JPH02177761A - Photosensor device - Google Patents

Abstract

PURPOSE:To form a clearance where light can pass without necessitating post- working by fixing a first substrate and a second substrate which support the supporting body of a photodetector and a lens part for image-forming mutually in keeping the above stated clearance. CONSTITUTION:An image sensor is formed in such structure that the sensor substrate 7 of the photodetector 6, the driving circuit substrate 13 of an IC chip 8, and an image-forming rod lens array 5 are fixed on a first chassis 51 and furthermore, the first chassis 51 is fixed on a second chassis 52 which encloses the periphery of the first chassis. And the chassis 51 is fixed with position relation with the fixing plane 81 of the chassis 52 decided in advance so that the clearance equivalent to a slit 22 can be secured between both chassis 51 and 52. And by fixing the sensor substrate 7 and the rod lens array 5 at desired positions on the chassis 51, and fixing the chassis 51 so as to generate the clearance 62 between the chassis 52, an optical system can be assembled with high accuracy without necessitating the working of the slit.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to an optical sensor device, for example, a contact type image sensor.

As a conventional optical sensor device, for example, a contact type image sensor is used to capture images (original documents) in facsimiles, image readers, etc.
It has been developed as a reading device. This image sensor has the same size as the reading length and is configured to come into close contact with the document and perform photoelectric conversion.

FIG. S shows an example of such an image sensor. That is, the substrate 28 of the LED array 3 is supported on the inclined surface 27 inside the chassis 21, and the chassis 21
A document supporting glass (cover glass) plate 2 is attached to the lower end of the document. The through hole provided in the chassis 21 (
A rod lens array 5 for imaging is fixed so as to face the slit 22. Further, an image sensor module 40 is attached to the upper surface of the chassis 21 .

This module includes a sensor substrate 1 that supports a light receiving element 6.
On the other hand, the driving ICC lamp on the driving circuit board 13 is bonded with the wire 10.
and 13 are also fixed to the chassis 21. Note that 4 in the figure is the lining.

Light 24 from the LED array 3 passes through the glass plate 2 and illuminates a document (not shown) underneath, and the reflected light 24 passes through the rod lens array 5, the through hole 22 of the chassis, and the sensor board 7, and is received. An image is formed on the element 6 by back incidence, and this image information is converted into an electrical signal and output to the outside. In this case, the loft lens array 5 needs to be accurately positioned so that the image is accurately formed on the light receiving element 6.

However, in the above sensor, when manufacturing the chassis 21, it is necessary to extrude a single metal (for example, aluminum) block and form the slits 22 in post-processing. That is, if the block is simply extruded, the light 24 from the loft lens array 5 will be blocked, so it is necessary to open the slit 22 to allow the light to pass through to the light receiving element 6 side. If this is done through processing, the cost will increase. On the other hand, if punching is used, as shown in the cross section in FIG. 10, burrs 25 are likely to form along the opened slits 22, and if these burrs are not removed sufficiently, the sensor board 7 will be tilted and fixed. As a result, the optical system between the light-receiving element 6 and the Rondo lens array 5 is distorted, which changes the imaging position, deteriorates the modulation transfer function (MTF), and lowers the resolution. In addition to the occurrence of the above-mentioned cracks, the punching process tends to cause warping or twisting of the chassis 21 in the longitudinal direction (direction perpendicular to the plane of the paper), and the dimensional accuracy of the chassis tends to be lost.

Further, since the loft lens array 5 is attached to the chassis 21 within the narrow space 26 of the chassis 21, it is difficult to adjust the position of the array when it is attached.

In addition, since it is necessary to install the module 4G without the back cover 4 described above and then install the back cover 4 to prevent outside light from entering the chassis 21, it is necessary to manufacture and install the back cover 4. This will inevitably lead to higher costs and an increase in the number of processes.

C1 Purpose of the Invention The purpose of the present invention is to eliminate the need for post-processing to form through-holes such as the slits described above, to allow the optical system to be placed with good precision, and to adjust the position of the imaging lens portion with good precision. An object of the present invention is to provide an optical sensor device that can be easily fixed and manufactured at low cost.

20 Structure of the Invention That is, in the present invention, a support supporting a light-receiving element and an imaging lens part are supported by a first base, and light from the imaging lens part passes to the light-receiving element side. The present invention relates to an optical sensor device in which the first base body and the second base body are fixed to each other with a gap therebetween.

Here, the term "substrate" refers to one that can be attached to each component of the optical sensor device, has sufficient mechanical strength when fixing the device itself to the outside, and preferably protects against stray light from the outside. Means a blocking member.

Therefore, the back cover 4 and glass plate 2 described above are not included.

E, Example The present invention will be explained in detail below.

1 to 4 show a first embodiment in which the present invention is applied to an image sensor. However, Figure S and Figure 1
Parts common to those in the conventional example shown in FIG.

As shown in FIGS. 1 and 2, in the image sensor of this embodiment, the sensor substrate 7 of the light receiving element 6, the drive circuit board 13 of the IC chip 8, and the imaging rod lens array 5 are mounted on a first chassis. 51 and this first chassis 51
is further fixed to a second chassis 52 surrounding it. And these two chassis 51-5
The chassis 51 is fixed in a predetermined positional relationship to the fixing surface 81 of the chassis 52 so that a gap 62 corresponding to the above-mentioned slit 22 is secured between the two. In FIG. 1, 53 indicated by a dashed line indicates a document path, and 54 indicates a platen roller.Moreover, the module 40 actually includes a driving IC chip 8 and its control, as shown in FIG. Wiring 9. The IC chip 8 and the signal wiring IS of the six examples of light receiving elements are wire-bonded, respectively, but these wirings are omitted in other figures for the sake of simplification.

The second chassis 52 is provided with a protrusion 55 having a triangular cross section and an inclined surface 52a facing the gap 62, a recess 70 into which a glass plate 72 is fitted, and the like. The first chassis 51 also includes a vertical surface 57 (the rod lens array 5 is fixed here) orthogonal to the fixing surface 56 of the image sensor module 4G, and a vertical surface 51
An inclined surface 67 (to which the LED array 3 is fixed) is provided which is connected to the ridge 58 via a protrusion 58 having a triangular cross section.

To explain how to assemble the sensor of this embodiment, first, each of the chassis 51 to 52 described above is processed into predetermined dimensions. This can be easily and precisely machined by extruding aluminum, for example. Next, as shown in FIG.
A transparent substrate 76 with a test pattern 75 is placed on the optical path 74 of the support stand 73, and light 77 is irradiated from the test pattern 75 side. At this time, the respective substrates 7 and 13 have already been adhesively fixed to the surface 56 of the chassis 51 in a predetermined positional relationship, and the test pattern 75 is formed by the light 71 or the light receiving element 6 is
This image formed above can be electrically detected by extracting the output of the light receiving element 6 to the outside via the IC chip 8. Therefore, while checking the output, adjust the position of the rod lens array 5 on the vertical plane 57 as shown by arrows 7B and 7S, and fix the mouth 7 drain lens array 5 so that the above image is reliably formed. The position (that is, the positional accuracy with respect to the light receiving element 6) can be determined. Note that the transparent substrate 76, the test pattern 75, and the test pattern 75 correspond to the original 53, respectively.

Next, the substrate 28 of the LED array 3 is adhesively fixed to the surface 67 of the chassis 51, and then inserted into the chassis 52 from the side opening 80 as shown in FIG. At this time, the chassis 51 is fixed to the chassis 52 by adhesive so that it has the positional relationship shown in FIG. 1 (particularly while finely adjusting the vertical and horizontal positions of the chassis 51 so that a gap 62 is formed). After that, the glass plate 72 is fitted into the chassis 52 and fixed. This glass plate 72 is attached to the chassis 5 in advance.
It may be fixed at 2.

As explained above, the sensor of this embodiment has the following features not found in the conventional example.

First, the sensor board 7 and the rod lens array 5 are fixed to the chassis 51 at desired positions, and the chassis 51 is fixed to the chassis 52 so that a gap 62 is created, so that it is not necessary to process a slit as in the conventional case. Optical systems can be incorporated with high precision without any Therefore, the MT
The performance of F etc. can be made sufficient. In this case, since the chassis 51 has a simple shape, the processing accuracy is sufficient, so the above-mentioned optical system can be arranged with high precision, and even if the chassis S2 is slightly warped, the chassis 51 A positional error between −52 and 52 is within the allowable error range of the MTF, and there is no problem.

Further, since the rod lens array 5 can be fixed to the chassis 51 in a situation with a very large space as shown in FIG. 3, the position of the rod lens array 5 can be adjusted easily and accurately.

Further, since the chassis 52 is provided so as to surround the chassis 51, the back cover 4 as shown in FIG. S is unnecessary, which is also advantageous in reducing the manufacturing cost and number of steps for the sensor.

5 to 8 show image sensors according to other embodiments of the present invention.

The example shown in FIG. 5 differs from the example shown in FIG. 1 in that a glass plate 72 is fixed across the chassis 51-52, and 82 in FIG. 0 is a recess for fitting. In this example, even if the chassis 52 is deformed, the chassis 51 is unlikely to be deformed, so the glass plate 72 must be placed at the target position (that is, the contact point C with the platen roller 54 must be at the predetermined position). can be arranged.

FIG. 6 shows the shape of the chassis 51 (
Therefore, by changing the inner shape of the chassis 52,
1 is placed on the inner flat surface 83 of the chassis 52 and fixed with adhesive. Since such fixing can be performed by placing the chassis 51 on the flat surface 83 of the chassis 52, the position between the two chassis at the time of adhesion is In addition, in this example, since the LED array is fixed to the inclined surface 87 on the chassis 52 side, the LED array 3 and the glass plate 72 are attached to the chassis in advance. 52
The chassis 51 can be fixed by attaching the optical system to the optical system, further improving the accuracy of the arrangement of the optical system.

FIG. 7 shows a sensor module 40 that is different from the example shown in FIG.
An example of changing the board configuration of the sensor board 7 described above is shown.
and the drive circuit board 13 are fixed to a common support substrate (for example, an aluminum substrate) 84, and this support base vi84 is fixed to the chassis 51. In this case, both substrates 13 and 7 can already be fixed in the desired positional relationship on the support substrate 84 in the state shown in FIG. ), the chassis 51 is equipped with such a support board 84.
The workability of assembly is much better than simply fixing the parts.

FIG. 8 shows an example in which light enters from the module surface (i.e., the side of the light receiving element 6), instead of the type in which light enters from the back side of the sensor module 40 as in the example of FIG. Although the support substrate S7 may be transparent, it is also possible to use an opaque material with sufficient mechanical strength. Further, in this example, since the shapes of both chassis 51 and 52 are changed, positioning of both chassis becomes easy and work efficiency is improved.

Although the present invention has been illustrated above, the embodiments described above can be further modified based on the technical idea of the present invention.

For example, the shape of each chassis described above, the method of assembly, the material, shape, size, etc. of each part may be varied. Furthermore, the above-mentioned chassis 51 and 52 may be replaced, and the sensor module 40 and rod lens array 5 may be fixed to the chassis 52 in the example shown in FIG. 1, for example. Various types and types of sensors can be selected.

Effects of the Invention As described above, the present invention is characterized in that the first base body and the twentieth base body, which support the support body of the light receiving element and the imaging lens part, are fixed to each other with a gap through which light can pass. Therefore, the same gap can be formed without the need for post-processing, and the optical system can always be placed with high precision by eliminating cracks, warping, twisting, etc. of the substrate. Also,
Since the imaging lens part can also be fixed to the first base body in advance, this fixing can be done with sufficient space, and the position of the lens part can be adjusted easily and accurately. Furthermore, depending on the shape of the base described above, a back cover may also be unnecessary, and in this respect as well, the optical sensor can be easily manufactured at low cost.

[Brief explanation of the drawing]

Figures 1 to 8 show embodiments of the present invention. Figures 1, 5, 6, 7, and 8 are side views of each side of the contact image sensor. , FIG. 2 is an exploded perspective view of an example of a contact type image sensor, FIG. 3 is a side view showing a method for adjusting the position of the optical system of the image sensor, and FIG. 4 is a side view of the image sensor module. Figure S is a side view of a conventional contact type image sensor;
The figure is a sectional view of the main parts of the image sensor. In addition, in the symbols shown in the drawings, 3.-------LED array s ----
−−−−−−One rod lens array 6−−−−−...
-・-Light receiving element 7・・・・・・・・Sensor board 8-111・−1−−IC chip 13・−−−−−・−・−Drive circuit board 2 t- ---
−−−−−−−−−Chassis 22−・・・−・−−−−
−〜Slit 24−・・・−・−1−−−−Reflected light 2
5-・-・−〜−−−−・−Bali 40・−・・−・・・−・−Sensamosier 51.5
2～---------・-・-Chassis 62---------
- Gap 72 - - - Glass plate (cover glass plate). Agent Patent Attorney Hiroshi Aisaka Figure 3 Figure 4! Figure 5 Figure 7 Figure 8 Figure 9 Figure 10

Claims (1)

[Claims] 1. A support for supporting a light-receiving element and an imaging lens part are supported by a first base body, and a gap is provided for light from the imaging lens part to pass to the light-receiving element side. An optical sensor device in which a first base body and a second base body are fixed to each other.