JPH02161726A - Manufacture of electronic member or electronic device - Google Patents

Abstract

PURPOSE:To manufacture a substrate containing no impurity by a method wherein hydrogen peroxide is vaporized in a carrier gas, to produce a gas containing hydrogen peroxide, the gas is supplied into a vessel in which a substrate to be processed is arranged, and oxidizes the substrate surface. CONSTITUTION:Hydrogen peroxide water as raw material is supplied from a raw material hydrogen oxide water storing tank 2 to a vaporization apparatus 1, which is heated and evaporates hydrogen peroxide in the inside. From the outside, carrier gas is simultaneously supplied into the apparatus 1 with a specified flow rate; the gas containing hydrogen peroxide is sent to a substate chamber 3, and processes a substrate 4 to be processed. In the case water it is intended to eliminate organic material on the surface, the hydrogen peroxide oxidizes and decomposes the organic material; the organic material is turned into carbon oxide gas and water, and unnecessary component gas is discharged outside the chamber 3. In the case where it is intended to oxidize the substrate 4 to be processed, the hydrogen peroxide supplies oxygen to the substrate 4 and generates water.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing an electronic member or an electronic device.

[Prior art] Figure 3 shows, for example, the Japan Society for the Promotion of Science
1 is a configuration diagram showing a wet cleaning apparatus used in a conventional method for manufacturing electronic members or electronic devices disclosed in "Handbook". In the figure, (4) is the target substrate to be cleaned, (10> is the substrate carrier, (11)
is a substrate carrier transport device, (12) is a processing tank, (13)
For example, a treatment liquid consisting of hydrogen peroxide solution and pure water, etc.
(14) is an ultrasonic generation transducer, (15) is a high frequency power supply for the ultrasonic generation transducer, (16) is a filter for mouth passage (
17) is a circulation pump.

Next, the operation of the conventional method will be explained.

The substrate (4) is loaded onto a substrate carrier (lO) and immersed in a processing tank (12) by a substrate carrier transport device (11). Here, the substrate (4) is treated by the oxidizing action of the treatment liquid (14). The effect of the ultrasonic waves generated from the ultrasonic generating transducer (15) is to transfer hydrogen peroxide in the processing liquid to the substrate (4).
It plays a role in supplying the details of the microstructure.

Hydrogen peroxide in the treatment liquid oxidizes and decomposes organic substances on the surface of the substrate (4) to clean the substrate <4> and at the same time generate water. Further, a similar method is used when using hydrogen peroxide to oxidize or make the surface of a silicon substrate or the like hydrophilic. As the treatment operation is repeated in this way, the hydrogen peroxide concentration in the treatment solution (13) gradually decreases and the treatment effect decreases, and decomposition products and substrates (4) are adhered to the treatment solution (13). > When the concentration of impurities brought into the tank is constant (above iJJ), the processing solution is updated.The processing solution to be discarded still contains a high concentration of hydrogen peroxide, and should be disposed of after taking sufficient measures. During the transition from the previous process to this cleaning process, the substrate (4) is once removed from the processing equipment, so it is exposed to the outside air and impurity particles are removed from the substrate (4).
Give it a chance to stick. Therefore, the introduction of adhering impurity particles into the treatment tank (12) is unavoidable, and as a countermeasure to this, the treatment liquid (13) is constantly circulated to the filtration filter (16) with a circulation pump (17) to separate the impurity particles. , processing tank (12)-, over-operation of returning is always performed.

In general, in the manufacturing process of microstructured electronic components such as semiconductors and electronic devices, the incorporation of fine particles and soluble impurities into the chemical solution used must be avoided as much as possible to avoid reducing the yield of the product. .

In particular, the presence of fine particles directly leads to breakage of fine patterns, so a reliable pre-removal treatment is required. However, commercially available hydrogen peroxide solutions are manufactured by an automatic oxidation method using alto-anthraquinone, which prevents anthraquinone and organic solvents from being released during the manufacturing process, and prevents impurities from leaching from the container and decomposing hydrogen peroxide during the transportation process. It is contaminated with colloidal tin compounds added for this purpose, and cannot be used as is. Therefore, at present, pretreatments such as distillation and precision filtration are performed.

[Problems to be Solved by the Invention] In the conventional method of processing substrates using a wet method using hydrogen peroxide, the pre-process and cleaning process are performed in separate devices, and there are many problems such as removing, moving, and inserting the substrate. The transportation process is essential during the process, giving an opportunity for impurity particles to adhere to the substrate, and pretreatment such as distillation and precision filtration is essential, as the raw material hydrogen peroxide water is highly contaminated. Furthermore, the hydrogen peroxide concentration in the cleaning solution decreases with repeated treatments, and therefore it is necessary to constantly control the concentration in order to maintain a certain level of treatment effectiveness. Furthermore, since a large amount of waste liquid is generated each time, a waste liquid treatment device with a certain level of processing capacity is required. As described above, the conventional method for manufacturing electronic components or electronic devices using hydrogen peroxide has drawbacks such as requiring complicated management and auxiliary equipment.

This invention was made to solve the above-mentioned problems. It does not require pre-treatment of raw materials, and concentration control is extremely easy, reducing the chances of contamination of the substrate to be processed. Make electronic parts! Electronic device manufacturing method 1
! Aimed at Surukononi. .

[Means for Solving the Problem] The method for manufacturing an electronic device according to the second invention is to evaporate hydrogen peroxide in a tear gas. 2. Place 1 piece of hydrogen peroxide-containing steel into the container where the substrate to be treated is placed. (− from oxidation treatment−j′Rumono′□+−′&i stone).

[Invention of action-1, iζ, 1): Since hydrogen peroxide is used in hydraulics, the substrate can be processed as it is, with particles 1 and 5 and 1 and 5 and 1 and 1, respectively. 1, -4, 11-1 degree of peroxide scale; sentence valve speed i-'! 'c IJ "γ gaso, nIT?"
Unique in 1 shot) 1 decision ``:X-r:G degree''n
Easy to understand (,-1°j J-7,,5,3la+1,&1
In addition to supplying the required amount of hydrogen peroxide without a colloidal decomposition inhibitor to the substrate, the raw material hydrogen peroxide solution can be stored while containing the decomposition inhibitor.
decomposition of hydrogen peroxide during storage is minimized1)
It will be done.

[Embodiment 1 Hereinafter, an apparatus using the method for manufacturing an electronic member or an electronic device according to an embodiment of the invention described in -J will be explained with reference to the drawings.] In Figure 1, (1) is the fm generator, (2
>i: t, M separate dynamic hydrogen oxide water storage tank, (3) ζJ, substrate processing chamber, (, 4) is the substrate to be treated (9), (5) is, for example, inside (, 1 granular dioxide... Fill in ff > i1j
l-f=exhaust gas treatment equipment) 0, Next (te operation; one'r explanation-J-ro).

Raw material jL) Hydrogen oxide water is stored in the raw material hydrogen peroxide water storage tank (2)
Kai',, Evaporation'Alt < 1)! ,=supply L'! ' jE, '? 'l l, steam RA 'Jj
It (1) u e−′λ”−・(,7j knee:″), for example, heat to 25 to 120°C to evaporate the peroxide 1′ and hydrogen inside. Apparatus <1) t; m is simultaneous +, == S1' Carrier gas, such as nitrogen gas, is supplied from 1 part at 5 Q /'fAlrσ cap j, and evaporates to produce t-hydrogen peroxide. Accompanied by hydrogen peroxide-containing gas (H20□0.1-0.5%, ■20 (water) 0.1
~0.5%) and sent to the substrate processing chamber (3) to process the substrate to be processed <4>. Side light substrate to be processed (4
), hydrogen peroxide oxidizes and decomposes the organic matter, converting it into carbon dioxide and water, and these generated unnecessary component gases are sent to the substrate processing chamber <3> according to the flow of the carrier gas. Discharge outside. In addition, when the purpose is to oxidize the substrate to be processed (4), hydrogen peroxide supplies oxygen to the substrate to be processed (4) and generates water, which is also discharged along the carrier gas flow as in the previous example. be done. Since the discharged gas contains unreacted hydrogen peroxide, it is brought into contact with manganese dioxide, which is an internal catalyst, in the exhaust gas treatment device (5) to decompose the residual hydrogen peroxide into water and oxygen. , is discharged from the system. Through the above-described treatment, a cleaning effect equal to or greater than that of conventional wet treatment was obtained.

Note that the substrate processing chamber (3) does not need to be a chamber dedicated to this process, but rather a general-purpose chamber that has a gas supply port and a gas discharge port in the processing chamber of the previous process, such as an etching chamber, and can be used in the same chamber. Performing multiple steps without removing the substrate is more effective in preventing contamination of the substrate.The production of gaseous hydrogen peroxide allows this very same chamber to perform multiple steps.

Furthermore, since the hydrogen peroxide in this invention has undergone an evaporation process, it does not contain any particulate impurities and can be used to process substrates as is. Further, since the concentration of hydrogen peroxide is uniquely determined by the evaporation rate and the flow rate of the carrier gas, the concentration can be easily controlled. Furthermore, hydrogen peroxide without a colloidal decomposition inhibitor can be supplied to the substrate as much as necessary in accordance with the substrate processing operation, and the raw hydrogen peroxide solution can be stored with the decomposition inhibitor still in it, so there is no need to worry about overheating during storage. Decomposition of hydrogen oxide is suppressed to a minimum. Furthermore, since a large amount of waste liquid is not generated at a time, there is no need to particularly increase the processing capacity of the waste liquid treatment device.

Furthermore, since gaseous hydrogen peroxide with low density is used for substrate processing, hydrogen peroxide is supplied to the fine details of the surface layer of the substrate, resulting in high precision (uniform processing).

Figure 2 further improves the oxidation ability of hydrogen peroxide.

This is a configuration of an apparatus that realizes a method for manufacturing an electronic member or an electronic device according to another embodiment, which can quickly and completely process a substrate. In the figure, (1) to (5) are equivalent to or equivalent to those in FIG. (6) is a wavelength 190 nm to 250 nm installed in the substrate processing chamber (3).
This is an ultraviolet lamp that generates ultraviolet light.

In the substrate processing chamber (3), hydrogen peroxide-containing gas is supplied from the evaporator (1), and an ultraviolet lamp (
The substrate to be processed (4) is irradiated with ultraviolet light from 6). The role of the ultraviolet rays is to decompose hydrogen peroxide near the surface of the substrate to be processed (4) to generate hydroxyl radicals. These hydroxyl radicals are extremely reactive and efficiently oxidize organic substances and substrates. Thus, by combining UV irradiation, a rapid and complete treatment effect can be achieved.

Here, the ultraviolet lamp (6) does not need to be provided in the substrate processing chamber (3), and the
The same effect can be expected even if part or all of 3) is made of a UV-transparent material and the UV lamp (6) is installed outside the substrate processing chamber (3).

[Effects of the Invention] As described above, according to the present invention, a hydrogen peroxide solution is evaporated into a carrier gas to generate a hydrogen peroxide-containing gas, and this hydrogen peroxide-containing gas is transferred to a substrate on which a substrate to be processed is placed. Since the hydrogen peroxide-containing gas is supplied into a container and the surface of the substrate is oxidized by the hydrogen peroxide-containing gas, there are no particulate impurities contained in the hydrogen peroxide raw material, and the substrate can be directly processed.
Furthermore, processing can be performed in the same chamber as the previous process, and contamination of the substrate during transportation can be prevented. Furthermore, since impure products generated by substrate processing are always discharged out of the system along with the exhaust gas, contamination of the substrate by reaction products can be prevented. Furthermore, since the required amount of hydrogen peroxide can be freely supplied, concentration control is easy.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram showing an apparatus for realizing a method for manufacturing an electronic member or an electronic device according to an embodiment of the present invention, and FIG.
FIG. 3 is a block diagram showing an apparatus for realizing a method for manufacturing an electronic member or electronic device according to another embodiment of the present invention, and FIG. 3 is a block diagram showing a conventional wet method substrate cleaning apparatus. In the figure, (1) is an evaporation device, (2) is a storage tank for raw material hydrogen peroxide, (3> is a substrate processing chamber, (4> is a substrate to be processed, and (5> is an exhaust gas treatment device). The same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A step of evaporating a hydrogen peroxide solution into a carrier gas to generate a hydrogen peroxide-containing gas, and supplying the hydrogen peroxide-containing gas into a container in which a substrate to be processed is installed, and applying the peroxide to the surface of the substrate. A method for manufacturing an electronic member or an electronic device, which performs an oxidation treatment using a hydrogen-containing gas.