JPH02159091A - Enamel circuit board - Google Patents
Enamel circuit boardInfo
- Publication number
- JPH02159091A JPH02159091A JP31407588A JP31407588A JPH02159091A JP H02159091 A JPH02159091 A JP H02159091A JP 31407588 A JP31407588 A JP 31407588A JP 31407588 A JP31407588 A JP 31407588A JP H02159091 A JPH02159091 A JP H02159091A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit
- enamel
- resistor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000003298 dental enamel Anatomy 0.000 title abstract description 8
- 229910021341 titanium silicide Inorganic materials 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000012299 nitrogen atmosphere Substances 0.000 abstract description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はテレビ、ＶＴＲ，オーディオ機器等の電子通信
機の電気回路に使用することのできるホーローカイロ基
板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a hollow body warmer substrate that can be used in electric circuits of electronic communication devices such as televisions, VTRs, and audio equipment.
従来の技術
従来、セラミック基板に銀バラジュームの導体を用いて
回路を形成し、その上に酸化ルテニュームの抵抗体を印
刷または描画形成して回路基板を形成している。ところ
がこの回路基板は貴金属材料である銀バラジューム導体
や酸化ルチニューム抵抗体を使用しているのでコストが
高く、また銀バラジューム導体のインピーダンスも高い
ため、高周波回路用の基板としては不敵当である。そこ
で本発明者らはセラミック基板に導体材料として安価で
かつインピーダンスの低い銅導体にてパターン形成をし
、その上に中性雰囲気で形成できる珪化チタンを主成分
とした抵抗体を形成し、回路基板を形成する試みを行っ
ている。かかる回路基板によれば、貴金属材料を一切使
用せず安価な非金属材料で形成できるため安価でかつ、
性能のよい回路基板を提供することができる。2. Description of the Related Art Conventionally, a circuit board is formed by forming a circuit on a ceramic substrate using a silver baladium conductor, and then printing or drawing a ruthenium oxide resistor thereon. However, this circuit board is expensive because it uses precious metal materials such as silver baladium conductors and rutinium oxide resistors, and the impedance of the silver baladium conductors is also high, making it unsuitable as a board for high-frequency circuits. Therefore, the present inventors formed a pattern on a ceramic substrate using a copper conductor, which is inexpensive and has low impedance, and formed a resistor mainly composed of titanium silicide, which can be formed in a neutral atmosphere, on top of the pattern. Attempts are being made to form a substrate. According to such a circuit board, it can be formed from inexpensive non-metallic materials without using any precious metal materials, so it is inexpensive and
A circuit board with good performance can be provided.
発明が解決しようとする課題
しかるに大電流用トランジスター及びＩＣ等を使用する
と熱が高くなり、セラミック基板では放熱性が悪いため
使用範囲が限定されるという課題は割れやすく、取扱い
にくいという！ｉ！！ｌもある。Problems to be Solved by the Invention However, when high-current transistors and ICs are used, they generate a lot of heat, and ceramic substrates have poor heat dissipation properties, which limits their range of use.The problem is that they are easily broken and difficult to handle! i! ! There is also l.
１ｌｉｆｔを解決するための手段
本発明は回路基板の素材として、ホーロー基板を用い、
その面上に銅導体ならびに珪化チタンを主成分とする抵
抗体を形成するものである。Means for Solving 1lift The present invention uses a hollow board as the material of the circuit board,
A copper conductor and a resistor whose main component is titanium silicide are formed on that surface.
作用
本発明は放熱効果がよいため大電流ＩＣを実装できるこ
とにより、実装密度を高めることができる。Function: The present invention has a good heat dissipation effect, so large current ICs can be mounted, thereby increasing the packaging density.
また銅導体、印刷抵抗の焼成条件についても従来セラミ
ック基板上で形成するのと同様の焼成条件であるチッ素
＜Ｎｔ）Ｍ囲気炉で行えるため、ホーロー基板を用いる
ための設備の変更をする必要がないものである。In addition, the firing conditions for copper conductors and printed resistors are the same as those used for forming conventional ceramic substrates in a nitrogen <Nt)M open air furnace, so it is necessary to change the equipment to use enamel substrates. There is no such thing.
実施例
以下、本発明の一実施例のホーロー回路基板を図面を参
照に説明する。EXAMPLE Hereinafter, a hollow circuit board according to an example of the present invention will be explained with reference to the drawings.
図に示す様にホーロー基板（１）の上に銅導体ベースト
を用いて実回路モジュールの導体回路（２）を印刷また
は描画にて形成する。その後、上記回路基板を加熱乾燥
し、チッ素（Ｎ、）雰囲気炉で焼成したのち、珪化チタ
ンを主成分とする抵抗体材料を印刷あるいは描画して実
回路用抵抗体（３）を形成する。これを加熱乾燥し、チ
ッ素（Ｎ、）雰囲気炉にて焼成してホーロー回路基板を
形成する。かかる回路基盤によれば、ホーロー基板（１
）を用いることにより銀バラジューム導体と比ら帆放熱
性がよく、またインピーダンスも低いため大電流ＩＣも
実装することができ、高密度化が可能となる。As shown in the figure, a conductor circuit (2) of an actual circuit module is formed by printing or drawing on a hollow substrate (1) using a copper conductor base. Thereafter, the circuit board is heated and dried and fired in a nitrogen (N) atmosphere furnace, and then a resistor material whose main component is titanium silicide is printed or drawn to form a resistor for an actual circuit (3). . This is heated and dried and fired in a nitrogen (N) atmosphere furnace to form a hollow circuit board. According to such a circuit board, the enamel board (1
) has better heat dissipation than silver-baladium conductors, and also has lower impedance, so large current ICs can be mounted, making it possible to increase density.
また焼成炉もセラミック基板をもちいたこれまでのチッ
素（Ｎり雰囲気焼成炉が使用できるため、あらためて設
備をおこす必要もない、さらに完成した回路基板の抵抗
体の値についても信幀性の高いものである。In addition, the firing furnace can be a conventional nitrogen atmosphere firing furnace that uses a ceramic substrate, so there is no need to install new equipment.Furthermore, the values of the resistors of the completed circuit board are highly reliable. It is something.
発明の効果
この様に本発明によれば、従来使用してきたセラミック
回路基板と同一製造条件で回路基板を形成することがで
き、高密度化が可能となり、抵抗値の信幀性についても
問題ないものである。Effects of the Invention As described above, according to the present invention, a circuit board can be formed under the same manufacturing conditions as conventionally used ceramic circuit boards, high density can be achieved, and there is no problem with reliability of resistance values. It is something.
図は本発明の一実施例におけるホーロー回路基板の平面
図である。
ｌ・・・・・・ホーロー基板、
の導体回路（ｗ４導体）、
（珪化チタン抵抗体）。
代理人の氏名 弁理士 粟野重孝 はか１名２・・・・
・・実回路モジュール
３・・・・・・実回路用抵抗体The figure is a plan view of a hollow circuit board in one embodiment of the present invention. l...Enamel board, conductor circuit (W4 conductor), (titanium silicide resistor). Name of agent: Patent attorney Shigetaka Awano Haka 1 person 2...
・・Real circuit module 3・・・Resistance element for actual circuit
Claims (1)
刷または、描画形成してなるホーロー回路基板。A hollow circuit board made by printing or drawing a resistor whose main component is titanium silicide on a hollow board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31407588A JPH02159091A (en) | 1988-12-13 | 1988-12-13 | Enamel circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31407588A JPH02159091A (en) | 1988-12-13 | 1988-12-13 | Enamel circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02159091A true JPH02159091A (en) | 1990-06-19 |
Family
ID=18048927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31407588A Pending JPH02159091A (en) | 1988-12-13 | 1988-12-13 | Enamel circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02159091A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515049A (en) * | 1978-07-19 | 1980-02-01 | Jeco Co Ltd | Voltmeter |
| JPS5874092A (en) * | 1982-06-14 | 1983-05-04 | 東光株式会社 | Board for electronic circuit |
| JPS58210686A (en) * | 1982-05-31 | 1983-12-07 | 住友電気工業株式会社 | Electronic circuit device |
| JPS62250603A (en) * | 1986-04-23 | 1987-10-31 | 松下電器産業株式会社 | Manufacture of thick film resistor |
| JPS63184301A (en) * | 1985-03-14 | 1988-07-29 | シ−テイ−エス・コ−ポレ−シヨン | Paint for thick film resistor and resistor made of the paint |
-
1988
- 1988-12-13 JP JP31407588A patent/JPH02159091A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515049A (en) * | 1978-07-19 | 1980-02-01 | Jeco Co Ltd | Voltmeter |
| JPS58210686A (en) * | 1982-05-31 | 1983-12-07 | 住友電気工業株式会社 | Electronic circuit device |
| JPS5874092A (en) * | 1982-06-14 | 1983-05-04 | 東光株式会社 | Board for electronic circuit |
| JPS63184301A (en) * | 1985-03-14 | 1988-07-29 | シ−テイ−エス・コ−ポレ−シヨン | Paint for thick film resistor and resistor made of the paint |
| JPS62250603A (en) * | 1986-04-23 | 1987-10-31 | 松下電器産業株式会社 | Manufacture of thick film resistor |
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