JPH02172244A - Apparatus for bonding and curing - Google Patents

Abstract

PURPOSE:To reduce blow-out of gas containing organic component from a bonding window to prevent increase in H2 concentration by providing a gas exhausting means for exhausting from a sample transfer passage gas containing organic component generated from a sample by heating a heat block. CONSTITUTION:Covers 50, 51 are fixed to a top surface of a housing 10 so that a heat block 11 is covered on the left (loader) side and the right (unloader) side of a shielding plate 34. On a lower surface of the cover 50, grooves 50e, 50f are formed perpendicular to a sample transfer passage 53 at an inlet and an outlet of the sample transfer passage 53 formed by the housing 10 and the cover 50. In addition, a groove 50g is also formed at the side of the groove 50e adjacent to the groove 50f, while the groove 50g is provided with a pipe 56 for exhausting gas. At the time of bonding, therefore, most of gas containing organic component generated from the sample is exhausted by the gas exhausting means. This reduces organic component blown out from a bonding window, thereby preventing increase in H2 concentration.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a bonding device for performing wire bonding or die bonding on a sample 4 made of an easily oxidized material, and a curing device for curing a die-ponded sample. Regarding equipment.

[Prior Art] The case of wire bonding will be described below as an example. Materials that are easily oxidized 1 For example, when a copper-based material is used for the substrate (including lead frame) itself or the leads formed on the substrate, the substrate of the sample is heated as shown in Japanese Patent Publication No. 53-9838. The upper part of the heat block is covered with a cover to form a sealed sample transport path, and a reducing gas, an inert gas, or a mixture of reducing gas and inert gas (hereinafter referred to as reducing gas) is injected into the sample transport path. ), and the sample is pumped through a bonding window formed in the cover to prevent the sample from becoming disfigured.

Furthermore, as shown in Japanese Patent Application Laid-Open No. 59-25232, a shielding plate covering the cover and having a bonding window formed thereon is
There is also known a device in which the pounding tool is interlocked with an XY child table that drives the pumping tool in the XY force directions.

[Problems to be Solved by the Invention] In the prior art described above, most of the reducing gas supplied into the sample transport path flows out through the pumping window.

By the way, the organic resin applied to the substrate material, the Badmark River ink applied to the die, and the organic components in the adhesive for the die material are heated by the heat block and evaporated. As this organic component blows out from the bonding window together with the reducing gas, the organic component adheres to the components above the bonding window, such as the camera, the bonding tool, and the clamper, contaminating the camera and the wire path. .

If Ja components adhere to the lens surface of a camera, image recognition defects will occur. Furthermore, if organic components adhere to the components of the wire path, the wire will not be fed smoothly, resulting in a defective wire loop shape and wire breakage.

Therefore, in the past, it was necessary to clean the camera and wire path components about once a day.

In addition, when N2 H2 gas is used as the reducing gas, most of the gas in the sample transport path is blown out from a small bonding window that is large enough for bonding, so the H3N2 gas near the bonding window is becomes high and dangerous.

An object of the present invention is to provide a pumping device and a curing device that can reduce the blowing out of gas containing organic components from a pumping window and prevent an increase in H2 concentration.

[Means for Solving the Problems] The above object is achieved by providing a gas exhaust means for exhausting gas containing organic components generated from the sample by heating the heat block from the sample transport path.

[Function] When applied to a pumping device, most of the gas containing organic components generated from the sample by heating the heat block is exhausted by the gas exhaust means, so the amount of organic components blown out from the pumping window is reduced. . This will not have a negative effect on ponding, and
The number of cleaning times is drastically reduced.

Furthermore, when applied to a curing device, the gas containing organic components is not released into the atmosphere from the inlet/outlet portion 11 of the curing device, so that the surrounding environment will not be deteriorated.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 4. In this embodiment, as shown in FIG. 3 (3a, 3b, 3c
, 3d, 3e), the die 3
The case is shown in which the present invention is applied to a wire bonding device that connects a wire to a pad and a lead 1.

First, the same parts as in the conventional example will be explained, then a structure that is not conventionally known but has nothing to do with the features of the present invention will be explained, and finally, an embodiment of the structure that is a feature of the present invention will be explained.

First, a known structure will be explained. The samples 4 are positioned and mounted on a carrier 5 at equal intervals, and in the housing 10 in which guide grooves 10a are formed to guide both sides of the carrier 5, there is a heat block 11 that is driven vertically by a vertical driving means (not shown). is installed. The carrier 5 is pitch-fed by inserting the feed pawl 12 therein. This feed claw 12 is fixed to a claw lever 13 that is driven vertically and in the X direction by a drive means (not shown). In addition, the heat block 11
A sample holding plate 14 having a sample holding part 14a to be pressed is provided, and this sample holding plate 14 is moved up and down by a driving means (not shown).

A pumping head 20 is disposed on the side of the housing 10 corresponding to the sample holding plate 14, and a pumping arm 22 (not shown) to which a pumping tool 21 is fixed to one end is attached to the pumping head 20. It is provided so that it can be driven up and down by a vertical drive means. Further, a camera support arm 23 is fixed to the pounding head 20, and a television camera 24 is fixed to the camera support arm 23, which is offset from the pounding tool 21 by a certain distance in the X direction. The bonding head 20 is fixed on an XY child table 5 having a well-known structure. In the XY child table 5, the lower stage is a Y table 26 that is driven in the Y direction, and the upper stage is an X table 27 that is driven in the X direction.

Next, a structure which is not conventionally known but is not related to the features of the present invention will be explained. Rollers 30.31 are disposed on both sides of the housing 10 corresponding to the sample holding plate 14, and both sides of the rollers 30.31 are rotatably supported by roller support plates 32.33 fixed to the housing 10. has been done. Here, the rollers 30 and 31 are disposed such that their upper surfaces match the upper surface of the sample holding plate 14 or are located slightly below the upper surface of the sample holding plate 14. A shielding plate 34 made of a bendable thin plate is hung over the rollers 30,31. One end of the shielding plate 34 is fixed to the Y table 26 of the xY table 25 through a roller 35 rotatably supported by the roller support plate 33. One end of a spring 36 is hung on the other end of the shielding plate 34, and the other end of the spring 36 is fixed to a fixed part of the device, and the spring hook is hung on a bottle 37. A small bonding window 34 necessary for wire bonding of one die 3 is provided in the shielding plate 34 at a portion corresponding to the bonding tool 21.
a is formed.

Next, an embodiment of the structure which is a feature of the present invention will be described. Covers 50 and 51 are fixed to the upper surface of the housing IO so as to cover the heat block 11 on the left side (loader side) and the right side (unloader side) of the shielding plate 34. The cover 50.51 has sliding surfaces 50a and 5La on which the lower surface of the shielding plate 34 slides.
are provided, and eaves portions 50b, 51b are provided at the tips of the slide surfaces 50a, 51a. Further, the cover 50, 51 is formed with claw relief holes 50c, 51c into which the feed claws 12 are inserted.

A slide groove 50d is formed in the cover 50 along the pawl escape hole 50c, and a slide plate 52 is slidably disposed in the slide groove 50d. Further, a pawl insertion hole 52a into which the feed rL t 2 is inserted is formed in the slide plate 52, and the feed pawl 12 is inserted into the pawl escape hole 50c through this pawl insertion hole 52a.

The lower surface of the cover 50 includes the housing 10 and the cover 5.
Grooves 50e and 50f are formed perpendicularly to the sample transport path 53 on the inlet and exit sides of the sample transport path 53 formed by the gas supply pipes 54 and 50, respectively.
55 are arranged. Further, the groove 50f is adjacent to the groove 50f.
A groove 50g is also formed on the e side, and a gas exhaust pipe 56 is disposed in this groove 50g. The gas supply pipe 54 is formed with a gas ejection hole 54a directly below and diagonally downward in the inlet side direction, and the gas supply pipe 55 is similarly formed with a gas ejection hole 54a.
Gas ejection holes 55a are formed directly below and laterally downward in the direction toward the outlet, and gas suction holes 56a are formed in the gas exhaust pipe 56 directly below and diagonally downward in the direction toward the inlet.

A concave gas reservoir chamber 50h is provided on the upper surface of the cover 50 between the gas supply pipe 54 and the gas exhaust pipe 56.
A large number of gas ejection holes 50i penetrating the sample transport path 53 are formed in this gas reservoir chamber 50h. In addition, a cover 5 is installed so as to cover the gas reservoir chamber 50h.
A cover 57 is fixed to the cover 57, and a gas supply pipe 58 for supplying reducing gas to the gas reservoir chamber 50h is fixed to the cover 57.

Next, the operation of the pounding device having the above configuration is performed in the fifth step.
This will be explained with reference to the figures.

First, the operation of the configuration, which is a feature of the present invention, will be explained. Reducing gas is supplied to the gas supply pipes 54, 55, 58 from the outside. Further, a suction means for sucking from the outside is connected to the gas exhaust pipe 56. The reducing gas supplied to the gas supply pipe 54 is ejected into the sample transport path 53 from the gas ejection hole 54a, and a portion flows to the inlet side of the sample transport path 53 to prevent air from entering from the inlet side. A part of the sample transport path 53 is made into a gas atmosphere. Similarly, the reducing gas supplied to the gas supply pipe 55 is ejected into the sample transport path 53 from the gas ejection hole 55a, and a portion flows into the pumping window 34a to prevent air from entering through the pumping window 34a. However, a part of the sample transport path 53 is made into a gas atmosphere. The reducing gas supplied to the gas supply pipe 58 enters the gas reservoir chamber 50h and is ejected from the gas ejection hole 50t to the sample transport path 53, creating a gas atmosphere inside the sample transport path 53.

By the way, as explained in the section on problems to be solved by the invention, the organic components generated when the sample 4 is heated are transferred to the bonding window 34a together with the reducing gas in the sample transport path 53.
However, before that, it is exhausted from the gas suction hole 56a of the gas exhaust pipe 56. Therefore, the amount of organic components blown out from the pumping window 34a is reduced.

As a result, almost no organic components adhere to the lens at the tip of the camera 24, the wire clamper, etc., allowing clear detection, and there is no wire breakage or wire looseness caused by dirt on the clamp surface, and good wire bonding is possible. . In addition, the number of times cleaning for dirt can be done once a month is greatly reduced.

Next, the operation of configurations unrelated to the features of the present invention will be explained. The explanation will be made starting from a state in which the television camera 24 is positioned above the bonding center line 60 shown in FIG.

That is, the television camera 24 is connected to the bonding tool 21 and
Since the TV camera 24 is offset by a certain distance in the direction shown in FIG.
It is located above a.

First, while the heat block 11 is in a lowered state, the carrier 5 is fed one pitch at a time by the feeding claw 1z, and as shown in FIG. 5(a).
As shown in FIG.
When is located on the pounding center line 60, Y
As the table 26 is moved in the Y direction, the television camera 24 is positioned above the die 3a that will be pounded first. In this case, since one end of the shielding plate 34 is fixed to the Y table 26, it moves together with the movement of the Y table 26 in the Y direction as described above. That is, the shielding plate 34
The bonding window 34a is also located above the die 3a to be bonded first.

Further, as described above, when the carrier 5 is sent and the first die 3a to be pounded is positioned at the pounding center line 60, the heat block 11 is raised and the sample 4 is pressed against the sample holding plate 14 and clamped. be done. The sample 4 is clamped and the television camera 2 is
4 is positioned above the first die 3a to be bonded, the pattern of the die 3a portion is detected by the television camera 24 through the bonding window 34a.

The position of the pounding point is corrected by a calculation device (not shown).

Next, the pounding tool 21 is attached to the die 3a.

That is, the X table 27 is driven by the offset distance between the pounding tool 21 and the television camera 24 so as to be located above the pounding window 34a. Then, in the bonding tool 21, the XY child table 5 is driven according to the corrected bonding data of the die 3a portion, and wires are connected to the pads of the die 3a and the leads 1. Since this wire connection method is well known, detailed explanation thereof will be omitted.

When the wire bonding of the die 3a part is completed,
Next, as shown in FIG. 5(b), the Y table 26 is driven in the Y direction so that the television camera 24 and the bonding window 34a are positioned above the second die 3b. As described above, the pattern of the die 3b portion is detected through the bonding window 34a, and the position of the bonding point is corrected by an arithmetic unit (not shown). Thereafter, as described above, the X table 27 is driven by the offset distance between the pounding tool 21 and the television camera 24 so that the pounding tool 21 is positioned above the die 3, that is, the pounding window 34a. Then, in the bonding tool 21, the XY table 25 is driven according to the corrected bonding data for the die 3b portion, and wire bonding is performed for the die 3b portion.

Next, the heat block it is lowered to release the clamp on the sample 4. After that, the carrier 5 is sent one pitch, the third die 3C is sent onto the bonding center line 60, and then the heat block 11 is raised in the same way as described above, and the television camera 24 and the bonding window 34a are moved in the Y direction. The die 3c is positioned above the die 3c.
patterns are detected. Thereafter, the bonding tool 21 is driven in the X direction and positioned above the die 3C in the same manner as described above, and wire bonding is performed on the die 3C. This completes the wire bonding of one sample 4. Thereafter, wire bonding of the next sample 4 is performed by repeating the same operation as described above.

In the above embodiment, a case where the present invention is applied to a wire bonding device has been described, but the present invention can also be applied to a die bonding device for bonding a die 3 onto a substrate 2. In this case, it goes without saying that the pounding tool 21 needs to be configured to attract the die 3 using a vacuum device.

Also when applied to die-ponding equipment.

This prevents the camera from getting dirty and the suction part of the pounding tool from getting dirty.

In addition, although the case where the sample 4 is placed on the carrier 5 and the carrier 5 is sent has been explained, if the substrate 2 is long, such as a lead frame, and does not need to be attached to the carrier 5, the substrate 2 itself may be sent. You may also do so.

In addition, although the case where the sample holding plate 14 is provided has been explained,
Depending on the type of sample 4, the sample holding plate 14 may not be provided.

Furthermore, a structure in which the cover 50.51 is fixed to the housing 10 has been described.
1 may be fixed.

Furthermore, although the case where the shielding plate 34 is provided has been described, the shielding plate 34 may not be provided and a bonding window of a size necessary for bonding may be provided in the cover 50, 51.
It goes without saying that the covers 50 and 51 may be a single member.

Further, as a gas supply means for creating a gas atmosphere in most of the sample transport path 53, the gas is supplied to the gas reservoir chamber 50h and is ejected from the gas ejection hole 50i. A large number of gas supply pipes may be provided.

The present invention can be applied to a curing device for curing a sample 4 having a die 3 attached to a substrate 2, and also to a wire bonding device with a curing device in which a curing device and a wire bonding device are combined in a line.

[Effects of the Invention] As is clear from the above explanation, according to the pumping device of the present invention, organic components generated in the sample transport path are exhausted without blowing out from the pumping window.
Adhesion to the camera and bonding components is prevented, stable bonding is possible, and the number of cleanings is reduced. Also, even if N2 H2 gas is used as the reducing gas, the N2 gas blown out from the pumping window
Since the amount of H2 gas is small and the H2 concentration does not become high, safety is improved.

Furthermore, in the case of a curing device, the gas containing organic components is not released into the atmosphere from the inlet/outlet portion of the curing device, so that the environment of the hill is not deteriorated.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
Figure 3 is an enlarged cross-sectional view of a portion of the cover, Figure 4 is a cross-sectional view taken along line B-B in Figure 1, and wSS diagram (a
), (b), and (c) are plan views showing the position of the shielding plate nohonding window, and FIG. 6 is a plan view showing an example of the sample. 4: Sample, 10: Housing, 11: Heat block. zl: Ponding tool. 34a: Ponding window, 50.51: Cover, 50h: Gas storage chamber, 50i
: Gas ejection hole, 53: Sample transport path, 54.55:
Gas supply pipe, 54a, 55a: Gas ejection hole 56: Gas exhaust pipe, 56a: Gas suction hole, 57: Cover 58: Gas supply pipe.

Claims (2)

[Claims] (1) A sealed sample transport path that transports the sample, a heat block that heats the sample, a gas supply means that creates a reducing gas atmosphere in the sample transport path, and a gas supply means that communicates with the sample transport path from above. a bonding tool that performs bonding through a bonding window provided in the bonding apparatus, further comprising a gas exhaust means for exhausting a gas containing an organic component generated from the sample by heating the heat block from the sample transport path. A bonding device characterized in that: (2) In a curing apparatus comprising a sealed sample transport path for transporting a sample, a heat block for heating the sample, and a gas supply means for creating a reducing gas atmosphere in the sample transport path, the heat block A curing device comprising a gas exhaust means for exhausting a gas containing an organic component generated from the sample by heating the sample from the sample transport path.