JPH0216758A - Semiconductor device cap - Google Patents

Semiconductor device cap

Info

Publication number
JPH0216758A
JPH0216758A JP63167053A JP16705388A JPH0216758A JP H0216758 A JPH0216758 A JP H0216758A JP 63167053 A JP63167053 A JP 63167053A JP 16705388 A JP16705388 A JP 16705388A JP H0216758 A JPH0216758 A JP H0216758A
Authority
JP
Japan
Prior art keywords
cap
casing
sealing
semiconductor
slanting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63167053A
Other languages
Japanese (ja)
Inventor
Kunio Takatsuki
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP63167053A priority Critical patent/JPH0216758A/en
Publication of JPH0216758A publication Critical patent/JPH0216758A/en
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

PURPOSE: To prevent a sealing material from flowing into a casing by slanting the cap sealing section to make an interval between the casing and a cap wider at the outside than at the inside of the cap.
CONSTITUTION: A sealing section 4 located at the bottom surface of a cap 5 includes a tapered portion directed upward from an inner peripheral section to an outer peripheral section thereof and formed into a slanting surface. A pellet 1 is mounted on a casing 2 and connected to the same through a wire 3. Since the sealing section 4 is formed slantingly, the cap 5 is bonded to the casing 2 through a sealing material 6. Hereby, an interval between the casing 2 and the cap 5 is more extended at the outside than at the inside to prevent the sealing material 6 from flowing into the casing 2.
COPYRIGHT: (C)1990,JPO&Japio
JP63167053A 1988-07-05 1988-07-05 Semiconductor device cap Granted JPH0216758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63167053A JPH0216758A (en) 1988-07-05 1988-07-05 Semiconductor device cap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63167053A JPH0216758A (en) 1988-07-05 1988-07-05 Semiconductor device cap

Publications (1)

Publication Number Publication Date
JPH0216758A true JPH0216758A (en) 1990-01-19

Family

ID=15842525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63167053A Granted JPH0216758A (en) 1988-07-05 1988-07-05 Semiconductor device cap

Country Status (1)

Country Link
JP (1) JPH0216758A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02130120U (en) * 1989-03-31 1990-10-26
JPH059026U (en) * 1991-07-12 1993-02-05 テイーデイーケイ株式会社 Electronic parts
JP2007281233A (en) * 2006-04-07 2007-10-25 Denso Corp Semiconductor sensor device and its manfacturing method
JP2011114192A (en) * 2009-11-27 2011-06-09 Shinko Electric Ind Co Ltd Semiconductor device
JP2014072346A (en) * 2012-09-28 2014-04-21 Nec Corp Hollow sealing structure and manufacturing method of the same
JP2014150333A (en) * 2013-01-31 2014-08-21 Kyocera Corp Piezoelectric component
JP2014225837A (en) * 2013-05-17 2014-12-04 京セラクリスタルデバイス株式会社 Crystal device
JP6399272B1 (en) * 2017-09-05 2018-10-03 三菱電機株式会社 Power module, manufacturing method thereof, and power conversion device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02130120U (en) * 1989-03-31 1990-10-26
JPH059026U (en) * 1991-07-12 1993-02-05 テイーデイーケイ株式会社 Electronic parts
JP2007281233A (en) * 2006-04-07 2007-10-25 Denso Corp Semiconductor sensor device and its manfacturing method
JP2011114192A (en) * 2009-11-27 2011-06-09 Shinko Electric Ind Co Ltd Semiconductor device
US8592959B2 (en) 2009-11-27 2013-11-26 Shinko Electric Industries Co., Ltd. Semiconductor device mounted on a wiring board having a cap
JP2014072346A (en) * 2012-09-28 2014-04-21 Nec Corp Hollow sealing structure and manufacturing method of the same
JP2014150333A (en) * 2013-01-31 2014-08-21 Kyocera Corp Piezoelectric component
JP2014225837A (en) * 2013-05-17 2014-12-04 京セラクリスタルデバイス株式会社 Crystal device
JP6399272B1 (en) * 2017-09-05 2018-10-03 三菱電機株式会社 Power module, manufacturing method thereof, and power conversion device

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