JPH02177587A - プリント配線基板 - Google Patents

プリント配線基板

Info

Publication number
JPH02177587A
JPH02177587A JP33357288A JP33357288A JPH02177587A JP H02177587 A JPH02177587 A JP H02177587A JP 33357288 A JP33357288 A JP 33357288A JP 33357288 A JP33357288 A JP 33357288A JP H02177587 A JPH02177587 A JP H02177587A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
pattern
conductive paste
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33357288A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0515317B2 (enExample
Inventor
Yukio Tsuneki
常木　幸男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP33357288A priority Critical patent/JPH02177587A/ja
Publication of JPH02177587A publication Critical patent/JPH02177587A/ja
Publication of JPH0515317B2 publication Critical patent/JPH0515317B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
JP33357288A 1988-12-28 1988-12-28 プリント配線基板 Granted JPH02177587A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33357288A JPH02177587A (ja) 1988-12-28 1988-12-28 プリント配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33357288A JPH02177587A (ja) 1988-12-28 1988-12-28 プリント配線基板

Publications (2)

Publication Number Publication Date
JPH02177587A true JPH02177587A (ja) 1990-07-10
JPH0515317B2 JPH0515317B2 (enExample) 1993-03-01

Family

ID=18267542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33357288A Granted JPH02177587A (ja) 1988-12-28 1988-12-28 プリント配線基板

Country Status (1)

Country Link
JP (1) JPH02177587A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5488540A (en) * 1993-01-19 1996-01-30 Nippondenso Co., Ltd. Printed circuit board for reducing noise
JP2021089992A (ja) * 2019-12-05 2021-06-10 三菱電機株式会社 電力変換装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5488540A (en) * 1993-01-19 1996-01-30 Nippondenso Co., Ltd. Printed circuit board for reducing noise
JP2021089992A (ja) * 2019-12-05 2021-06-10 三菱電機株式会社 電力変換装置

Also Published As

Publication number Publication date
JPH0515317B2 (enExample) 1993-03-01

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