JP3642692B2 - Image reading device - Google Patents

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Publication number
JP3642692B2
JP3642692B2 JP36592098A JP36592098A JP3642692B2 JP 3642692 B2 JP3642692 B2 JP 3642692B2 JP 36592098 A JP36592098 A JP 36592098A JP 36592098 A JP36592098 A JP 36592098A JP 3642692 B2 JP3642692 B2 JP 3642692B2
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image reading
light
lens
image
housing
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JP2000196808A (en
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重孝 新谷
啓徳 森田
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Kyocera Corp
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Kyocera Corp
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Description

【0001】
【発明の属する技術分野】
本発明はファクシミリやパーソナルコンピュータ用のスキャナまたはデジタルPPC等の原稿読取用に使用される画像読取装置である。
【0002】
【従来の技術】
露出した状態のCCD(ベアチップCCD)を用いた光量検出部材およびこの光量検出部材からなる画像読取装置が提案されている(特開平9−61239号と特開平9−83736号参照)。
【0003】
図11と図12はそれぞれ従来の画像読取装置の断面概略図である。
図11の画像読取装置1に示す光量検出部材2においては、回路基板3上にレンズ固定用の筐体4を搭載し、その内部に光学レンズ群である3組の光学レンズ5(L1、L2、L3)を固定している。光学レンズL1は色収差補正レンズ、光学レンズL2は結像レンズ、光学レンズL3はディストーション補正レンズである。そして、光学レンズL3と筐体4と回路基板3とにより密閉空間6を形成し、さらに回路基板3上にベアチップ状のCCD7を固定し、各電極をボンディングワイヤーなどで回路基板3と接続させている。
【0004】
上記構成の光量検出部材2を画像読取装置1に搭載するに当たって、光源が原稿8を光照射し、その反射光が光学レンズ5を介してCCD7に精度よく結像されるように位置合わせをおこなう。
【0005】
このような画像読取装置1においては、光学レンズ5が筐体4に固定されているが、これに代えて、図12の画像読取装置9に示す光量検出部材10においては、同様な光学レンズ5aが光軸方向にそって可動できる構成にして、その位置調整でもって原稿8からの反射光が光学レンズ5を介してCCD7に精度よく結像させる。
【0006】
【発明が解決しようとする課題】
上記各画像読取装置1、9においては、筐体4を画像読取装置1の所定部位に固定すること、CCD7が搭載された回路基板3および光学レンズ5をそれぞれ筐体4に固定するという各作業があるが、これらの作業と同時に光学的に精度の高い位置合わせが必要である。図中、X軸方向は主走査方向(CCD7の一次元方向)、Y軸方向は副走査方向であって、これら双方の軸方向を調整することで、2次元エリアにおいて歪みのない真っ平らの結像平面となり、さらにZ軸は光軸方向であって、光学レンズ5の位置調整することで、光学的解像度(MTF)および光学系の倍率を設計値に近づける。また、Z軸回転を調整することで光学レンズ5のMTFを最大にする。
【0007】
しかしながら、このような微調整をおこなうことで、密閉空間6内に非常に微小な塵等が封入されるという課題がある。
すなわち、回路基板3を筐体4に固定するに際し、2個のネジを締め込んで固定すると(以下、このようなネジ止め部を螺着部p1と呼ぶ)X軸方向およびY軸方向が調整され、同時に光学レンズ5とCCD7の各光学的な位置も定められるが、もし、調整が所要とおりにできない場合には螺着部p1でのネジをゆるめて再調整しなければならず、これに起因する摩擦により発生する微小な塵やゴミが密閉空間6内に入り、CCD7の受光面に付着して、読み取り画像に白すじや黒すじが発生するなど、画質が低下するという課題があった。
【0008】
図13は上記各画像読取装置1、9による画像信号のタイムチャートであり、矢印Nにてノイズの発生を示すが、これは塵埃等が受光面の一部に付き、これによって光路が遮られて発生したものである。
【0009】
したがって本発明は上記事情に鑑みて完成されたものであり、その目的はベアチップCCDの受光面に塵埃やゴミが付着される度合いを小さくしたり、あるいは皆無となし、これにより、読取り画像の画質を高めた画像読取装置を提供することにある。
【0010】
本発明の他の目的は簡単な作業でもって容易に作製することで、精度調整に要する時間を短縮し、これによって製造歩留りを高めて、生産コストを低減した画像読取装置を提供することにある。
【0011】
【課題を解決するための手段】
本発明の画像読取装置は光透過部が配設された筐体の内部にベアチップCCDを設けて気密封止した光量検出部材を、前記光学レンズと、該光学レンズが設けられたレンズ取着用筐体とから構成される画像読取本体に対し光学的位置決めでもって固定させ、光源の出射光による原稿からの反射光を、前記光学レンズ及び光透過部を順次通過させ、ベアチップCCDに結像せしめるように構成した画像読取装置において、
前記光量検出部材の筐体と前記画像読取本体のレンズ取着用筐体とが面接触しており、且つ前記レンズ取着用筐体の接触面には溝が形成されていることを特徴とするものである。
【0012】
【発明の実施の形態】
本発明を600DPIの解像性をもつ画像読取装置(読取り幅310mmのベアチップCCD)でもって図1〜図10により詳述する。
図1は光量検出部材11の断面概略図、図2は光量検出部材11を搭載した画像読取装置12の断面概略図である。図3は図2に示す画像読取装置12に対し矢印Aから見た断面概略図である。図4は他の光量検出部材13の断面概略図、図5は光量検出部材13を搭載した画像読取装置14の断面概略図であり、図6は画像読取装置14の具体的な構造を示す画像読取装置14aの斜視図、図7は画像読取装置14aの要部分解斜視図である。図8はさらに他の光量検出部材15を搭載した画像読取装置14bの断面概略図、図9は光量検出部材15の分解斜視図である。図10はXY軸方向の調整方法を示す概略図である。
【0013】
図1の光量検出部材11において、ポリカーボネート製の筐体16の内部にガラスエポキシからなるプリント基板の回路基板17を設け、この回路基板17上にベアチップCCD18を搭載し、各電極をボンディングワイヤーなどで回路基板17と接続させている。回路基板17の外側面にはICやオペアンプ、抵抗、コンデンサ等の各種電子部品チップを設ける。また、ベアチップCCD18に対向して前記光透過部である合成樹脂やガラス等からなる透明基板19が筐体16に設けられている。そして、筐体16は気密封止され、密閉空間20が形成される。
【0014】
図2と図3は光量検出部材11を画像読取装置12に搭載した際の取着構造を示し、21は光学レンズ、22は光学レンズ21が設けられたレンズ取着用筐体であり、たとえばポリカーボネートで作製する。光学レンズ21にはたとえば前記光量検出部材2に用いた3組の光学レンズ5(光学レンズL1:色収差補正レンズ、光学レンズL2:結像レンズ、光学レンズL3:ディストーション補正レンズ)を用いる。23は画像読取装置12の画像読取本体の一部であるベースプレートであり、ベースプレート23にレンズ取着用筐体22が固定される。また、24は画像読取装置12にて読取るべき原稿である。さらに画像読取本体にはLED、キセノン管、冷陰極管などの光源が設けられる。
【0015】
上記構成の画像読取装置12を作製するには、下記(1)〜(3)の各実装工程を順次経る。なお、工程(1)と工程(2)との順序を変えてもよい。
【0016】
工程(1)...回路基板17上にベアチップCCD18を搭載し、その回路基板17を筐体16の内部に固定する。さらに透明基板19も筐体16に固定する。そして、この工程により密閉空間20を形成する。
【0017】
回路基板17の上にベアチップCCD18を搭載するには、ダイマウンターを用いておこなう。その後に絶縁性接着剤(ダイアタッチペースト)でもって固定する。そして、ワイヤーボンディングやフェイスダウン、バンプによってベアチップCCD18の端子と、回路基板17上の配線とを電気的に接続する。
【0018】
透明基板19を筐体16に固定するには、双方の間に樹脂系やシリコン系の接着材を塗布し、固化する。透明基板19を合成樹脂で構成した場合には超音波溶着法によって接合させてもよい。
【0019】
工程(2)...光学レンズ21をレンズ取着用筐体22に設置する。そして、このレンズ取着用筐体22をベースプレート23に固定する。
【0020】
光学レンズ21をレンズ取着用筐体22に固定するには、樹脂系やシリコン系の接着材を用いる。光学レンズ21を合成樹脂で構成した場合には超音波溶着法によって接合させてもよい。
【0021】
また、レンズ取着用筐体22は、たとえばプレス板金であるベースプレート23に対し2個程度のネジでもって固定する。さらにベースプレート23とレンズ取着用筐体22とを一体化させたものであってもよい。あるいはレンズ取着用筐体22とベースプレート23とを接着剤を使って固定してもよい。
【0022】
工程(3)...工程(1)にて得られた筐体16をレンズ取着用筐体22に固定する。その際には2個のネジを締め込んで固定される(螺着部p2)。そして、同時に光学的に調整する。
【0023】
この光学調整を図10により説明する。
画像読取装置12に対し規定の調整用特殊なテストチャート32を用意し、外部照明(光源)によりテストチャート32を光放射し、縮小光学系レンズ36を通して、ベアチップCCD18に結像させ、画像を光電変換させる。そして、ベアチップCCD18から取り込んだアナログ信号データをオシロスコープ33によりモニタしながら、画像処理コントローラ34に接続されたパソコン35で処理する。具体的には、白地のチャート上の主走査方向の細い黒色のラインを読むように画像読取装置12を固定し、焦点を合わせながら、ベアチップCCD18の信号出力が、そのラインに対応して均一になるように、X軸方向およびY軸方向にて2次元的に調整する。そして、同時に、そのチャート上のラインに焦点を合わせるべく、画像倍率、画像解像度(MTF)が最適になるように、レンズ群の位置も調整され、z軸方向とともに、θ調整される。チャート上には、倍率用、MTF用のパターンが形成され、それぞれの調整に際しては、画像読取装置12のためのステージが動き、チャートと画像読取装置12との位置関係が決められる。
【0024】
このような固定方法でもって、X軸方向およびY軸方向でもって2次元的に調整することができ、さらにZ軸方向に隙間等によるゆがみが生じなくなる。本例では螺着部p2を2か所にしたが、さらに3か所、4か所にまで増やすことで、確実に固定できる。
【0025】
以上のとおり、画像読取装置12については、工程(2)にてレンズ取着用筐体22をベースプレート23(画像読取本体)に固定することで、光学レンズ21の位置合わせがおこなわれ、Z軸方向に対する位置が規定され、その後、工程(3)にて筐体16をレンズ取着用筐体22に固定するに当たって、螺着部p2でもってX軸方向およびY軸方向を調整することで光学的位置合わせがおこなわれる。
【0026】
しかる後に性能検査をおこなうが、この性能検査にはa)ゴミによる信号低下の有無、b)光学特性、c)出力の調整、という各項目の電気検査をおこなう。
【0027】
かくして上記構成の画像読取装置12においては、気密封止された筐体16をレンズ取着用筐体22に固定すると同時に、螺着部p2で位置合わせをおこなうが、もし、調整ができない場合には螺着部p2でのネジをゆるめて再調整した場合でも、それにより生じた微小な塵やゴミが筐体16に入らなくなった。
【0028】
つぎに図4〜図7に示す他の光量検出部材13(画像読取装置14、14a)を述べる。
上記光量検出部材11では、電子部品チップを設けた回路基板17を使用したが、これに代えて光量検出部材13においては、セラミック回路基板25を用いて、その上にベアチップCCD18を搭載し、さらに透明基板19に代えてアクリル製の湾曲収差補正レンズ26を設けている。なお、光量検出部材11と同一箇所には同一符号を付す。
【0029】
そして、光量検出部材13を画像読取装置14、14aに搭載するに当たって、光量検出部材13の筐体16の外側面にICやオペアンプ、抵抗、コンデンサ等の各種電子部品チップ(インターフェース回路)を設けたガラスエポキシからなるプリント基板の回路基板27を設置している。図6に一例としてコネクタ28を設けた場合を示す。
【0030】
上記構成の画像読取装置14、14aにおいても、気密封止された筐体16をレンズ取着用筐体22に固定すると同時に、螺着部p2で位置合わせをおこなうことで、微小な塵やゴミが筐体16に入らなくなった。
【0031】
具体的には図7に示すようにタップネジ37を筐体16に設けた大きな貫通孔39にゆるやかな状態でもって挿入し、レンズ取着用筐体22に設けた穴40にねじ込むことで、X軸方向およびY軸方向に対し自在に動かすことでき、調整でき、そして、位置が定まることで、さらに締める。また、筐体16とレンズ取着用筐体22とは面接触でもって当たる構成になっているが、レンズ取着用筐体22の接触面には溝41が形成されているので、ゴミ等が面上に存在しても、それが溝41の内部に入るので、精度が高い調整ができる。
【0032】
さらに図8〜図9に示す他の光量検出部材15(画像読取装置14b)においては、上記光量検出部材11では、筐体16の密閉空間20が大きかったが、この筐体16に代えて密閉空間に小さくしている。なお、光量検出部材11と同一箇所には同一符号を付す。
【0033】
29は透明基板、30は板状体であり、透明基板29の矩形状に対応した貫通部31を設けて、貫通部31に透明基板29を設ける。そして、透明基板29の周辺に樹脂系やシリコン系の接着材を塗布し、固定する。透明基板29を合成樹脂で構成した場合には超音波溶着法によって接合させてもよい。
【0034】
そして、回路基板17上に板状体30を載設することで、回路基板17と板状体30と透明基板29によって狭い密閉空間31ができ、その密閉空間内にベアチップCCD18が収納されている。
【0035】
かくして上記構成の画像読取装置14bにおいても、気密封止された光量検出部材15をレンズ取着用筐体22に固定すると同時に、螺着部p2で位置合わせをおこなうことで、微小な塵やゴミが密閉空間31に入らなくなった。
【0036】
また、このように小さな密閉空間31であれば、クリーンルーム内で製作した場合に塵埃が封入される度合いが著しく小さくなり、ベアチップCCD18の受光面が汚染されず、その結果、読み取り画像に白すじや黒すじが発生しなくなり、さらに画質が向上した。ちなみに前記光量検出部材11と対比しても、密閉空間の容積が約30分の1程度にまで小さくなった。
【0037】
なお、本発明は上記実施形態例に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更や改良等は何ら差し支えない。
【0038】
【発明の効果】
以上のとおり、本発明によれば、光源の出射光による原稿からの反射光を、光学レンズを通してベアチップCCDに結像させる画像読取装置において、光透過部が配設された筐体の内部にベアチップCCDを設けて気密封止した光量検出部材を、光学レンズが設けられた画像読取本体に対し光学的位置決めでもって固定させ、光学レンズを通過した反射光を光透過部を通してベアチップCCDに結像せしめるように構成したことで、X軸方向およびY軸方向の2次元的な調整と、さらにZ軸方向の調整もしながら、同時に光量検出部材を画像読取本体に固定でき、このような簡単な作業でもって容易に作製することで、精度調整に要する時間が短縮でき、これによって製造歩留りが高くなり、その結果、生産コストを低減した画像読取装置が提供できた。
【0039】
また、本発明においては、気密封止した光量検出部材を使用することで、ベアチップCCDの受光面に塵埃やゴミが付着される度合いを小さくしたり、あるいは皆無となし、これにより、読取り画像の画質を高めた画像読取装置が提供できた。
【0040】
さらにまた、本発明においては、気密封止した光量検出部材の密閉空間を小さくでき、これにより、その空間内に塵やゴミが封入される度合いが著しく小さくなって、ベアチップCCDの受光面が汚染されず、その結果、読み取り画像に白すじや黒すじが発生しなくなり、画質が著しく向上した。
【0041】
しかも、本発明においては、回路基板上にベアチップCCDを搭載しているので、アナログ処理回路を回路基板に設けることで、双方間の距離が短くなり、これによってS/N比が向上するという利点もある。
【図面の簡単な説明】
【図1】本発明の画像読取装置に使用する光量検出部材の断面概略図である。
【図2】本発明の画像読取装置の断面概略図である。
【図3】本発明の画像読取装置の断面概略図である。
【図4】本発明の他の画像読取装置に使用する光量検出部材の断面概略図である。
【図5】本発明の他の画像読取装置の断面概略図である。
【図6】本発明の画像読取装置の要部具体的構成を示す斜視図である。
【図7】本発明の画像読取装置の要部分解斜視図である。
【図8】本発明のさらに他の画像読取装置の断面概略図である。
【図9】本発明に係る光量検出部材の分解斜視図である。
【図10】X軸/Y軸方向の調整方法を示す説明図である。
【図11】従来の他の画像読取装置の断面概略図である。
【図12】従来の他の画像読取装置の断面概略図である。
【図13】従来の画像読取装置による画像信号のタイムチャートである。
【符号の説明】
1、9、12、14、14a、14b
画像読取装置
2、10、11、15 光量検出部材
3、17、27 回路基板
4、16 筐体
5、5a 光学レンズ
6、20、31 密閉空間
7 CCD
8、24 原稿
18 ベアチップCCD
19、29 透明基板
21 光学レンズ
22 レンズ取着用筐体
23 ベースプレート
25 セラミック回路基板
p1、p2 螺着部
[0001]
BACKGROUND OF THE INVENTION
The present invention is an image reading apparatus used for reading an original such as a scanner for a facsimile or a personal computer or a digital PPC.
[0002]
[Prior art]
A light amount detection member using an exposed CCD (bare chip CCD) and an image reading apparatus including the light amount detection member have been proposed (see Japanese Patent Application Laid-Open Nos. 9-61239 and 9-8336).
[0003]
11 and 12 are schematic sectional views of a conventional image reading apparatus.
In the light amount detection member 2 shown in the image reading apparatus 1 of FIG. 11, a lens fixing housing 4 is mounted on a circuit board 3, and three sets of optical lenses 5 (L1, L2) which are optical lens groups are provided therein. , L3) is fixed. The optical lens L1 is a chromatic aberration correction lens, the optical lens L2 is an imaging lens, and the optical lens L3 is a distortion correction lens. Then, a sealed space 6 is formed by the optical lens L3, the housing 4, and the circuit board 3, and a bare chip CCD 7 is fixed on the circuit board 3, and each electrode is connected to the circuit board 3 by a bonding wire or the like. Yes.
[0004]
When the light quantity detection member 2 having the above-described configuration is mounted on the image reading apparatus 1, the light source irradiates the document 8 and alignment is performed so that the reflected light is accurately imaged on the CCD 7 via the optical lens 5. .
[0005]
In such an image reading apparatus 1, the optical lens 5 is fixed to the housing 4. Instead, in the light amount detection member 10 shown in the image reading apparatus 9 of FIG. 12, a similar optical lens 5 a is used. Is configured to be movable along the optical axis direction, and the reflected light from the document 8 is accurately imaged on the CCD 7 via the optical lens 5 by adjusting the position thereof.
[0006]
[Problems to be solved by the invention]
In each of the image reading devices 1 and 9, each operation of fixing the housing 4 to a predetermined part of the image reading device 1 and fixing the circuit board 3 on which the CCD 7 is mounted and the optical lens 5 to the housing 4, respectively. However, optically accurate alignment is necessary simultaneously with these operations. In the figure, the X-axis direction is the main scanning direction (one-dimensional direction of the CCD 7), and the Y-axis direction is the sub-scanning direction. By adjusting both axial directions, the two-dimensional area is flat without distortion. An imaging plane is formed, and the Z-axis is in the optical axis direction. By adjusting the position of the optical lens 5, the optical resolution (MTF) and the magnification of the optical system are brought close to the design values. Further, the MTF of the optical lens 5 is maximized by adjusting the Z-axis rotation.
[0007]
However, there is a problem that very fine dust or the like is enclosed in the sealed space 6 by performing such fine adjustment.
That is, when the circuit board 3 is fixed to the housing 4, when two screws are tightened and fixed (hereinafter, such a screwing portion is referred to as a screwed portion p <b> 1), the X-axis direction and the Y-axis direction are adjusted. At the same time, the optical positions of the optical lens 5 and the CCD 7 are determined. However, if the adjustment cannot be performed as required, the screw at the screwing portion p1 must be loosened and readjusted. There is a problem that the image quality is deteriorated, for example, fine dust or dirt generated by friction caused by the friction enters the sealed space 6 and adheres to the light receiving surface of the CCD 7 to generate white stripes or black stripes in the read image. .
[0008]
FIG. 13 is a time chart of image signals by the image reading devices 1 and 9, and the occurrence of noise is indicated by an arrow N. This is because dust or the like is attached to a part of the light receiving surface, thereby blocking the optical path. This is what happened.
[0009]
Therefore, the present invention has been completed in view of the above circumstances, and its purpose is to reduce the degree of dust or dirt adhering to the light receiving surface of the bare chip CCD, or to eliminate it, and thereby to improve the image quality of the read image. An object of the present invention is to provide an image reading apparatus having an improved image quality.
[0010]
Another object of the present invention is to provide an image reading apparatus that can be easily manufactured by a simple operation, thereby reducing the time required for accuracy adjustment, thereby increasing the manufacturing yield and reducing the production cost. .
[0011]
[Means for Solving the Problems]
The image reading apparatus of the present invention includes a light amount detecting member that is hermetically sealed by providing a bare chip CCD inside a housing in which a light transmission portion is disposed, the optical lens, and a lens mounting housing in which the optical lens is provided. The image reading main body composed of a body is fixed by optical positioning, and the reflected light from the manuscript by the light emitted from the light source is sequentially passed through the optical lens and the light transmitting portion to form an image on the bare chip CCD. In the image reading apparatus configured as described above,
The housing of the light amount detection member and the lens mounting housing of the image reading body are in surface contact, and a groove is formed on the contact surface of the lens mounting housing. It is.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described in detail with reference to FIGS. 1 to 10 with an image reading apparatus (bare chip CCD having a reading width of 310 mm) having a resolution of 600 DPI.
FIG. 1 is a schematic cross-sectional view of the light quantity detection member 11, and FIG. 2 is a schematic cross-sectional view of an image reading apparatus 12 equipped with the light quantity detection member 11. 3 is a schematic cross-sectional view of the image reading apparatus 12 shown in FIG. 4 is a schematic cross-sectional view of another light quantity detection member 13, FIG. 5 is a schematic cross-sectional view of an image reading apparatus 14 equipped with the light quantity detection member 13, and FIG. 6 is an image showing a specific structure of the image reading apparatus 14. FIG. 7 is an exploded perspective view of the main part of the image reading device 14a. FIG. 8 is a schematic sectional view of an image reading device 14b on which another light quantity detection member 15 is mounted, and FIG. 9 is an exploded perspective view of the light quantity detection member 15. FIG. 10 is a schematic view showing an adjustment method in the XY axis direction.
[0013]
In the light quantity detection member 11 of FIG. 1, a printed circuit board 17 made of glass epoxy is provided inside a polycarbonate casing 16, a bare chip CCD 18 is mounted on the circuit board 17, and each electrode is bonded with a bonding wire or the like. The circuit board 17 is connected. Various electronic component chips such as an IC, an operational amplifier, a resistor, and a capacitor are provided on the outer surface of the circuit board 17. Further, a transparent substrate 19 made of synthetic resin, glass, or the like, which is the light transmission portion, is provided on the housing 16 so as to face the bare chip CCD 18. And the housing | casing 16 is airtightly sealed and the sealed space 20 is formed.
[0014]
2 and 3 show a mounting structure when the light quantity detection member 11 is mounted on the image reading device 12, 21 is an optical lens, 22 is a lens mounting housing provided with the optical lens 21, for example, polycarbonate To make. As the optical lens 21, for example, three sets of optical lenses 5 (optical lens L1: chromatic aberration correction lens, optical lens L2: imaging lens, optical lens L3: distortion correction lens) used for the light amount detection member 2 are used. Reference numeral 23 denotes a base plate which is a part of the image reading main body of the image reading device 12, and the lens mounting housing 22 is fixed to the base plate 23. Reference numeral 24 denotes a document to be read by the image reading device 12. Further, the image reading body is provided with a light source such as an LED, a xenon tube, or a cold cathode tube.
[0015]
In order to manufacture the image reading device 12 having the above-described configuration, the following mounting steps (1) to (3) are sequentially performed. In addition, you may change the order of a process (1) and a process (2).
[0016]
Step (1) . . . A bare chip CCD 18 is mounted on the circuit board 17, and the circuit board 17 is fixed inside the housing 16. Further, the transparent substrate 19 is also fixed to the housing 16. And the sealed space 20 is formed by this process.
[0017]
In order to mount the bare chip CCD 18 on the circuit board 17, a die mounter is used. Then, it is fixed with an insulating adhesive (die attach paste). Then, the terminals of the bare chip CCD 18 and the wiring on the circuit board 17 are electrically connected by wire bonding, face down, and bumps.
[0018]
In order to fix the transparent substrate 19 to the housing 16, a resin-based or silicon-based adhesive is applied between the two and solidified. When the transparent substrate 19 is made of synthetic resin, it may be bonded by an ultrasonic welding method.
[0019]
Step (2) . . . The optical lens 21 is installed in the lens mounting housing 22. Then, the lens mounting housing 22 is fixed to the base plate 23.
[0020]
In order to fix the optical lens 21 to the lens mounting housing 22, a resin-based or silicon-based adhesive is used. When the optical lens 21 is made of synthetic resin, it may be bonded by an ultrasonic welding method.
[0021]
The lens mounting housing 22 is fixed to the base plate 23 which is, for example, a press sheet metal with about two screws. Further, the base plate 23 and the lens mounting housing 22 may be integrated. Alternatively, the lens mounting housing 22 and the base plate 23 may be fixed using an adhesive.
[0022]
Step (3) . . . The casing 16 obtained in the step (1) is fixed to the lens mounting casing 22. At that time, the two screws are fastened and fixed (screwed portion p2). At the same time, optical adjustment is performed.
[0023]
This optical adjustment will be described with reference to FIG.
A special adjustment adjustment test chart 32 is prepared for the image reading device 12, the test chart 32 is emitted by external illumination (light source), and is imaged on the bare chip CCD 18 through the reduction optical system lens 36. Convert it. The analog signal data captured from the bare chip CCD 18 is processed by the personal computer 35 connected to the image processing controller 34 while being monitored by the oscilloscope 33. Specifically, the image reading device 12 is fixed so as to read a thin black line in the main scanning direction on a white background chart, and the signal output of the bare chip CCD 18 is uniformly corresponding to the line while focusing. In such a manner, two-dimensional adjustment is performed in the X-axis direction and the Y-axis direction. At the same time, in order to focus on the line on the chart, the position of the lens group is adjusted so that the image magnification and the image resolution (MTF) are optimized, and θ is adjusted along with the z-axis direction. Patterns for magnification and MTF are formed on the chart, and the stage for the image reading device 12 moves and the positional relationship between the chart and the image reading device 12 is determined for each adjustment.
[0024]
With such a fixing method, two-dimensional adjustment can be performed in the X-axis direction and the Y-axis direction, and further, distortion due to a gap or the like does not occur in the Z-axis direction. In this example, the number of screwed portions p2 is two, but it can be reliably fixed by further increasing the number to three or four.
[0025]
As described above, with respect to the image reading device 12, the lens mounting housing 22 is fixed to the base plate 23 (image reading main body) in the step (2), so that the optical lens 21 is aligned and the Z-axis direction is adjusted. Then, in fixing the housing 16 to the lens mounting housing 22 in the step (3), the optical position is adjusted by adjusting the X-axis direction and the Y-axis direction with the threaded portion p2. Matching is done.
[0026]
After that, a performance inspection is performed. In this performance inspection, electrical inspection is performed for each item of a) presence / absence of signal degradation due to dust, b) optical characteristics, and c) output adjustment.
[0027]
Thus, in the image reading device 12 having the above-described configuration, the hermetically sealed casing 16 is fixed to the lens mounting casing 22 and at the same time the alignment is performed at the screwed portion p2. If the adjustment cannot be made, Even when the screw at the screwing portion p <b> 2 is loosened and readjusted, minute dust and dust generated thereby do not enter the housing 16.
[0028]
Next, another light quantity detection member 13 (image reading devices 14 and 14a) shown in FIGS. 4 to 7 will be described.
In the light quantity detection member 11, the circuit board 17 provided with the electronic component chip is used. Instead, the light quantity detection member 13 uses the ceramic circuit board 25 and the bare chip CCD 18 is mounted thereon. Instead of the transparent substrate 19, an acrylic curvature aberration correction lens 26 is provided. In addition, the same code | symbol is attached | subjected to the same location as the light quantity detection member 11. FIG.
[0029]
In mounting the light quantity detection member 13 on the image reading devices 14 and 14a, various electronic component chips (interface circuits) such as an IC, an operational amplifier, a resistor, and a capacitor are provided on the outer surface of the housing 16 of the light quantity detection member 13. A printed circuit board 27 made of glass epoxy is installed. FIG. 6 shows a case where the connector 28 is provided as an example.
[0030]
Also in the image reading apparatuses 14 and 14a having the above-described configuration, the dust-tight dust 16 and the dust are collected by fixing the hermetically sealed casing 16 to the lens mounting casing 22 and performing the alignment at the screwing portion p2. I can no longer enter the casing 16.
[0031]
Specifically, as shown in FIG. 7, a tap screw 37 is inserted into a large through-hole 39 provided in the housing 16 in a loose state and screwed into a hole 40 provided in the lens mounting housing 22 so that the X axis It can be freely moved and adjusted with respect to the direction and the Y-axis direction, and the position is fixed, thereby further tightening. Further, the housing 16 and the lens mounting housing 22 are configured to come into contact with each other by surface contact. However, since the groove 41 is formed on the contact surface of the lens mounting housing 22, dust or the like is surfaced. Even if it exists above, it enters the inside of the groove 41, so that adjustment with high accuracy can be performed.
[0032]
Further, in the other light quantity detection member 15 (image reading device 14 b) shown in FIGS. 8 to 9, in the light quantity detection member 11, the sealed space 20 of the housing 16 is large. The space is small. In addition, the same code | symbol is attached | subjected to the same location as the light quantity detection member 11. FIG.
[0033]
Reference numeral 29 denotes a transparent substrate, and reference numeral 30 denotes a plate-like body. A through portion 31 corresponding to the rectangular shape of the transparent substrate 29 is provided, and the transparent substrate 29 is provided in the through portion 31. Then, a resin-based or silicon-based adhesive is applied around the transparent substrate 29 and fixed. When the transparent substrate 29 is made of a synthetic resin, it may be bonded by an ultrasonic welding method.
[0034]
Then, by mounting the plate-shaped body 30 on the circuit board 17, a narrow sealed space 31 is formed by the circuit board 17, the plate-shaped body 30 and the transparent substrate 29, and the bare chip CCD 18 is accommodated in the sealed space. .
[0035]
Thus, also in the image reading device 14b having the above-described configuration, the dust-tightness of the light quantity detection member 15 that is hermetically sealed is fixed to the lens mounting case 22, and at the same time, the position is adjusted by the screwing portion p2, so that minute dust and dirt are collected. I can no longer enter the sealed space 31.
[0036]
In addition, in such a small sealed space 31, the degree of dust being enclosed becomes extremely small when manufactured in a clean room, and the light receiving surface of the bare chip CCD 18 is not contaminated. Black lines are not generated and the image quality is improved. Incidentally, even when compared with the light quantity detecting member 11, the volume of the sealed space is reduced to about 1/30.
[0037]
It should be noted that the present invention is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the scope of the present invention.
[0038]
【The invention's effect】
As described above, according to the present invention, in an image reading apparatus that forms an image of reflected light from an original by light emitted from a light source on a bare chip CCD through an optical lens, the bare chip is provided inside the casing in which the light transmission portion is disposed. The light quantity detecting member that is hermetically sealed with the CCD is fixed to the image reading body provided with the optical lens by optical positioning, and the reflected light that has passed through the optical lens is imaged on the bare chip CCD through the light transmitting portion. With this configuration, the light quantity detection member can be fixed to the image reading body at the same time while performing two-dimensional adjustment in the X-axis direction and Y-axis direction and further adjustment in the Z-axis direction. Therefore, it is possible to reduce the time required for accuracy adjustment by manufacturing easily, thereby increasing the manufacturing yield. I was able to today.
[0039]
Further, in the present invention, by using a hermetically sealed light amount detection member, the degree of dust or dirt adhering to the light receiving surface of the bare chip CCD is reduced or eliminated, and thus, the read image can be reduced. An image reading apparatus with improved image quality could be provided.
[0040]
Furthermore, in the present invention, the sealed space of the hermetically sealed light quantity detection member can be made smaller, and thereby the degree of dust and dirt enclosed in the space is significantly reduced, and the light receiving surface of the bare chip CCD is contaminated. As a result, white and black streaks are not generated in the read image, and the image quality is remarkably improved.
[0041]
In addition, in the present invention, since the bare chip CCD is mounted on the circuit board, the analog processing circuit is provided on the circuit board, thereby shortening the distance between the two, thereby improving the S / N ratio. There is also.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a light amount detection member used in an image reading apparatus of the present invention.
FIG. 2 is a schematic cross-sectional view of the image reading apparatus of the present invention.
FIG. 3 is a schematic cross-sectional view of the image reading apparatus of the present invention.
FIG. 4 is a schematic cross-sectional view of a light amount detection member used in another image reading apparatus of the present invention.
FIG. 5 is a schematic cross-sectional view of another image reading apparatus of the present invention.
FIG. 6 is a perspective view illustrating a specific configuration of a main part of the image reading apparatus according to the present invention.
FIG. 7 is an exploded perspective view of a main part of the image reading apparatus of the present invention.
FIG. 8 is a schematic cross-sectional view of still another image reading apparatus of the present invention.
FIG. 9 is an exploded perspective view of a light amount detection member according to the present invention.
FIG. 10 is an explanatory diagram showing an adjustment method in the X-axis / Y-axis direction.
FIG. 11 is a schematic cross-sectional view of another conventional image reading apparatus.
FIG. 12 is a schematic cross-sectional view of another conventional image reading apparatus.
FIG. 13 is a time chart of an image signal by a conventional image reading apparatus.
[Explanation of symbols]
1, 9, 12, 14, 14a, 14b
Image reader 2, 10, 11, 15 Light quantity detection member 3, 17, 27 Circuit board 4, 16 Case 5, 5a Optical lens 6, 20, 31 Sealed space 7 CCD
8, 24 Document 18 Bare chip CCD
19, 29 Transparent substrate 21 Optical lens 22 Lens mounting housing 23 Base plate 25 Ceramic circuit boards p1, p2 Screwed portions

Claims (1)

光透過部が配設された筐体の内部にベアチップCCDを設けて気密封止した光量検出部材を、前記光学レンズと、該光学レンズが設けられたレンズ取着用筐体とから構成される画像読取本体に対し光学的位置決めでもって固定させ、光源の出射光による原稿からの反射光を、前記光学レンズ及び光透過部を順次通過させ、ベアチップCCDに結像せしめるように構成した画像読取装置において、
前記光量検出部材の筐体と前記画像読取本体のレンズ取着用筐体とが面接触しており、且つ前記レンズ取着用筐体の接触面には溝が形成されていることを特徴とする画像読取装置。
An image composed of the optical lens and a lens mounting housing provided with the optical lens, the light quantity detecting member hermetically sealed by providing a bare chip CCD inside the housing provided with the light transmitting portion. In an image reading apparatus configured to be fixed with respect to a reading main body by optical positioning, and reflected light from a manuscript by light emitted from a light source sequentially passes through the optical lens and the light transmitting portion and forms an image on a bare chip CCD . ,
An image characterized in that a housing of the light amount detecting member and a lens mounting housing of the image reading body are in surface contact, and a groove is formed on a contact surface of the lens mounting housing. Reader.
JP36592098A 1998-12-24 1998-12-24 Image reading device Expired - Fee Related JP3642692B2 (en)

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