JPS60230627A - Circuit board for led array - Google Patents

Circuit board for led array

Info

Publication number
JPS60230627A
JPS60230627A JP59086124A JP8612484A JPS60230627A JP S60230627 A JPS60230627 A JP S60230627A JP 59086124 A JP59086124 A JP 59086124A JP 8612484 A JP8612484 A JP 8612484A JP S60230627 A JPS60230627 A JP S60230627A
Authority
JP
Japan
Prior art keywords
circuit board
led array
positioning
led
image reading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59086124A
Other languages
Japanese (ja)
Inventor
Shigeki Yabu
薮 成樹
Masato Yamanobe
山野辺 正人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP59086124A priority Critical patent/JPS60230627A/en
Publication of JPS60230627A publication Critical patent/JPS60230627A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Light Sources And Details Of Projection-Printing Devices (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)

Abstract

PURPOSE:To improve positioning precision by providing reference positioning projections to the circuit board, and using those projections as position references when LED chips are die-bonded and the LED array is mounted on an image reader body. CONSTITUTION:The reference projections 7 are formed integrally on the circuit substrate 1 for the LED array. Therefore, those projections are used as common positioning references in respective manufacture processes of patterning on the circuit board 1, die bonding of the LED chips, boring of fitting holes 6, etc. In this case, the reference projections 7 are used even as positioning reference at the time of the fitting of the LED array to the image reader body, so errors in positioning precision are reduced extremely and the positioning precision of fitting and fixation is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はLEDアレイ用回路基板に関する。詳しくは、
ファクシミリ装置、複写機等の画像読取装置の原稿面の
照明に用いるIJDアレイのLEDアレイ用回路基板に
係り、特に受光面に対する位置決めおよび固定が容易な
LEDアレイ用回路基板に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit board for an LED array. For more information,
The present invention relates to a circuit board for an LED array of an IJD array used for illuminating the document surface of an image reading device such as a facsimile machine or a copying machine, and particularly to a circuit board for an LED array that can be easily positioned and fixed to a light receiving surface.

〔従来技術〕[Prior art]

近年、電子技術の発展に伴って各種の画像伝達システム
や画像処理システムが普及しつつある。
In recent years, with the development of electronic technology, various image transmission systems and image processing systems are becoming popular.

この種のシステムにおいて、画像情報を光信号として入
力し、電気信号として出力する画像読取装置はシステム
全体の性能をも左右する重要な装置である。この為、優
れた性能を持った画像読取装置の開発が強くめられてい
る。それに伴い、前記画像読取装置の原稿面の照明には
、小型化、コスト低減、熱発生の低減等の問題から新た
にLEDチップを複数個並べたLEDアレイが用いられ
るようになった。このようなLEDアレイにおいて、L
EDチッノから発生した光は集光レンズによって受光面
の中央部に集光し照度分布のピークを形成するが、受光
面上における照度分布のピークが鋭く、高い照度を得ら
れる領域が受光面中央の狭い領域に限られるため、この
LEDアレイを、画像読取装置の原稿の照明に用いる場
合、原稿面全受光面とし、原稿上の読み取ろうとする部
分を、最も高い照度の得られる受光面中央に一致させて
用いなければならない。この際の取付固定手段として、
LEDアレイは、第1図のごとく取υ付はネジ25によ
シ画像読取装置本体20に取シ付けられていた。しかし
、従来は、第5図に示す様に位置決め固定用の取9付は
用穴6の穴開けと、LEDチッグ2を回路基板1に接合
するためのダイデンディングが別々の工程であるため、
取り付は用穴6とLEDチップ2の位置精度が良くなか
った。このため、回路基板1と支持部材4の位置決め精
度および回路基板1と画像読取装置本体20との位置決
め精度により集光レンズ3の位置決め精度が決っている
為、集光レンズ3の原稿面に対する位置精度が出しにく
かった。
In this type of system, an image reading device that inputs image information as an optical signal and outputs it as an electrical signal is an important device that influences the performance of the entire system. For this reason, there is a strong need to develop an image reading device with excellent performance. Along with this, an LED array in which a plurality of LED chips are arranged has been newly used for illuminating the document surface of the image reading device due to problems such as miniaturization, cost reduction, and reduction in heat generation. In such an LED array, L
The light generated from the ED chitno is focused on the center of the light-receiving surface by the condenser lens, forming a peak in the illuminance distribution, but the peak of the illuminance distribution on the light-receiving surface is sharp, and the area where high illuminance can be obtained is at the center of the light-receiving surface. Therefore, when using this LED array to illuminate a document in an image reading device, the entire light-receiving surface of the document should be used, and the part of the document to be read should be placed in the center of the light-receiving surface where the highest illuminance can be obtained. Must be used in unison. As a means of mounting and fixing in this case,
The LED array was attached to the image reading device main body 20 with screws 25 as shown in FIG. However, conventionally, as shown in FIG. 5, attaching the mounting 9 for positioning and fixing requires separate processes for drilling the hole 6 and die-dending for joining the LED chip 2 to the circuit board 1.
During installation, the positional accuracy of the hole 6 and the LED chip 2 was not good. Therefore, since the positioning accuracy of the condensing lens 3 is determined by the positioning accuracy of the circuit board 1 and the support member 4 and the positioning accuracy of the circuit board 1 and the image reading device main body 20, the position of the condensing lens 3 with respect to the document surface It was difficult to achieve accuracy.

また、画像読取装置本体20のLEDアレイ取シ付は穴
21の精度によって、LEDアレイの原稿面に対する位
置決め精度が決まるため、このLEDアレイ取9付は穴
21を位置精度よく設けられない場合、例えば、長大、
切シ欠き等しか設けられない場合は、LEDアレイ26
の取シ付けを位置精度よく行なうことが難かしく、他の
位置決め手段として例えば、LEDアレイ26の回路基
板1の外形を位置決め基準に利用しようとすると、回路
基板1の外形と、回路基板1の取9付は用穴6およびL
EDチップ2との位置精度が悪いため、LEDアレイ2
6を画像読取装置本体20へ位置精度よく取シつけるこ
とが難しいという欠点があった。
Furthermore, when the image reading device main body 20 is equipped with an LED array mounting hole, the accuracy of positioning the LED array with respect to the document surface is determined by the accuracy of the hole 21. For example, long,
If only a notch etc. is provided, the LED array 26
It is difficult to mount the circuit board 1 with high positional accuracy, and if you try to use the outer shape of the circuit board 1 of the LED array 26 as a positioning reference as another positioning means, for example, the outer shape of the circuit board 1 and the Hole 6 and L for mounting 9
Due to poor positional accuracy with the ED chip 2, the LED array 2
6 to the image reading device main body 20 with high positional accuracy.

また、LEDアレイの回路基板1へのLEDチップ2の
ダイデンディング、LEDアレイの画像読取装置本体2
0への取9付は用の回路基板1への取り付は用穴6の穴
開は工程、およびLEDプレイの画像読取装置本体20
への取p付けなどの時に、相互の位置が決めにくいとい
う不都合があった。このため、LEDアレイ用回路基板
には位置決め用となる共通の基準点が必要となっていた
Also, die-dending of the LED chip 2 to the circuit board 1 of the LED array, and the image reading device body 2 of the LED array.
0 to the circuit board 1, the drilling of the hole 6 is the process, and the image reading device main body 20 of the LED play.
There was an inconvenience in that it was difficult to determine their mutual positions when attaching them to the . Therefore, the LED array circuit board requires a common reference point for positioning.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、上記欠点を解消し、簡単な構造で、L
EDアレイの原稿面および画像読取装置本体に対する位
置決め精度を向上させ、取付固定を容易とするLEDア
レイ用回路基板を提供することである。
The object of the present invention is to solve the above-mentioned drawbacks, to have a simple structure, and to
It is an object of the present invention to provide a circuit board for an LED array that improves the positioning accuracy of an ED array with respect to a document surface and an image reading device main body, and facilitates mounting and fixing.

〔発明の概要〕[Summary of the invention]

本発明のかかる目的は、LEDアレイのLEDアレイ用
回路基板に位置決め基準用突起を設け、該突起を前記回
路基板の取付は用穴の設置とLEDチップのダイボンデ
ィングおよびLEDアレイの画像読取装置本体への装着
時の位置基準とすることを特徴とするLEDアレイ用回
路基板によって達成されるO 〔実施例〕 本発明のLEDアレイ用回路基板の一実施例を図面を参
照して説明する。
An object of the present invention is to provide a positioning reference protrusion on an LED array circuit board of an LED array, and to attach the protrusion to the circuit board by forming a hole, die bonding the LED chip, and performing image reading device main body of the LED array. [Embodiment] An embodiment of the LED array circuit board of the present invention will be described with reference to the drawings.

第2図は本発明のかかわるLBDアレイを示すもので(
a)はその上面図、(b)はその正面図、(C)はその
側面図である。
Figure 2 shows an LBD array according to the present invention (
(a) is its top view, (b) is its front view, and (C) is its side view.

第2図に示すLEDアレイにおいて、1は板状の回路基
板、2は前記回路基板1上にダイデンディングされたL
EDチッゾ、3はIJDチップ2よシ発した光を集光す
る集光レンズ、4は回路基板1の両側部に設けられた支
持部材、5は集光レンズ3の軸上に回路基板1の両側部
に設けられた支持部材、6は回路基板1に設けられた取
シ付は用の穴、7は回路基板1と一体形成された位置決
め基準用の突起である。
In the LED array shown in FIG.
ED chip; 3 is a condenser lens that condenses the light emitted from the IJD chip 2; 4 is a support member provided on both sides of the circuit board 1; Support members provided on both sides, reference numeral 6 are mounting holes provided on the circuit board 1, and reference numeral 7 are projections for positioning reference formed integrally with the circuit board 1.

LEDアレイを画像読取装置本体20に取シ付ける際の
本実施例の概略構成図を第3図および第4図に示す。
FIGS. 3 and 4 show schematic configuration diagrams of this embodiment when the LED array is attached to the image reading device main body 20.

第3図および第4図において、1は回路基板、6は回路
基板1に設けられた取シ付は用穴、7は回路基板1と一
体形成された位置決め用突起、20は画像読取装置本体
の一部、25はLEDアレイ取シ付は用ネジ、26はL
EDアレイ、27は位置決め用突起7と対応する様画像
読取装置本体20に設けられたIJDアレイ位置決め基
準用凹部で位置決め用突起7が案内される。28はLE
Dアレイの取シ付は用穴6に対応する様画像読取装置本
体20に設けられたLEDアレイ取シ付は用長穴である
3 and 4, 1 is a circuit board, 6 is a mounting hole provided on the circuit board 1, 7 is a positioning projection formed integrally with the circuit board 1, and 20 is the main body of the image reading device. , 25 is the screw for the LED array mounting, 26 is L
The positioning protrusion 7 of the ED array 27 is guided by an IJD array positioning reference recess provided in the image reading apparatus main body 20 so as to correspond to the positioning protrusion 7. 28 is LE
The LED array mounting holes provided in the image reading device main body 20 are elongated holes that correspond to the mounting holes 6 for the D array.

第2図に示す、本実施例のLEDアレイのLEDアレイ
用回路基板においては、あらかじめ回路基板1に位置決
め基準用突起7が一体形成されているので、回路基板1
へのパターンニング、LEDチップ2のダイポンディン
グ、取シ付は用穴6の穴開は工程等の製造上の各工程に
おいて共通の位置決め基準として用いることができる。
In the LED array circuit board of the LED array of this embodiment shown in FIG. 2, since the positioning reference projection 7 is integrally formed on the circuit board 1 in advance, the circuit board 1
The patterning of the LED chip 2, the die bonding of the LED chip 2, and the drilling of the hole 6 for mounting can be used as a common positioning reference in each manufacturing step.

さらに、この位置決め基準用突起7が一体形成された回
路基板1を用いたLεDアレイ26を画像読取装置20
に取シ付ける時、第3図および第4図に示すように、画
像読取装置本体20に、位置決め基準用突起7と対応し
た位置に位置決め基準用凹部27と取シ付は用穴6に対
応した位置にLEDプレイ取p付は用長穴21を設け、
そのそれぞれが対応し、かつ、位置決め基準用突起7と
位置決め基準用凹部とが恢合してIJDアレイ26が案
内されて画像読取装置本体20に位置決めされ、固定さ
れる。しかる後、取シ付は用ネジ25等によp LED
アレイ26を画像読取装置本体20へ固定することで位
置精度の極めて向上した取付固定が行なわれる。
Further, the LεD array 26 using the circuit board 1 on which the positioning reference protrusion 7 is integrally formed is attached to the image reading device 20.
As shown in FIGS. 3 and 4, when installing the image reading device main body 20, there is a positioning reference recess 27 at a position corresponding to the positioning reference protrusion 7 and a mounting hole 6 corresponding to the positioning reference protrusion 7. Provide an elongated hole 21 for installing the LED play at the position shown in the figure.
The positioning reference protrusions 7 and the positioning reference recesses correspond to each other, and the IJD array 26 is guided, positioned, and fixed to the image reading apparatus main body 20. After that, use the screw 25 etc. to attach the LED.
By fixing the array 26 to the image reading device main body 20, mounting and fixing with extremely improved positional accuracy can be achieved.

上記実施例においては、位置決め基準用突起として円柱
状のものを図示したが、突起の形状および数はこれに限
るものではなく、例えば、四角柱状突起でもよく、実施
態様はこれに限定されるものではない。
In the above embodiment, a cylindrical positioning reference protrusion is illustrated, but the shape and number of the protrusions are not limited to this. For example, a square columnar protrusion may be used, and the embodiments are not limited to this. isn't it.

また、前記実施例においては、位置決め基準用突起を回
路基板と一体形成する様構成されていたが、他部材で位
置決め基準用突起全形成し、回路基板に接着等の手段に
より接合してもよく、材質等も適宜用いられて、本実施
例に限定されるものではない。
Further, in the above embodiment, the positioning reference protrusion is formed integrally with the circuit board, but the positioning reference protrusion may be entirely formed with another member and bonded to the circuit board by adhesive or other means. , materials, etc. may be used as appropriate, and are not limited to the present embodiment.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、LEDアレイの回路基板に位置決め基
準用突起を設けて、これを回路基板へのノ4ターンニン
グ、LEDチップのダイボンディング、取シ付は用穴の
穴開は工程等の製造工程において、位置決め基準点とし
て用いられるばかりでなく、IJDアレイの画像読取装
置本体への取υ付けに際しての位置決め基準として用い
ることができることから、位置決め精度の誤差が極めて
少くなシ、取付固定の位置精度が向上し、装置本体への
装填が容易となるLEDアレイのLEDアレイ用回路基
板が得られる。
According to the present invention, positioning reference protrusions are provided on the circuit board of the LED array, and these are used for four-turning on the circuit board, die bonding of LED chips, and drilling of holes for attaching mounting holes. In the manufacturing process, it is not only used as a positioning reference point, but also as a positioning reference when attaching the IJD array to the main body of the image reading device. A circuit board for an LED array with improved positional accuracy and easy loading into the main body of the device can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のIJDアレイを用いた画像読取装置の一
部切欠斜視図。M2図は本発明の一実施例のLEDアレ
イの概略構成図で(、)は上面図、(b)は正面図、(
C)は側面図、第3図は第2図のLEDアレイを画像読
取装置本体に取シ付は固定する時の概略構成説明図。第
4図は、第3図のLEDアレイを画像読取装置に取付固
定した時の側面図である。第5図は、従来のLEDアレ
イの概略構成図でちる。 1・・・回路基板、2・・・LEDチップ、3・・・集
光レンズ、4・・・支持部材、5・・・支持部材、6・
・・取シ付は用穴、7・・位置決め基準用突起、20・
・・画像読取装置本体、21・・・LEDアレイ取シ付
は用長穴、25・・・LEDアレイ取シ付はネジ、26
・・・LEDアレイ、27・・・LEDアレイ位置決め
基準用凹部s1図 第2図 @3図 第4図
FIG. 1 is a partially cutaway perspective view of an image reading device using a conventional IJD array. Figure M2 is a schematic configuration diagram of an LED array according to an embodiment of the present invention, (,) is a top view, (b) is a front view, (
C) is a side view, and FIG. 3 is a schematic configuration explanatory diagram when the LED array of FIG. 2 is mounted and fixed to the main body of the image reading apparatus. FIG. 4 is a side view of the LED array shown in FIG. 3 when it is attached and fixed to an image reading device. FIG. 5 is a schematic diagram of a conventional LED array. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... LED chip, 3... Condenser lens, 4... Support member, 5... Support member, 6...
...Mounting hole, 7.Protrusion for positioning reference, 20.
...Image reading device body, 21...Elongated hole for LED array mounting, 25...Screw for LED array mounting, 26
... LED array, 27 ... LED array positioning reference recess s1 Figure 2 @ Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] (1)回路基板上のダイボンディングされた複数個のL
EDチップと該回路基板上に設けられた支持部材と該支
持部材によって支持される集光レンズよシなるLEDア
レイのIEDアレイ用回路基板において、前記回路基板
に位置決め基準用突起を設け、該突起を前記回路基板の
取付は用穴の設置とLEDチップのダイボンディングお
よびLEDアレイの画像読取装置本体への装着時の位置
基準とすることを特徴とするLEDアレイ用回路基板。
(1) Multiple L die-bonded on a circuit board
In a circuit board for an IED array of an LED array consisting of an ED chip, a support member provided on the circuit board, and a condensing lens supported by the support member, a positioning reference protrusion is provided on the circuit board, and the protrusion A circuit board for an LED array, wherein the mounting of the circuit board is performed by providing a hole, die bonding the LED chip, and using the LED array as a position reference when mounting the LED array on the main body of the image reading device.
JP59086124A 1984-05-01 1984-05-01 Circuit board for led array Pending JPS60230627A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59086124A JPS60230627A (en) 1984-05-01 1984-05-01 Circuit board for led array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59086124A JPS60230627A (en) 1984-05-01 1984-05-01 Circuit board for led array

Publications (1)

Publication Number Publication Date
JPS60230627A true JPS60230627A (en) 1985-11-16

Family

ID=13877950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59086124A Pending JPS60230627A (en) 1984-05-01 1984-05-01 Circuit board for led array

Country Status (1)

Country Link
JP (1) JPS60230627A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007214948A (en) * 2006-02-10 2007-08-23 Canon Inc Image reader

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007214948A (en) * 2006-02-10 2007-08-23 Canon Inc Image reader

Similar Documents

Publication Publication Date Title
US5986253A (en) Illuminating unit for illuminating an original to be read by an image sensor
JPH0936339A (en) Image sensor assembly and its packaging method
US4457017A (en) Method of adjusting position of solid-state scanning element and mounting same
US20050218313A1 (en) Optical encoder and its manufacturing method
JPH10233946A (en) Structure for holding image pickup element of camera
US6156587A (en) Method of attaching solid state imaging device
JPS60230627A (en) Circuit board for led array
JP3416580B2 (en) Solid-state imaging device, camera using the same, and method of manufacturing solid-state imaging device
JPS60230626A (en) Led array
JP2000069336A (en) Mount structure for image pickup device
JP2002055174A (en) Light reflection type sensor
JPS60230621A (en) Led array
JPH07183993A (en) Lens holder and reader using the same
JP2530322B2 (en) Image sensor
JPH07240815A (en) Image scanner
JPS6298854A (en) Contact sensor
JPS6243960A (en) Contact type image sensor unit
JPH02177761A (en) Photosensor device
JP2576668Y2 (en) Multi-optical axis photoelectric switch
KR20090069263A (en) Light detecting device
JPS61107212A (en) Lighting device
JPS61212076A (en) Light-emitting diode array device
JPS60230624A (en) Led array
JPH02114414A (en) Lens unit for reflex type photoelectric switch
JP3084092U (en) Solid-state imaging device