JPH02172041A - Manufacture of stamper for optical disk - Google Patents

Abstract

PURPOSE:To prolong service life of a master disk and to improve the uniformity by applying sputter etching onto a photosensitive resin of the master disk and laminating a thin film made of a dielectric substance or a semiconductor. CONSTITUTION:A dielectric substance or a semiconductor 3 is laminated onto the photosensitive resin 4 on the master disk base 5 by the sputtering. As the semiconductor 3, one of nitride such as Si3O4, oxide such as SiO2, carbide such as SiC and semiconductor such as Si or over is selected and the sputter gas, the Ar gas, or Ar and N2 or Ar and O2 in mixture is selected and the film is formed by the reactive sputtering. The thickness of the semiconductor 3 is desirably 2,000Angstrom or less. An ultraviolet curing resin 2 is coated onto the semiconductor 3, a flexible light transparent member 1 as the stamper base is overlapped to the resin 2, made flat and the ultraviolet ray 6 is radiated from the rear side of the member 1. When the member 1 is deflected, exfoliation is caused at the border layer between the resin 2 and the semiconductor 3 to attain the manufacture of the stamper. Since the exfoliated layer is the dielectric or semiconductor, no corrosion takes place, the service life of the master disk is prolonged and the uniformity is improved.

Description

[Detailed description of the invention] [Fields of application on beams] The present invention relates to a method for manufacturing an optical disc, which is expected to serve as a memory for a variety of information. The present invention relates to a method for manufacturing a stamper suitable for manufacturing an optical disk having a uniform uneven pattern and good flatness.

[Prior Art] In the conventional process, as shown in FIG. 3, a photosensitive resin 4 is applied to a master substrate 5, and information in the form of a concavo-convex pattern is recorded by optical means. Then, as a release layer, A
After vapor-depositing 128, an ultraviolet curing resin 2 is applied, a transparent member 1 is superimposed as a stamper substrate, and ultraviolet ray 6 is applied.
After irradiating.

The transparent substrate 1 was bent and peeled off from the interface between the ultraviolet curing resin 2 and AQ8 to produce a stamper. An example of this is Japanese Patent Application No. 59-233169.

Note that the same fabrication can be performed using Ni instead of Al28.

[Problems to be Solved by the Invention] In the above-mentioned conventional technology, since the stress applied to the master is large during peeling during stamper production, the peeling layer (Al, Ni, etc.) of the master is damaged after the stamper is manufactured several times. There are problems in that the adhesive peels off and transfers to the stamper side, making it impossible to manufacture optical discs and causing rust and corrosion.

Furthermore, in order to cure the ultraviolet curable resin, it was necessary to irradiate ultraviolet rays from the back side of the stamper substrate made of a flexible, transparent material (plastic, epoxy, etc.). This is because the release layer (Al, Ni, etc.) of the master does not transmit light.

For this reason, materials for the stamper have been limited to light-transmitting members. However, during the production of optical discs, the stamper was bent when the disc was peeled off, so the plastic or epoxy used earlier was likely to warp. The thickness of an ultraviolet curable resin layer having a concavo-convex pattern of an optical disk produced from such a stamper often varies in thickness.

In order to overcome the above-mentioned drawbacks, an object of the present invention is to form a release layer made of a non-corrosive material on a master disc with good adhesion, thereby extending the life of the master disc and producing a high-quality optical disc.

Means for Solving the Problems 1 The above object is achieved by sputter etching and then laminating at least one layer of a dielectric or semiconductor thin film on a master disk with an information pattern.

More specifically, when forming dielectric or semiconductor films, A
This is achieved by improving adhesion using a reactive sputtering method in an atmosphere of a mixed gas of r and N2, and forming information in the form of a concavo-convex pattern on a flexible stamper substrate.

Furthermore, in order to manufacture optical discs with good flatness and uniformity, it is necessary to use hard materials such as AQ3Ni and Fe, which are less likely to cause deformation such as warping even if the substrate is forcibly bent. Preferred 2 (Action 1) Sputter etching is performed on the photosensitive resin of the master with the concavo-convex pattern to form a thin film (
For example, by laminating Si3N, etc.), it became possible to form a transparent peelable S layer with good adhesion on the /I board. Therefore, the release layer of the master will not be peeled off during stamper production.

Also, the release layer laminated to the master allows light to pass through.

In addition to substrates made of conventionally used translucent materials (plastic, epoxy, etc.), we also use substrates made of metal materials (Affi3Ni, etc.) that are less likely to cause deformation such as warping even if they are opaque. A stamper using the above method can be manufactured. An uneven pattern with good flatness and uniformity can be formed on an optical disk produced using this stamper.

Furthermore, since thin films can be formed by reactive sputtering using a mixed gas of Ar and N2 or Ar and 0□, which has the effect of improving adhesion, the internal stress of thin films made of dielectrics or semiconductors can be reduced. reduce As a result, even if the photosensitive resin film is affected by temperature change, moisture absorption, dryness, or any external force, phenomena such as peeling will not occur in the thin film.

As a result, since thin films made of dielectric or semiconductor are laminated, there is no rust or corrosion, and the master can be reused even after long-term storage, extending the life of the original. .

[Example 1 Embodiments of the present invention will be described below with reference to the drawings.

<Example 1> As shown in FIG. 1, sputter etching is performed on the photosensitive resin 4 on which information forming the uneven pattern shape on the master substrate 5 is recorded. Sputter etching uses Ar gas, the pressure is 1.3 to 2.5 Pa, and the discharge power is 100-2.
00W for 3 to 5 minutes.

Thereafter, a dielectric or semiconductor (eg 5iiN4.
sio, etc.) 3 are stacked by sputtering. Sputtering of the dielectric or semiconductor 3 is performed in an Ar gas atmosphere at a pressure of 1.3 to 2.5 Pa and a discharge power of 50 to 3 Pa.
A film is formed for several minutes in the range of 00W.

Here, when the sputtered film is formed from a nitride such as Si3N, Ar and N2 are used as the atmospheric gas, and when the sputtered film is formed from an oxide such as Sin, the atmospheric gas is Forming a film using a mixed gas such as Ar and 02 is effective in improving adhesiveness. The gas pressure and discharge power are almost the same as the previous sputtering conditions.

The thickness of the dielectric or semiconductor 3 is 2000 mm, which is a film thickness that can keep the uneven pattern of the photosensitive resin 4 in the same shape.
It is desirable that the number be within the number of people. The amount of N2 at this time is Ar
It is preferably about 3 to 10%.

After that, an AI8 external radiation curing resin 2 is applied on the dielectric or semiconductor 3, and then a flexible light-transmitting member (plastic, epoxy, etc.) 1 is superimposed on the resin 2 as a stamper substrate. Make it flat.

Ultraviolet ff16 is irradiated from the back surface of the transparent member 1. When the transparent substrate 1 is bent, peeling occurs at the boundary layer between the ultraviolet curing resin 2 and the dielectric or semiconductor 3, allowing the stamper to be manufactured.

One stamper produced in this way has no peeling of the master release layer, and the above stamper production can be repeated at least 10 times.

In addition, as dielectric or semiconductor materials, Si3N,
Nitrides such as, oxides such as 5i02, carbides such as SiC,
A similar effect can be obtained by using any one of semi-metallic materials such as Si. However, the transmittance of the master after lamination must be set within a range in which the ultraviolet curable resin can be cured by ultraviolet rays.

Furthermore, two or more of the above materials can also be laminated. In this case, the total thickness of the multilayer film is 2000 or less, as described above.

<Example 2> Since a transparent release layer could be laminated on the master disc, it became possible to irradiate ultraviolet rays through the master disc. Therefore, a stamper can be manufactured using an opaque S-quality material that is less likely to undergo deformation such as warping.

As shown in FIG. 2, a master disc is formed by laminating a dielectric or semiconductor 3 on a photosensitive resin 4 on an opaque member (for example, an AQ substrate with a thickness of 2 mm) 7 coated with an ultraviolet curing resin 2. After the substrates 5 are stacked and the ultraviolet curing resin 2 is made flat, ultraviolet rays 6 are irradiated from the back side of the master. Thereafter, as in Example 1, the opaque member 7, which is the stamper substrate, is bent and peeled off.

An information pattern with good uniformity is formed on the optical disc manufactured from the stamper thus manufactured.

Furthermore, even if an optical disc is made using this stamper,
The stamper no longer warps.

In addition to AQ, there are three types of non-transparent substrates for stampers mentioned above.
Although Ni, Fe, etc. can also be used, either of them should be a flexible substrate.

In order to make the film thickness of the optical disc uniform, it is desirable that the thickness of the opaque substrate for the stamper is 0.5 to 3 mm or less. It is 0.5 mm or less.

Variations in the film thickness of the optical disc are observed, and if the film thickness is 6 mm or more, the flexibility of the stamper is lost, causing problems when peeling off the optical disc.

[Effects of the Invention 1] According to the present invention, in the method for producing a stamper for an optical disc, it has become possible to form a release layer with good adhesion on the photosensitive resin on which the concavo-convex pattern is recorded. Furthermore, since the release layer is made of a dielectric or a semiconductor, it is possible to prevent rust and corrosion from occurring, making it possible to extend the life of the master.

As a result, while conventionally the number of stampers produced from one master was about 2.3, it has become possible to produce 10 or more stampers.

Furthermore, since we were able to change the release layer of the master from opaque to transparent, it became possible to create a standby board with a hard flexible substrate that is less likely to warp or otherwise deform. This has made it easier to produce optical discs with highly uniform information patterns.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing a first embodiment of the method for manufacturing an optical disk stamper of the present invention, FIG. 2 is a cross-sectional view showing the second example, and FIG. 3 is a cross-sectional view showing a conventional method for manufacturing an optical disk stamper. FIG. Explanation of symbols 1... Transparent member 2... Ultraviolet curing resin 3... Dielectric or semiconductor 4... Photosensitive resin 5... Master substrate 6... Ultraviolet light 7... Opaque member 8 ...AQ Figure 1 Figure 3 Figure 2

Claims (1)

[Scope of Claims] 1. A master substrate, and a photosensitive resin film on which information forming a concavo-convex pattern is recorded by optical means on the master substrate,
After performing sputter etching, there are a step of laminating a thin film made of dielectric or semiconductor by sputtering, a step of applying an ultraviolet curable resin, a step of stacking a stamper member on the resin, and a step of irradiating the resin with ultraviolet rays. . A method for producing a stamper for an optical disc, which comprises peeling off the resin from the master disc. 2. In the method for producing a stamper for an optical disk according to claim 1, Si is used as the dielectric or semiconductor material.
Nitride such as _3N_4, oxide such as SiO_2, SiC
At least one of carbides such as, metalloid substances such as Si, etc.
A method for producing an optical disc stamper, characterized by laminating more than one type of stamper. 3. In the method for producing a stamper for an optical disk according to claim 1, when laminating thin films made of dielectric or semiconductor by sputtering, the sputtering gas is in an Ar gas atmosphere, or in a combination of Ar and N_2, or Ar and N_2. O_
1. A method for producing a stamper for an optical disk, the method comprising forming a film using a reactive sputtering method in a mixed gas atmosphere such as No. 2. 4. In the method for producing a stamper for an optical disk according to claim 1, the stamper member is a substrate made of a flexible light-transmitting material (plastic, epoxy, etc.);
Alternatively, a substrate made of an opaque material (Al, Ni, Fe
etc.) A method for producing a stamper for an optical disc. 5. In the method for producing a stamper for an optical disk according to claim 1, the substrate thickness of the stamper member is 0.5 to 5 m.
1. A method for producing an optical disc stamper, characterized in that the stamper is in the range of m.