winding Methods 0.000 description 1