JPH02177568A - Semiconductor device transparent cover - Google Patents
Semiconductor device transparent coverInfo
- Publication number
- JPH02177568A JPH02177568A JP63333902A JP33390288A JPH02177568A JP H02177568 A JPH02177568 A JP H02177568A JP 63333902 A JP63333902 A JP 63333902A JP 33390288 A JP33390288 A JP 33390288A JP H02177568 A JPH02177568 A JP H02177568A
- Authority
- JP
- Japan
- Prior art keywords
- light blocking
- adhesive
- agent
- light
- property
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 abstract description 13
- 239000000049 pigment Substances 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 abstract 9
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 239000002981 blocking agent Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、固体撮像素子などの光電変換半導体装置やＦ
ＲＯＭ等の光学的窓が必要な半導体封止のパンケージと
して用いられる半導体装置用被覆体に係る。[Detailed Description of the Invention] <Industrial Application Field> The present invention is applicable to photoelectric conversion semiconductor devices such as solid-state image sensors,
The present invention relates to a covering for a semiconductor device that is used as a pancage for sealing a semiconductor such as a ROM that requires an optical window.
〈従来の技術〉 従来の技術につき簡単に説明する。<Conventional technology> The conventional technology will be briefly explained.
特開昭６１−１２０４６４には、ＣＣＯのキャップガラ
ス内面に遮光処理を行なう技術が述べられているが、そ
の形成方法も接着方法も記載がない。JP-A No. 61-120464 describes a technique for applying a light-shielding treatment to the inner surface of the cap glass of a CCO, but does not describe a method for forming it or a method for adhering it.
また、特開昭６２−２４９１０３には、遮光板に代わっ
てＣＣｏのカラーフィルターに黒色成型物をかぶせるの
みで、キャップガラスとの関わりはなにもない。Moreover, in JP-A-62-249103, a black molded material is simply placed over a CCo color filter in place of a light shielding plate, and there is no relationship with the cap glass.
また、特開昭６３−６２３５８には蒸着により被覆体に
金属遮光膜を形成する技術が述べられているがその金属
遮光膜自体やその蒸着工程の費用は無視出来ない、また
、接着手段は別にある構成となっている。In addition, Japanese Patent Application Laid-open No. 63-62358 describes a technique for forming a metal light-shielding film on a coating by vapor deposition, but the cost of the metal light-shielding film itself and the vapor deposition process cannot be ignored, and the adhesive method is not required separately. It has a certain configuration.
従って、現在に至ってもこの樟な半導体装置においては
、接着剤が設けられている透明被覆体とは別体の遮光板
を作成して予め内部に封入してのち透明被覆体をパッケ
ージ本体と接着して半導体装置を作成している。Therefore, even today, in this standard semiconductor device, a light-shielding plate separate from the transparent cover with adhesive is created and sealed inside beforehand, and then the transparent cover is bonded to the package body. Semiconductor devices are manufactured using these methods.
〈発明が解決しようとする課題〉
上述の従来例では工程的に透明被覆体の所望の接着部に
接着剤を印刷等の手段により付与する工程とともに、別
体として設けた遮光板をパッケージ本体に据付ける工程
と、透明被覆体をパッケージ本体に接着する工程とによ
る。従ってこの為の工程が多くなっているとともに部品
点数が二つ必要となっている。<Problems to be Solved by the Invention> In the conventional example described above, in addition to the step of applying an adhesive to the desired adhesive part of the transparent covering by means such as printing, a separate light-shielding plate is attached to the package body. The process involves the installation process and the process of gluing the transparent covering to the package body. Therefore, the number of steps for this is increased and two parts are required.
この状況ではもって、簡易な構造と工程とが望まれてい
た。Under these circumstances, a simple structure and process were desired.
〈課題を解決するための手段〉
上記の課題に鑑み、透明被覆体に遮光性と接着性を同時
に付与することとする。その具体的構成としては片面に
所望の接着側部分を含む所望の遮光性の接着剤が設けら
れている構成とする。<Means for Solving the Problems> In view of the above problems, we decided to simultaneously impart light-shielding properties and adhesive properties to the transparent coating. Specifically, a desired light-shielding adhesive including a desired adhesive side portion is provided on one side.
なお、透明被覆体の本体はガラスや透明樹脂もしくはそ
れらの複合物等の様に透明性があり、しかもある程度の
剛性がある材料ならどの櫓なものでも良い、また、遮光
性の接着剤は、接着剤自体が元来遮光性をもったもので
も良いが、遮光性がないか不完全な接着剤に遮光性の顔
料やインクを添加し、結果的に遮光性を持つものであれ
ば良い。The main body of the transparent covering may be made of any material that is transparent and has a certain degree of rigidity, such as glass, transparent resin, or a composite thereof.Also, the light-shielding adhesive may be The adhesive itself may originally have a light-shielding property, but it is sufficient if a light-shielding pigment or ink is added to an adhesive that does not have a light-shielding property or has an incomplete light-shielding property, resulting in a light-shielding property.
また、この接着剤を本体に付与する手段は、印刷、塗布
、浸漬後パターニング、プロット描画など、いかなる手
段を用いても良い。Further, the adhesive may be applied to the main body by any means such as printing, coating, patterning after dipping, and drawing a plot.
また、バ・ンケージ本体はセラミックのものでもプラス
チックモールド形式のものでも構わない。Further, the bun cage body may be made of ceramic or of a plastic mold type.
く作用〉
本発明の透明被覆体は、遮光性とともに接着性を持って
いて、しかも各々所望の部位には所望の性能を持ってい
る為に、それのみを接着するだけで半導体装置に遮光性
を付与を同時にする事が出来る。Effects> The transparent coating of the present invention has adhesive properties as well as light-shielding properties, and each desired part has the desired performance. can be granted at the same time.
〈実施例〉
本発明を固体撮像素子に適用した場合の実施例を図面を
用いて詳細に説明する。第１図は、本発明の一実施例を
示す半導体装置用透明ｍ覆体の平面図である。第２図は
、同パッケージ本体に接着した固体撮像素子の一部分解
斜視図である。<Example> An example in which the present invention is applied to a solid-state image sensor will be described in detail with reference to the drawings. FIG. 1 is a plan view of a transparent m-cover for a semiconductor device showing one embodiment of the present invention. FIG. 2 is a partially exploded perspective view of the solid-state imaging device adhered to the package body.
透明被覆体本体ｌは１３．Ｏｘ １４．５ Ｘ Ｏ，８
ｍのガラスの四隅を削ったものである。その片面の周囲
より１．２閣の間は所望の接着部分Ａであり、また、周
囲より４．Ｏａｓの間は所望の遮光部分Ｂである。The transparent covering body l is 13. Ox 14.5
It is made by cutting the four corners of a piece of glass. The desired adhesion part A is 1.2 meters from the periphery of one side, and 4. The area between Oas is a desired light-shielding portion B.
従って、この透明被覆体本体の片面の周囲より４゜０ｍ
ｓの間つまりＡ領域とＢ領域を含む領域に５０ないし１
２０μ厚だけ接着剤２が設けられている。この接着剤は
、加熱溶解性でしかも耐水性のエポキシ樹脂系接着剤に
カーボンの粉を混入したものである。この製造方法とし
ては、スクリーン印刷により透明被覆体本体１に接着剤
２を付与する技術を用いた。Therefore, 4°0m from the periphery of one side of the transparent covering body.
50 to 1 in the area between s, that is, including area A and area B.
The adhesive 2 is provided with a thickness of 20μ. This adhesive is a heat-soluble and water-resistant epoxy resin adhesive mixed with carbon powder. As this manufacturing method, a technique was used in which the adhesive 2 was applied to the transparent covering body 1 by screen printing.
尚、この様にして出来上がった半導体装置用透明被覆体
はパッケージ本体３の所望部に加圧加熱（例えば１〜２
Ｋｇ／ｃｎｆ、１２０〜１５０℃） して接着する。尚
、上述例はＣＣＯ固有の要求性能の為完全に封着する事
が求められたものであるが、他の例では必ずしもここま
で完全に封着しな（ても良い場合もある。また、パッケ
ージ本体の材質によっても適宜変形適用する必要もある
。The transparent covering for a semiconductor device thus completed is heated under pressure (for example, 1 to 2
Kg/cnf, 120-150°C) and adhere. In addition, in the above example, complete sealing was required due to the required performance specific to CCO, but in other examples, it may not be necessary to seal completely to this extent. Also, It is also necessary to make appropriate modifications depending on the material of the package body.
〈発明の効果〉
本発明により部品点数が少なくない、しかも工程数が削
減され材料費も大幅な削減となった。<Effects of the Invention> The present invention has not only reduced the number of parts, but also reduced the number of steps, resulting in a significant reduction in material costs.
第１図は、本発明を固体撮像素子に適用した場合の実施
例の平面図である。第２図は、同パッケージ本体に接着
した固体撮像素子の一部分解斜視図である。
ｌ・・・透明被覆体本体
２・・・接着剤
３・・・固体撮像素子パッケージ本体
Ａ・・・所望の接着部分
Ｂ・・・所望の遮光部分
特 許 出 願 人
凸版印刷株式会社
代表者 鈴木和夫FIG. 1 is a plan view of an embodiment in which the present invention is applied to a solid-state image sensor. FIG. 2 is a partially exploded perspective view of the solid-state imaging device adhered to the package body. l...Transparent covering body 2...Adhesive 3...Solid-state imaging device package body A...Desired adhesive portion B...Desired light-shielding portion Patent applicant Representative of Toppan Printing Co., Ltd. Kazuo Suzuki
Claims (1)
光性の接着剤が設けられている半導体装置用透明被覆体
。(1) A transparent covering for a semiconductor device in which a light-shielding adhesive is provided on one side of a desired light-shielding portion including a desired adhesive portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63333902A JPH0744261B2 (en) | 1988-12-28 | 1988-12-28 | Transparent coating for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63333902A JPH0744261B2 (en) | 1988-12-28 | 1988-12-28 | Transparent coating for semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02177568A true JPH02177568A (en) | 1990-07-10 |
| JPH0744261B2 JPH0744261B2 (en) | 1995-05-15 |
Family
ID=18271229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63333902A Expired - Lifetime JPH0744261B2 (en) | 1988-12-28 | 1988-12-28 | Transparent coating for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744261B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002118188A (en) * | 2000-10-10 | 2002-04-19 | Sanyo Electric Co Ltd | Semiconductor device and method of manufacturing the same |
| JP2002118192A (en) * | 2000-10-10 | 2002-04-19 | Sanyo Electric Co Ltd | Semiconductor device and method of manufacturing the same |
| JP2009060113A (en) * | 2007-08-30 | 2009-03-19 | Osram Opto Semiconductors Gmbh | Housing comprising housing underpart |
| JP2013254914A (en) * | 2012-06-08 | 2013-12-19 | Hamamatsu Photonics Kk | Position detector |
| JP2014142644A (en) * | 2014-02-12 | 2014-08-07 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9203923B2 (en) | 2001-08-15 | 2015-12-01 | Qualcomm Incorporated | Data synchronization interface |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63149553U (en) * | 1987-03-23 | 1988-10-03 | ||
| JPH01140837U (en) * | 1988-03-22 | 1989-09-27 |
-
1988
- 1988-12-28 JP JP63333902A patent/JPH0744261B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63149553U (en) * | 1987-03-23 | 1988-10-03 | ||
| JPH01140837U (en) * | 1988-03-22 | 1989-09-27 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002118188A (en) * | 2000-10-10 | 2002-04-19 | Sanyo Electric Co Ltd | Semiconductor device and method of manufacturing the same |
| JP2002118192A (en) * | 2000-10-10 | 2002-04-19 | Sanyo Electric Co Ltd | Semiconductor device and method of manufacturing the same |
| JP2009060113A (en) * | 2007-08-30 | 2009-03-19 | Osram Opto Semiconductors Gmbh | Housing comprising housing underpart |
| JP2013254914A (en) * | 2012-06-08 | 2013-12-19 | Hamamatsu Photonics Kk | Position detector |
| JP2014142644A (en) * | 2014-02-12 | 2014-08-07 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0744261B2 (en) | 1995-05-15 |
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