JPH02155644A - Method for temporarily fixing part - Google Patents

Abstract

PURPOSE:To reduce the mounting inferiority of a part due to a resin by adjusting a high viscosity resin to a state possible to coat in a process for coating a substrate with the resin and subsequently increasing the viscosity of said resin adjusted to viscosity possible to coat. CONSTITUTION:A substrate 1 is thrown in a thermosetting adhesive 2 prepared by mixing cellosolve acetate with a high viscosity thermosetting epoxy resin to print said adhesive 2 on the space between the copper foil patterns 3 on the substrate 1 by a Tetlon screen having a thickness of 300mum and, next, in order to increase the viscosity of the thermosetting adhesive 2 wherein cellosolve acetate is mixed with the high viscosity thermosetting epoxy resin, the substrate 1 is kept in a drying oven at 80 deg.C for 10min to evaporate cellosolve acetate. In this state, a chip part 4 is mounted on the thermosetting adhesive 5 from which cellosolve acetate is evaporated and the whole is kept in a drying oven at 150 deg.C for 15min in order to temporarily fix the chip part 4 to the substrate 1 to cure the thermosetting adhesive 5.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a component temporary fixing method for temporarily fixing components onto a substrate.

2. Description of the Related Art A conventional method for temporarily fixing parts was as shown in FIG. In FIG. 2, 11 is a substrate, 12 is a resin, and 13 is a component.

The procedure for the above-mentioned component temporary fixing method will be explained below. The substrate 11 was put in, the resin 12 was applied onto the substrate 11, the component 13 was mounted on the resin 12, and the component 13 and the substrate 11 were temporarily fixed by curing the resin 12 by heating.

Problems to be Solved by the Invention However, when applying the resin 12 onto the substrate 11, the resin 12
must have a viscosity that allows for coating, and the adhesive strength (ordinary temperature adhesive strength) of Resin 12 was low. For this reason (due to low adhesive strength at room temperature), when the component 13 is mounted on the resin 12 coated on the substrate 11, the component 13 may fall off the substrate 11 or shift on the resin 12 (defective component mounting). occurred frequently. The present invention is intended to solve such problems and aims to reduce component mounting failures.

Means for Solving the Problem In order to solve this problem, the present invention includes a process of applying a resin to a substrate with a viscosity that allows the high viscosity resin to be applied, and a process of applying the resin to a viscosity that allows the high viscosity resin to be applied. The process consists of a step of improving the performance, a step of mounting the component onto the resin portion on the board, a step of mounting the component onto the board, and a step of curing the resin.

As a result, in the process of applying the resin to the substrate, the high viscosity resin can be made to have a viscosity that can be coated, and the same coating properties as before can be obtained, and then the viscosity of the resin that has been made to a viscosity that can be coated can be increased. As a result, the room-temperature adhesion was improved, and as a result, component mounting defects due to this resin were reduced.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 shows a method for temporarily fixing parts according to an embodiment of the present invention. In Figure 1, 1 is a substrate, 2 is a thermosetting adhesive made of high viscosity thermosetting epoxy resin mixed with Cellosolve acetate, 3 is a copper foil pattern, 4 is a chip component, and 6 is evaporated Cellosolve acetate. It is a thermosetting adhesive. The condyles of the hand will be explained below. A substrate 1 is put in, and a thermosetting adhesive 2 made of a high viscosity thermosetting epoxy resin mixed with cellosolve acetate (a solvent that evaporates at room temperature but completely evaporates in a drying oven) is applied onto the substrate 1. The substrate 1 was screen printed with a 300 μm thick Tetron screen between the copper foil patterns 3, and then the substrate 1 was mixed with cellosolve acetate into a high viscosity thermosetting epoxy resin to improve the viscosity of the thermosetting adhesive 2, and the substrate 1 was cured at room temperature. To improve adhesive strength, store in a drying oven at 80°C for 10 minutes to evaporate cellosolve acetate.
In this state, the chip component 4 is mounted on a thermosetting adhesive 5 containing evaporated cellosolve acetate, and placed in a drying oven at 150°C for 16 minutes to temporarily fix the chip component 4 and the substrate 1 with the adhesive 5. It was stored and the thermosetting adhesive 6 was cured.

During this series of operations, the viscosity of the thermosetting adhesive 2 of the present invention and the conventional thermosetting adhesive, and In the mounting process of the chip component 4, the following Table 1 shows a comparison of the viscosity, normal temperature adhesive strength, and component mounting failure rate of the present invention and the conventional thermosetting adhesive.

(Margin below) Table 1 *The numbers in the table are indexes when the conventional value is set as 100.

As described above, according to this example, printability in the printing process is maintained as before by mixing cellosolve acetate into a high viscosity thermosetting epoxy resin to make it viscous enough to coat it, and then adding cellosolve acetate to the resin. The viscosity of the thermosetting adhesive is improved by evaporation, the adhesive strength at room temperature is improved, and component mounting defects are reduced in the component mounting process, and the chip component 4 and the board 1 are temporarily fixed with the thermosetting adhesive 6. It is.

In this example, a solvent (Selonlupe Acetate) was mixed into the high viscosity resin to make it viscous enough to be coated, and the solvent was evaporated to improve the adhesive strength at room temperature and reduce component installation defects. It goes without saying that similar effects can be obtained when a high viscosity resin is made to a coatable viscosity by the method described above and a viscosity improving treatment is performed after coating on the substrate.

Effects of the Invention As described above, according to the present invention, there are a step of applying a resin to a substrate with a viscosity that allows the high viscosity resin to be applied, and a step of improving the viscosity of the resin that has a viscosity that allows the high viscosity resin to be applied. ,
Since it consists of the process of attaching the component to the resin part on the board and the process of curing the resin, ■ coating the resin on the board can be done as easily as before, and ■ reducing component installation defects. You can get the effect that you can.

[Brief explanation of the drawing]

FIG. 1 is a flowchart showing a component temporary fixing method according to an embodiment of the present invention, and FIG. 2 is a flowchart showing a conventional component temporary fixing method. 1...Substrate, 2...Thermosetting adhesive made of high viscosity thermosetting epoxy resin mixed with cellosolve acetate, 3...Copper foil pattern, 4... ...
Chip parts, 6...Thermosetting adhesive made from evaporated cellosolve acetate. Name of agent: Patent attorney Shigetaka Awano and one other person

Claims (1)

[Claims] A process of applying a resin with a viscosity that can be coated with high viscosity resin to a board, a process of improving the viscosity of the resin with a viscosity that can be coated with a high viscosity resin, and a process of attaching parts to the resin part on the board. , a part temporary fixing method consisting of a step of curing the resin.