JPH02174197A - Cooling structure for electronic device - Google Patents

Abstract

PURPOSE:To uniformly distribute cooling air to the whole interior of an electronic device and to prevent cooling capacity from decreasing by mounting a shielding plate on the front face of a testing printed board package or unmounted part closing plate, and providing a flow rate regulating plate extending substantially perpendicular to a direction in which the cooling air flows on the surface. CONSTITUTION:A shielding plate 11 is mounted on the front face of a testing printed board package 1a to be inserted into a shelf 6 or an unmounted part blocking plate 1b to be inserted into an unmounted position instead of an electronic circuit printed board package 1. The flowing resistance of cooling air passing over the surface of the testing printed board package 1a of an unmounted part closing plate 1b is arbitrarily regulated by a flow rate regulating plate 20 extending substantially perpendicularly to a direction in which the cooling air flows on the surface. Thus, the packages 1a, 1b not placed with electronic components can be set to the equivalent state at the point of supplying the cooling air to the electronic circuit printed board package 1 placed with the electronic components.

Description

[Detailed Description of the Invention] [Summary] A plurality of electronic circuit printed board packages in which electronic components are mounted on printed boards are inserted and arranged on a shelf at intervals to constitute an electronic device, and the electronic circuit printed board Regarding the cooling structure of electronic devices that cools the electronic device by forcing cooling air to flow between the packages, if a test package or unmounted part closing plate is inserted in place of the electronic circuit printed board package, the mounting of normal electronic components The purpose of this test is to obtain the same ventilation condition, that is, cooling capacity, as when inserting a printed circuit board package with a
) is provided with a shielding plate on the front surface thereof, and a flow regulating plate extending substantially perpendicularly to the direction in which the cooling air flows is provided on the surface thereof.

[Industrial application field]

The present invention relates to a cooling structure for an electronic device that accommodates a plurality of electronic circuit printed board packages in which electronic components are mounted on printed boards, and in particular, a cooling structure for an electronic device that accommodates a plurality of electronic circuit printed board packages in which electronic components are mounted on printed boards, and in particular, a cooling structure for an electronic device that accommodates a plurality of electronic circuit printed board packages in which electronic components are mounted on a printed board, and in particular, a test printed board package or an unmounted part closing plate in place of a normal printed board package. Regarding the cooling structure when inserted.

In recent years, electronic circuits in communication and information equipment have rapidly become faster and more dense, and the amount of heat generated by the equipment is increasing. For this reason, as a cooling method, forced cooling is generally adopted from the viewpoint of maintainability, economy, etc. When such forced cooling is performed, it is required to uniformly distribute cooling air throughout the interior of the electronic device to prevent the cooling capacity from decreasing.

[Conventional technology]

The conventional electronic device has a printed board 2 as shown in FIG.
A plurality of electronic circuit printed board packages 1 each having a plurality of electronic components 3 such as ICs and LSIs mounted therein, and a plurality of electronic circuit printed board packages 1 each having a connector 4 and a front plate 5 attached thereto are inserted and arranged in parallel in a column within a shelf 6 to form an electronic device 10. and this electronic device 10
A fan unit 8 composed of the fan 7 is installed on the top of the
Attach the fan 7 to the gap between the printed circuit board package 1.
Cooling is performed by forcing air to flow from the bottom to the top. The front surface of the shelf 6 is closed by the front plate 5 of the inserted printed board package 1 to prevent air from flowing in and out.

When a failure occurs in the electronic circuit printed board package 1, in order to investigate the failure, as shown in Figure 6, the electronic circuit printed board package (printed board package under test) 1 that is thought to be the cause of the failure is placed on a test printed board. package 1a
to investigate the problem. This test printed board package 1a has wiring for connection (not shown) and connectors for connection at the front and rear ends.

Therefore, the printed circuit board package 1 under test is pulled out to the front of the shelf 6 and is in the same state as if it were connected to the backboard connector 6b, and fault investigation and testing are performed in this state. Note that 6a is a backboard on the back surface of the shelf 5, and 6b is a backboard connector that fits into the connector 4 (FIG. 5) of the electronic circuit printed board package 1.

Further, in the unmounted portion of the shelf 6 where no electronic circuit printed board package is inserted, an unmounted portion closing plate 1b consisting of a simple plate is inserted in order to prevent air leakage. This unmounted portion closing plate 1b also has a similar front plate 5.

[Problem to be solved by the invention]

In the conventional electronic device as described above, since the electronic device 10 is forcedly cooled, external air flows in from the front of the test printed circuit board package 1a, reducing the overall cooling capacity of the electronic device 10 and reducing the test printed board package 1a. Printed board package 1a
The temperature of the electronic circuit printed board package 1 adjacent to the electronic circuit board package 1 increases, causing a secondary failure. In addition, since the electronic circuit printed board package 1 has different shapes and quantities of electronic components such as ICs and LSIs in each package, when the test package 1a is mounted, the electronic circuit printed board package 1 may be different from the original mounted package. Not all of the electronic circuit printed board packages 1 in the device 10 are mounted, and may be mounted later due to the addition of functions, or may be "empty" without being mounted in the first place (unmounted with no components mounted). Mounting part closing plate 1b
In such a case, the ventilation resistance inside the electronic device 10 is extremely different from that of other electronic circuit printed board packages 1, and there is a problem that the cooling capacity of the entire electronic device 10 is reduced.

Therefore, in the present invention, when inserting a test printed board package or when inserting an unmounted blocking board, the same ventilation condition, that is, the same cooling capacity as when inserting a normal electronic circuit printed board package, can be achieved. The purpose is to provide a cooling structure that can

[Means to solve the problem]

In order to solve such problems, in the present invention, as shown in FIG. is opened and inserted and placed on the shelf (6) to configure the electronic device (10), and the electronic circuit printed board package (
1) In a cooling structure for an electronic device in which cooling air is forced to flow between the electronic device and the electronic device, the test printed board package (1a) is inserted into the shelf (6) instead of the electronic circuit printed board package (1). ) or a shielding plate (11) is attached to the front surface of the unmounted part closing plate (1b) to be inserted into the unmounted part, and a flow rate adjustment plate (20) extending approximately perpendicular to the direction in which the cooling air flows is provided on the surface. A cooling structure for an electronic device is provided.

[For production]

According to the present invention, the test printed board package (1a) or the unmounted portion closing plate (1b) is
By arbitrarily adjusting the flow resistance of the cooling air passing over the surface of the package, these packages without electronic components can be cooled with the original electronic circuit printed board package (1) with electronic components mounted. Equivalent conditions can be set in terms of air supply.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 4. First, in FIG. 1, there is a fan unit 8 having a fan 7 on the top of the electronic device 10, and cooling air is forced to flow from the lower shelf 6 to the upper shelf 6 for cooling. On the upper shelf 6, there is a test printed board package 1 for fault investigation.
The middle shelf 6 is connected to the backboard connector 6b through the backboard connector 6b, and the middle shelf 6 is inserted with an ordinary electronic circuit printed board package 1, and the lower shelf 6 is filled with unmounted parts in the empty areas. A state in which the plate 1b is inserted is shown.

Test printed board package 1a and unmounted part closing plate 1
A leakage/inflow prevention plate (shielding plate) 1 is provided on the front surface of b to prevent external air from flowing into the shelf 6 from the front surface of the shelf 6 or from cooling flowing out to the outside of the shelf 6.
Install 1. The shape of this shielding plate 11 is that of a normal electronic circuit printed board package (printed board package under test).
This is similar to the front plate 5 of No. 1. Further, on the surfaces of the test printed board package 1a and the unmounted portion closing plate 1b, a flow 1iJ1 straightening plate 20 extending in a direction substantially perpendicular to the direction in which the cooling air flows, that is, in a horizontal direction, is attached perpendicular to the package surface. The flow rate adjusting plate 20 is composed of a fixed plate 21 and a movable plate 22, as will be described in detail later.

FIG. 2 shows an embodiment of the test printed board package 1a. Inside, there is a flow rate regulating plate 31 having a width equivalent to one printed board package and a plurality of ventilation holes 31a fixed so as to function at all times. Similarly, a plurality of ventilation holes 32 are set to an arbitrary width (n crosspiece width) according to the mounting width of the package.
A movable flow regulating plate 32 having a shape is pivotally mounted. When the printed board package to be tested is one sheet wide or when not in use for other reasons, this movable flow rate adjustment plate 32 is rotated upward so as not to obstruct the flow path of the cooling air. It is rotated to a position where it overlaps the fixed width flow rate adjusting plate 31. At this time, the movable flow rate adjusting plate 32
The longitudinal holes 32b provided in the single-width fixed flow rate adjustment plate 31 are prevented from blocking the air circulation holes 31a.

A single-width shielding plate 13 with a holding spring 33 attached is always fixed on the front surface, and a movable shielding plate with an arbitrary width (n crosspiece width) corresponding to the mounting width of the printed circuit board package to be tested is mounted on the front surface. 14 are pivotally mounted. When this movable shielding plate 14 is not in use, it faces forward so as not to interfere with tests, etc., and when in use, it is rotated to a position where it overlaps the front part of the one-width shielding plate 15 (in addition, The movable shielding plate 14 has a main part that overlaps with the one-width fixed shielding plate 13 cut out (or can be cut out) to prevent air from flowing into and out of the shelf.The holding spring 33 is a movable flow rate adjusting plate. 32 in the upwardly rotated position, and the adjusting screws 15 and 34 are used to adjust the flow rate as described later.
9 is a rail for inserting a printed board package to be tested (not shown), and 36 and 37 are connectors located at the front and rear of the test printed board package 1a.

FIG. 3 shows an embodiment of the unmounted portion closing plate 1b.

A flow regulating plate 20 having a width equivalent to one printed board package is provided inside, and a shielding plate 11 having a width corresponding to one printed board package is provided at the front.
is provided.

FIG. 4 shows the structure of the flow HJM straightening plate 20. As mentioned above, this flow rate adjusting plate 20 has ventilation holes 21a and 22a of the same size.
It consists of a fixed plate 21 and a movable plate 22. Movable plate 2
Both ends of the movable plate 22 are fitted into rail grooves 24 on both sides of the fixed plate 21, and the movable plate 22 can be moved back and forth using adjustment screws 23 attached to the shield plate 11 so that adjustment can be made from the front of the shield plate 11. The opening area between the ventilation holes 21a and 22a is
In other words, the flow resistance can be adjusted. A flow rate adjustment mechanism similar to this is also provided on the unmounted portion closing plate 1b and on the one-width flow rate adjustment plate 31 of the test printed board package 1a.
Needless to say, the present invention can also be used for the n-bar width flow rate adjusting plate 32.

According to the above embodiment, the test printed board package (
1a) or the unmounted portion closing plate (1b) can be arbitrarily set, and it can also be applied when testing electronic circuit printed board packages with different mounting widths.

〔Effect of the invention〕

As described above, according to the present invention, the flow HII straightening plate (20)
The flow resistance of the cooling air passing over the surface of the test printed circuit board package (1a) or the unmounted part closing plate (1b) can be adjusted as desired, and the shielding plate (11) can be used to control the flow of air at the front of the shelf. Since leakage can be prevented, the ventilation resistance becomes equivalent to that of the original electronic circuit printed board package, and the cooling capacity of the entire electronic device 10 can be maintained at the desired state.

[Brief explanation of the drawing]

FIG. 1 and a longitudinal sectional view of a cooling structure for an electronic device according to the present invention,
Fig. 2 is a perspective view of an embodiment of the printed board package for testing, Fig. 3 is a perspective view of an embodiment of the unmounted part closing plate, and Fig. 4 (
a), (b), and (c) are perspective views, cross-sectional views (when opened), and cross-sectional views (when narrowed down) of the flow rate adjustment mechanism, and Figures 5 (a) and (b) are conventional cooling structures for electronic devices. FIGS. 6(a) and 6(b) are a perspective view and a longitudinal sectional view of a conventional test printed board package and an unmounted portion closing plate. l...Electronic circuit printed board package, (tested printed board package) 2... Printed board, 3... Electronic component, 6.
...Shelf, 1a...Test printed board package, lb...Unmounted part closing plate, 11...Shielding plate, 20...Flow i! Adjustment plate, 21... fixed plate, 22... movable plate,
23... Adjustment, 31... Single width flow rate adjusting plate, 32... N crosspiece width flow rate adjusting plate, 13... Bow crosspiece width shielding plate, 14... Crosspiece width shielding plate. Cross-sectional view (b) (a) Cooling structure of electronic device (conventional example) 2... Printed board 61φ Shelf 7... Fan

Claims (1)

[Claims] 1. An electronic device (10) is created by inserting and arranging a plurality of electronic circuit printed board packages (1), each of which has electronic components (3) mounted on a printed board (2), at intervals on a shelf (6).
In the cooling structure for an electronic device, which cools the electronic circuit printed board package (1) by forcing cooling air to flow between the electronic circuit printed board packages (1).
Instead, a shielding plate (11) is attached to the front of the test printed circuit board package (1a) inserted into the shelf (6) or the unmounted part closing plate (1b) inserted into the unmounted part, and cooling air is placed on the surface. A cooling structure for an electronic device, characterized in that a flow rate adjusting plate (20) is provided that extends substantially perpendicularly to the flow direction of the electronic device.