JPH0217481Y2 - - Google Patents
Info
- Publication number
- JPH0217481Y2 JPH0217481Y2 JP1984167273U JP16727384U JPH0217481Y2 JP H0217481 Y2 JPH0217481 Y2 JP H0217481Y2 JP 1984167273 U JP1984167273 U JP 1984167273U JP 16727384 U JP16727384 U JP 16727384U JP H0217481 Y2 JPH0217481 Y2 JP H0217481Y2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- substrate
- pellets
- loading
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 54
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 230000002950 deficient Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167273U JPH0217481Y2 (ko) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167273U JPH0217481Y2 (ko) | 1984-11-02 | 1984-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183038U JPS6183038U (ko) | 1986-06-02 |
| JPH0217481Y2 true JPH0217481Y2 (ko) | 1990-05-16 |
Family
ID=30725074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984167273U Expired JPH0217481Y2 (ko) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217481Y2 (ko) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164545A (en) * | 1980-05-21 | 1981-12-17 | Hitachi Ltd | Pellet bonding inspection and device therefor |
| JPS5715429A (en) * | 1980-07-02 | 1982-01-26 | Hitachi Ltd | Apparatus for mounting pellet |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57173339U (ko) * | 1981-04-28 | 1982-11-01 |
-
1984
- 1984-11-02 JP JP1984167273U patent/JPH0217481Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164545A (en) * | 1980-05-21 | 1981-12-17 | Hitachi Ltd | Pellet bonding inspection and device therefor |
| JPS5715429A (en) * | 1980-07-02 | 1982-01-26 | Hitachi Ltd | Apparatus for mounting pellet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6183038U (ko) | 1986-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6780734B2 (en) | Wafer table and semiconductor package manufacturing apparatus using the same | |
| CN113600505A (zh) | 一种传感器元件检测分选设备 | |
| CN209738472U (zh) | 一种离型膜分离设备 | |
| JPH0725463B2 (ja) | 半導体装置の製造方法 | |
| CN114335253A (zh) | 一种硅片取放装置及取放方法 | |
| JPH0217481Y2 (ko) | ||
| JP3275743B2 (ja) | チップの実装装置 | |
| JP2001156083A (ja) | 半導体装置の製造方法およびダイボンディング装置 | |
| JP3570126B2 (ja) | チップの実装装置 | |
| CN210579503U (zh) | 一种包边机传动机构 | |
| JPH05152418A (ja) | チツプピツクアツプ装置 | |
| JPH0563057A (ja) | 半導体製造装置 | |
| US5474228A (en) | External lead bonding method and apparatus | |
| KR100257397B1 (ko) | 리드 프레임의 세정방법 및 그 장치 | |
| JPS6317249Y2 (ko) | ||
| JP3712695B2 (ja) | 半導体組立装置における製品供給装置 | |
| JPH03192753A (ja) | ウエハブレーキング装置 | |
| CN114918157B (zh) | 一种蓝膜分选机及分选方法 | |
| JPH0697209A (ja) | 半導体ペレットボンディング方法 | |
| JP2639953B2 (ja) | 半導体製造装置 | |
| JPH0697267A (ja) | フィルム剥離・洗浄装置 | |
| KR0145126B1 (ko) | 반도체 장비의 대형칩용 플렌지 업 스테이지 | |
| JPS644339B2 (ko) | ||
| JPH05211184A (ja) | ダイボンディング装置 | |
| JPH0570932B2 (ko) |