JPH02159383A - 無電解金メッキ用組成物 - Google Patents
無電解金メッキ用組成物Info
- Publication number
- JPH02159383A JPH02159383A JP1270155A JP27015589A JPH02159383A JP H02159383 A JPH02159383 A JP H02159383A JP 1270155 A JP1270155 A JP 1270155A JP 27015589 A JP27015589 A JP 27015589A JP H02159383 A JPH02159383 A JP H02159383A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- amount
- alkali metal
- plating
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010931 gold Substances 0.000 title claims abstract description 73
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 70
- 238000007747 plating Methods 0.000 title claims abstract description 51
- 239000000203 mixture Substances 0.000 claims abstract description 45
- 239000003381 stabilizer Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 150000001639 boron compounds Chemical class 0.000 claims abstract description 13
- 238000007772 electroless plating Methods 0.000 claims abstract description 9
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910000085 borane Inorganic materials 0.000 claims abstract description 5
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000003973 alkyl amines Chemical class 0.000 claims abstract description 4
- UORVGPXVDQYIDP-BJUDXGSMSA-N borane Chemical compound [10BH3] UORVGPXVDQYIDP-BJUDXGSMSA-N 0.000 claims abstract 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 35
- -1 alkali metal gold cyanide Chemical class 0.000 claims description 32
- 239000000243 solution Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 17
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 13
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 6
- 150000001340 alkali metals Chemical class 0.000 claims description 5
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical group OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 4
- 238000009713 electroplating Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract description 10
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000033116 oxidation-reduction process Effects 0.000 abstract description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 2
- 229910052796 boron Inorganic materials 0.000 abstract 2
- 229910000000 metal hydroxide Inorganic materials 0.000 abstract 2
- 150000004692 metal hydroxides Chemical class 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical group [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 2
- ZRXHLJNBNWVNIM-UHFFFAOYSA-N 3-methyl-1-benzofuran Chemical compound C1=CC=C2C(C)=COC2=C1 ZRXHLJNBNWVNIM-UHFFFAOYSA-N 0.000 description 1
- 244000248349 Citrus limon Species 0.000 description 1
- 235000005979 Citrus limon Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- QFLVHLKRNQNMGT-UHFFFAOYSA-N boron;methanamine Chemical compound [B].NC QFLVHLKRNQNMGT-UHFFFAOYSA-N 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- YQGDEPYYFWUPGO-UHFFFAOYSA-N gamma-amino-beta-hydroxybutyric acid Chemical compound [NH3+]CC(O)CC([O-])=O YQGDEPYYFWUPGO-UHFFFAOYSA-N 0.000 description 1
- PDSIOMKEYNZXLS-UHFFFAOYSA-H hexapotassium hexahydroxide Chemical compound [OH-].[K+].[K+].[K+].[K+].[K+].[K+].[OH-].[OH-].[OH-].[OH-].[OH-] PDSIOMKEYNZXLS-UHFFFAOYSA-H 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- LIBWRRJGKWQFSD-UHFFFAOYSA-M sodium;2-nitrobenzenesulfonate Chemical compound [Na+].[O-][N+](=O)C1=CC=CC=C1S([O-])(=O)=O LIBWRRJGKWQFSD-UHFFFAOYSA-M 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27640588A | 1988-11-22 | 1988-11-22 | |
| US07/351,924 US5130168A (en) | 1988-11-22 | 1989-05-15 | Electroless gold plating bath and method of using same |
| US351924 | 1994-12-08 | ||
| US276405 | 1999-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02159383A true JPH02159383A (ja) | 1990-06-19 |
| JPH031383B2 JPH031383B2 (enrdf_load_stackoverflow) | 1991-01-10 |
Family
ID=26957956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1270155A Granted JPH02159383A (ja) | 1988-11-22 | 1989-10-17 | 無電解金メッキ用組成物 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH02159383A (enrdf_load_stackoverflow) |
| DE (1) | DE3938653A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2639654B1 (enrdf_load_stackoverflow) |
| GB (1) | GB2225026A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006077270A (ja) * | 2004-09-07 | 2006-03-23 | Nikko Materials Co Ltd | 無電解金めっき液の安定化方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4302066A1 (en) * | 1993-01-26 | 1993-07-01 | Metrotech Handelsgesellschaft | Chemical precision gold@ plating process - producing thin, hard coatings in short cycle times, for e.g. jewellery with reduced gold@ usage |
| US5338343A (en) * | 1993-07-23 | 1994-08-16 | Technic Incorporated | Catalytic electroless gold plating baths |
| JP3331260B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
| US5635253A (en) * | 1994-08-30 | 1997-06-03 | International Business Machines Corporation | Method of replenishing electroless gold plating baths |
| DE19651900A1 (de) * | 1996-12-13 | 1998-06-18 | Albert Thorp Gmbh | Elektrolyt für eine reduktive Goldabscheidung |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH615464A5 (en) * | 1976-06-01 | 1980-01-31 | Systemes Traitements Surfaces | Special compositions and particular additives for gold electrolysis baths and their use |
| ZA775495B (en) * | 1976-11-22 | 1978-07-26 | Kollmorgen Tech Corp | Method and apparatus for control of electroless plating solutions |
| DE3707817A1 (de) * | 1987-03-09 | 1988-09-22 | Schering Ag | Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold |
| DE3805627A1 (de) * | 1988-02-24 | 1989-09-07 | Wieland Edelmetalle | Goldbad |
-
1989
- 1989-09-27 GB GB8921796A patent/GB2225026A/en not_active Withdrawn
- 1989-10-17 JP JP1270155A patent/JPH02159383A/ja active Granted
- 1989-11-21 DE DE3938653A patent/DE3938653A1/de active Granted
- 1989-11-22 FR FR898915335A patent/FR2639654B1/fr not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006077270A (ja) * | 2004-09-07 | 2006-03-23 | Nikko Materials Co Ltd | 無電解金めっき液の安定化方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3938653A1 (de) | 1990-05-23 |
| GB2225026A (en) | 1990-05-23 |
| FR2639654B1 (fr) | 1992-01-24 |
| DE3938653C2 (enrdf_load_stackoverflow) | 1991-08-22 |
| JPH031383B2 (enrdf_load_stackoverflow) | 1991-01-10 |
| GB8921796D0 (en) | 1989-11-08 |
| FR2639654A1 (fr) | 1990-06-01 |
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