JPS61212076A - Light-emitting diode array device - Google Patents

Light-emitting diode array device

Info

Publication number
JPS61212076A
JPS61212076A JP60053740A JP5374085A JPS61212076A JP S61212076 A JPS61212076 A JP S61212076A JP 60053740 A JP60053740 A JP 60053740A JP 5374085 A JP5374085 A JP 5374085A JP S61212076 A JPS61212076 A JP S61212076A
Authority
JP
Japan
Prior art keywords
led
chip
array device
emitting diode
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60053740A
Other languages
Japanese (ja)
Inventor
Koji Uei
上井 宏司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60053740A priority Critical patent/JPS61212076A/en
Publication of JPS61212076A publication Critical patent/JPS61212076A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To extend the width of illuminance peak and to enlarge the range of precisions allowable for mounting light-emitting diode (LED) chips, by arranging each LED chip having a rectangular planar shape such that one of the diagonals is approximately perpendicular to the central axis of the chip array. CONSTITUTION:LED chips 2... are mounted in an array on an electrically insulating stem 1. A cylindrical condenser lens is fixed on a reflecting plate 3 for efficiently distributing light emitted by the LED chips 2. Each LED chip 2 is mounted in such an orientation that one of the diagonals is approximately perpendicular to the central axis of the array, so that the illuminance peak width (a') in the direction of width of the chip is substantially enlarged in comparison with the illuminance peak width (a) of a conventional LED array device. Any deviation in position of the illuminance peak, which would be caused by deviation in mounting position of the LED chips 2, can be remarkably remedied. Thus, the allowable range of precisions required for mounting an LED array device can be enlarged.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は物体の読取りセンサ用光源等に使用される発光
ダイオードアレイ装置の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement in a light emitting diode array device used as a light source for an object reading sensor.

〔発明の技術的背景〕[Technical background of the invention]

例えばファクシミリの複写機用光源として、複数個の発
光ダイオード(LED)を配列した発光ダイオードアレ
イ装置(以下、LEDアレイ装置という)が用いられて
いる。
For example, a light emitting diode array device (hereinafter referred to as an LED array device) in which a plurality of light emitting diodes (LEDs) are arranged is used as a light source for a facsimile copying machine.

第2図(A)は上記従来のLEDアレイ装置の外観を示
す正面図であり、同図(B)は側面図である。また、同
図(C)はこのアレイ装置におけるLEDチップの配列
状態を示す平面図である。
FIG. 2(A) is a front view showing the external appearance of the conventional LED array device, and FIG. 2(B) is a side view. Further, FIG. 2C is a plan view showing the arrangement state of the LED chips in this array device.

これらの図において、1は絶縁性または絶縁処理を施し
たステムである。該ステム1上には、第2図(C)に示
すように多数のLEDチップ2・・・が−列にマウント
されている。これらLEDチップ2・・・の表面には図
示しないポンディングパッドが形成され、図示しないボ
ンディングワイヤを介してステムに設けられた端子(図
示せず)に接続されている。ステム1にはLEDチップ
2・・・からの光を効率良く分布させるための反射板3
が設けられており、その上には集光レンズ4が固定され
ている。
In these figures, 1 is an insulating or insulated stem. On the stem 1, as shown in FIG. 2(C), a large number of LED chips 2 are mounted in a negative row. Bonding pads (not shown) are formed on the surfaces of these LED chips 2, and are connected to terminals (not shown) provided on the stem via bonding wires (not shown). The stem 1 includes a reflector plate 3 for efficiently distributing light from the LED chips 2...
is provided, and a condenser lens 4 is fixed thereon.

なお、前記LEDチップ2・・・は全て矩形の平面形状
(例えば0.3 #I X O,3m )を有している
。また、図示のように各LEDチップ2・・・はその対
向辺をアレイ中心線に平行に設置されている。
Note that the LED chips 2... all have a rectangular planar shape (for example, 0.3 #I x O, 3m). Moreover, as shown in the figure, each LED chip 2... is installed with its opposing sides parallel to the array center line.

第3図は上記従来のLEDアレイ装置における幅方向の
光強度分布を示している。集光レンズ4の作用により、
図示のようにピーク幅の狭い光分布特性が得られている
FIG. 3 shows the light intensity distribution in the width direction of the conventional LED array device. Due to the action of the condensing lens 4,
As shown in the figure, a light distribution characteristic with a narrow peak width is obtained.

〔背景技術の問題点〕[Problems with background technology]

上記のLEDアレイ装置においてLEDチップ2・・・
のマウントズレが生じると、ピーク照度位置にはマウン
トズレの略4倍のズレが生じる。例えば、人手によるマ
ウント作業で±0.15111111のズレが生じた場
合にはピーク照度位置に士Q、5+nのズレが生じる。
In the above LED array device, the LED chip 2...
When a mount misalignment occurs, the peak illuminance position will be shifted approximately four times as much as the mount misalignment. For example, if a deviation of ±0.15111111 occurs due to manual mounting work, a deviation of -Q,5+n will occur in the peak illuminance position.

また、自動マウントで±0.05fllfflのマウン
トズレが生じた場合にはピーク照度位置に0.2111
1のズレが生じる。このため、レンズ4で集光した光の
ピーク線がアレイの中心線に沿って蛇行することとなり
、次のような問題が発生している。
In addition, if a mount deviation of ±0.05fllffl occurs with automatic mounting, the peak illuminance position will be 0.2111
A deviation of 1 occurs. For this reason, the peak line of the light condensed by the lens 4 winds along the center line of the array, causing the following problem.

即ち、上記LEDアレイの使用に際しては、第4図(A
)に示すように照射面Xに対して傾斜した入射角で光を
照射し、その反射光を受光素子5で検知する。この場合
、安全域を見込んでピーク照度の80〜90%の部分が
照射面Xに当るような態様で使用されるが、既述のよう
にピーク位置にズレが生じると、第4図(B)に示すよ
うに更に照度の低い部分が照射面Xに当ることになり、
照度が低下して使用できなくなる。従ってLEDアレイ
及び受光素子5の取付けに愼めで高い精度が要求される
他、ピークズレを生じた場合には電流を大きくして照度
を上げなければならないといった問題があった。
That is, when using the above LED array, the LED array shown in FIG.
), light is irradiated at an angle of incidence oblique to the irradiation surface X, and the reflected light is detected by the light receiving element 5. In this case, it is used in such a manner that 80% to 90% of the peak illuminance hits the irradiated surface ), the part with even lower illuminance hits the irradiation surface X,
The illuminance decreases and it becomes unusable. Therefore, there is a problem in that not only is the mounting of the LED array and the light receiving element 5 required to be delicate and highly accurate, but also that if a peak shift occurs, the current must be increased to increase the illuminance.

〔発明の目的〕[Purpose of the invention]

本発明は上記事情に鑑みてなされたもので、発光ダイオ
ードチップのマウント形態を変えるだけで照度ピークの
幅を拡大し、マウントの位置ズレを生じた場合にも発光
ダイオードアレイ装置の取付は精度に広い許容範囲を得
ることを目的とするものである。
The present invention has been made in view of the above circumstances, and the width of the illuminance peak can be expanded simply by changing the mounting form of the light emitting diode chip, and even if the mount is misaligned, the mounting accuracy of the light emitting diode array device can be improved. The purpose is to obtain a wide tolerance range.

〔発明の概要〕[Summary of the invention]

本発明による発光ダイオードアレイ装置は、絶縁性また
は絶縁処理を施したステム上に矩形の平面形状を有する
複数個の発光ダイオードチップを一列に配列してマウン
トし、且つ夫々のチップを並列にワイヤボンディングし
てアセンブリーした発光ダイオードアレイ装置において
、個々の発光ダイオードチップを、その一方の対角線が
7レイ中心線に対して略垂直になるように配置したこと
を特徴とするものである。
The light emitting diode array device according to the present invention mounts a plurality of light emitting diode chips having a rectangular planar shape in a line on an insulating or insulating stem, and wire bonding each chip in parallel. In the assembled light emitting diode array device, the individual light emitting diode chips are arranged so that one diagonal line thereof is substantially perpendicular to the center line of the seven rays.

矩形の平面形状を有するLEDチップの対角線はその一
辺よりも長いから、チップの対角線を上記のようにアレ
イ中心線に対して直行させることにより照度ピークの幅
が拡大されることになる。
Since the diagonal line of an LED chip having a rectangular planar shape is longer than one side thereof, the width of the illuminance peak is expanded by making the diagonal line of the chip perpendicular to the array center line as described above.

〔発明の実施例〕[Embodiments of the invention]

第1図は本発明の一実施例になるLEDアレイ装置のに
おけるLEDチップの配列状態を示す平面図である。同
図において、第2図(A)〜(C)と同じ部分には同一
の参照番号を付しである。即ち、1は絶縁性のステム、
2・・・はLEDチップ、3は反射板である。各LED
チップ2・・・の表面には図示しないポンディングパッ
ドが形成され、且つ図示しないボンディングワイヤを介
してステムに設けられた端子(図示せず)に接続されて
いる。
FIG. 1 is a plan view showing the arrangement of LED chips in an LED array device according to an embodiment of the present invention. In this figure, the same parts as in FIGS. 2(A) to 2(C) are given the same reference numerals. That is, 1 is an insulating stem;
2... is an LED chip, and 3 is a reflector. Each LED
A bonding pad (not shown) is formed on the surface of each chip 2, and is connected to a terminal (not shown) provided on the stem via a bonding wire (not shown).

また第2図(A>(B)に示したと同様、反射板3の上
には円柱状の集光レンズが載置固定されている。これら
の構成は殆ど第2図の従来例の場合と全く同じで、LE
Dチップ2・・・の平面形状も0.3awXO13厘の
正方形である。但し、LEDチップ2・・・のマウント
状態は従来と異なっており、図示のように各LED2は
一方の対角線がアレイ中心線に対して略直行する向きで
マウントされている。
Also, as shown in FIG. 2 (A>(B)), a cylindrical condensing lens is mounted and fixed on the reflection plate 3. These structures are almost the same as in the conventional example shown in FIG. Exactly the same, LE
The planar shape of the D chip 2... is also a square of 0.3 aw x 13 mm. However, the mounting state of the LED chips 2 is different from the conventional one, and as shown in the figure, each LED 2 is mounted with one diagonal line substantially perpendicular to the array center line.

上記実施例のLEDアレイ装置では、個々のLEDチッ
プ2・・・が従来の向きから45°回転した向きでマウ
ントされているため、アレイ中心線に直行する方向の長
さが2倍に拡大されている。
In the LED array device of the above embodiment, the individual LED chips 2... are mounted in an orientation rotated by 45 degrees from the conventional orientation, so the length in the direction perpendicular to the array center line is doubled. ing.

即ち、従来は第5図(A)に示すようにLEDチップ2
の一辺に等しい長さ0.311LIか得られないのに対
し、上記の実施例では第5図(8)に示すように0.4
2u+の長さを得ることができる。従って、第6図に示
すように、上記実施例のLEDアレイ装置における幅方
向の照度ピーク幅a’  (同図(B))は、従来のL
EDアレイ装置における照度ピーク幅a(同図(A))
に比較して大幅に拡大される。
That is, conventionally, as shown in FIG. 5(A), the LED chip 2
In contrast, in the above embodiment, a length of 0.311LI equal to one side of
A length of 2u+ can be obtained. Therefore, as shown in FIG. 6, the illuminance peak width a' (FIG. 6(B)) in the width direction of the LED array device of the above embodiment is different from that of the conventional L
Illuminance peak width a in the ED array device ((A) in the same figure)
is significantly expanded compared to

こうして照度ピーク幅が拡大される結果、上記実施例に
おいてLEDチップ2のマウントズレによる照度ピーク
の位置ズレは顕著に改善され、LEDアレイ装置の取付
けに要求される精度の許容範囲を広げることができる。
As a result of expanding the illuminance peak width in this way, the displacement of the illuminance peak due to the mounting displacement of the LED chip 2 in the above embodiment is significantly improved, and the tolerance range of precision required for mounting the LED array device can be expanded. .

因みに、上記実施例では人手によるマウント作業により
±0.15mmのズレが生じた場合にも、照度ビークズ
レは±0.121にしかすぎない。また、自動マウント
時のズレ±0゜05に対しては、照度ピークのズレは殆
ど無視することができる。
Incidentally, in the above embodiment, even if a deviation of ±0.15 mm occurs due to manual mounting work, the illuminance beak deviation is only ±0.121. Moreover, for a deviation of ±0°05 during automatic mounting, the deviation of the illuminance peak can be almost ignored.

なお、本発明によることなく、第7図(A)のように長
方形(0,3a+m xO06go++ )の平面形状
を有するLEDチップ2′を用い、その長辺をアレイ中
心線に対して直行するように配置することによっても上
記実施例と同様の効果を得ることは可能である。しかし
、この場合にも本発明を適用すればより大きな効果が得
られる。第6図(B)はこのLEDチッ72′を用いた
他の実施例において、チップのマウント向きを示す平面
図である。図示のように、この実施例においても第6図
(A)の従来例に比較して0,071mだけチップ幅を
長くしたのと同様の効果が得られる。
Note that, without relying on the present invention, an LED chip 2' having a rectangular (0,3a+m xO06go++ ) planar shape as shown in FIG. 7(A) is used, and its long side is perpendicular to the array center line. It is also possible to obtain the same effects as in the above embodiment by arranging them. However, even in this case, greater effects can be obtained if the present invention is applied. FIG. 6(B) is a plan view showing the mounting direction of the chip in another embodiment using this LED chip 72'. As shown, this embodiment also provides the same effect as when the chip width is increased by 0.071 m compared to the conventional example shown in FIG. 6(A).

(発明の効果) 以上詳述したように、本発明によれば発光ダイオードチ
ップのマウント形態を変えるだけで発光ダイオードアレ
イ装置の照度ピーク幅を拡大し、マウントの位置ズレを
生じた場合にも発光ダイオードアレイ装置の取付は精度
に広い許容範囲を得ることができる等、顕著な効果が得
られるものである。
(Effects of the Invention) As described in detail above, according to the present invention, the illuminance peak width of the light emitting diode array device can be expanded simply by changing the mounting form of the light emitting diode chip, and even if the mount is misaligned, the light emission can be continued. The mounting of the diode array device has remarkable effects such as being able to obtain a wide tolerance range for accuracy.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実m例になるLEDアレイ装置にお
けるチップの配列状態を示す平面図、第2図(A)は従
来のLEDアレイ装置の正面図、同図(B)はその側面
図であり、同図(C)はそのチップの配列状態を示す平
面図、第3図は第2図(A)〜(C)の従来のLEDア
レイ装置における幅方向の光強度分布を示す線図、第4
図か(A)(B)は従来のLEDアレイ装置の使用状態
とその問題点を示す説明図、第5図(A)(B)および
第6図(A)(B)は第1図の実施例におその効果を示
す説明図である。 1・・・絶縁性ステム、2,2′・・・LE[)チップ
、3・・・反射板、4・・・集光レンズ、5・・・受光
素子。 出願人代理人 弁理士 鈴江武彦 第1図 第2図 (A)         (B ) ム 第3図 第4図 (A)(B) 第6図 第7図 (A)           (B) 2′
Fig. 1 is a plan view showing the arrangement of chips in an LED array device which is an example of the present invention, Fig. 2 (A) is a front view of a conventional LED array device, and Fig. 2 (B) is a side view thereof. FIG. 3 is a plan view showing the arrangement state of the chips, and FIG. 3 is a line showing the light intensity distribution in the width direction in the conventional LED array device shown in FIGS. 2(A) to (C). Figure, 4th
Figures 5(A) and 6(B) are explanatory diagrams showing the usage status of the conventional LED array device and its problems. It is an explanatory view showing the effect in an example. DESCRIPTION OF SYMBOLS 1... Insulating stem, 2, 2'... LE[) chip, 3... Reflection plate, 4... Condensing lens, 5... Light receiving element. Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 2 (A) (B) Figure 3 Figure 4 (A) (B) Figure 6 Figure 7 (A) (B) 2'

Claims (1)

【特許請求の範囲】[Claims] 絶縁性または絶縁処理を施したステム上に矩形の平面形
状を有する複数個の発光ダイオードチップを一列に配列
してマウントし、且つ夫々のチップを並列または直列に
ワイヤボンディングしてアセンブリーした発光ダイオー
ドアレイ装置において、個々の発光ダイオードチップを
、その一方の対角線がアレイ中心線に対して略垂直にな
るように配置したことを特徴とする発光ダイオードアレ
イ装置。
A light emitting diode array assembled by mounting a plurality of light emitting diode chips having a rectangular planar shape in a line on an insulating or insulating stem, and wire bonding each chip in parallel or series. 1. A light emitting diode array device, characterized in that the individual light emitting diode chips are arranged so that one diagonal line thereof is substantially perpendicular to the array center line.
JP60053740A 1985-03-18 1985-03-18 Light-emitting diode array device Pending JPS61212076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60053740A JPS61212076A (en) 1985-03-18 1985-03-18 Light-emitting diode array device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60053740A JPS61212076A (en) 1985-03-18 1985-03-18 Light-emitting diode array device

Publications (1)

Publication Number Publication Date
JPS61212076A true JPS61212076A (en) 1986-09-20

Family

ID=12951216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60053740A Pending JPS61212076A (en) 1985-03-18 1985-03-18 Light-emitting diode array device

Country Status (1)

Country Link
JP (1) JPS61212076A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006189825A (en) * 2005-01-05 2006-07-20 Samsung Electronics Co Ltd Led package, illumination system and projection system employing the same
EP2466350A1 (en) * 2010-12-17 2012-06-20 Samsung LED Co., Ltd. LED light source module and display apparatus including the same
JP2014042012A (en) * 2012-07-27 2014-03-06 Nichia Chem Ind Ltd Light emitting device for linear light source
CN107345652A (en) * 2017-07-06 2017-11-14 成都汇翌科技有限公司 POV rotates the laying method of imaging device lamp bead

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006189825A (en) * 2005-01-05 2006-07-20 Samsung Electronics Co Ltd Led package, illumination system and projection system employing the same
JP4537311B2 (en) * 2005-01-05 2010-09-01 三星電子株式会社 Projection system
EP2466350A1 (en) * 2010-12-17 2012-06-20 Samsung LED Co., Ltd. LED light source module and display apparatus including the same
US8602626B2 (en) 2010-12-17 2013-12-10 Samsung Electronics Co., Ltd. LED light source module and display apparatus including the same
JP2014042012A (en) * 2012-07-27 2014-03-06 Nichia Chem Ind Ltd Light emitting device for linear light source
CN107345652A (en) * 2017-07-06 2017-11-14 成都汇翌科技有限公司 POV rotates the laying method of imaging device lamp bead
CN107345652B (en) * 2017-07-06 2019-09-13 江门市江海区昊锐光电科技有限公司 The laying method of POV rotation imaging device lamp bead

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