JPH0476487B2 - - Google Patents
Info
- Publication number
- JPH0476487B2 JPH0476487B2 JP4557186A JP4557186A JPH0476487B2 JP H0476487 B2 JPH0476487 B2 JP H0476487B2 JP 4557186 A JP4557186 A JP 4557186A JP 4557186 A JP4557186 A JP 4557186A JP H0476487 B2 JPH0476487 B2 JP H0476487B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- coating
- solvent
- polyphenylene oxide
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 12
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 11
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 11
- 239000003973 paint Substances 0.000 claims description 8
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 239000012046 mixed solvent Substances 0.000 claims description 5
- 239000011104 metalized film Substances 0.000 claims description 3
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002904 solvent Substances 0.000 description 14
- 239000010409 thin film Substances 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000013557 residual solvent Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器、電気機器に使用するフイ
ルムコンデンサのコーテイング誘電体膜の形成方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for forming a coating dielectric film for a film capacitor used in electronic and electrical equipment.
従来の技術
従来フイルムコンデンサの誘導体は、プラスチ
ツクを溶融あるいは溶液製膜されたフイルムを使
用していた。しかし近年機器の小型化に併いフイ
ルムコンデンサにも小型化の要求が強まつてき
た。そこで金属化フイルム面にプラスチツクを薄
膜形成し、積層あるいは巻回してフイルムコンデ
ンサとする方法が考案された。この方法は薄膜形
成したフイルムを単体で取扱しなくて良く又生産
性も非常に高い。一応誘電体に使用するプラスチ
ツク材料も実用化されているものはポリカーボネ
イトのみである。Prior Art Conventionally, film capacitors have used films made by melting or solution casting plastic. However, in recent years, as devices have become smaller, there has been a growing demand for smaller film capacitors. Therefore, a method was devised in which a thin film of plastic is formed on the surface of a metallized film and then laminated or wound to form a film capacitor. This method eliminates the need to handle the thin film alone and has very high productivity. Polycarbonate is the only plastic material that has been put into practical use as a dielectric material.
発明が解決しようとする問題点
前記の様な方法、つまり金属化フイルム上にプ
ラスチツクを薄膜形成させる方法としては、熱硬
化性プラスチツクを塗布硬化させる方法と、可溶
性プラスチツクを溶媒に溶解し塗布乾固させる方
法とに大別できる。前者は、薄膜状に塗布するこ
とが非常にむつかしく、また硬化させるために
は、多量のエネルギーを加えなければならない。
一方、後者の方法では、溶媒に溶解したプラスチ
ツクを薄膜形成するため、塗布時に目的の膜厚に
する必要がなく、乾固した状態で目的の膜厚にす
れば良い。また乾固させるためのエネルギーは前
者の硬化させるためのエネルギーに比べ少なくて
良く、生産性も高い。Problems to be Solved by the Invention The methods described above, that is, the method of forming a thin film of plastic on a metallized film, include a method of coating and curing thermosetting plastic, and a method of dissolving soluble plastic in a solvent and coating and drying. It can be broadly divided into methods. The former is very difficult to apply in the form of a thin film, and a large amount of energy must be applied to cure it.
On the other hand, in the latter method, since a thin film is formed from plastic dissolved in a solvent, it is not necessary to achieve the desired film thickness at the time of coating, but it is sufficient to achieve the desired film thickness after drying. Further, the energy required for drying and solidifying is less than the energy required for curing the former, and the productivity is also high.
さらに薄膜形成したコーテイング誘電体は、誘
電体として使用されるための膜の均一性が重要で
ある。誘電体としてのコーテイング膜に要求され
る特性は、前記の均一性のみではなく、コーテイ
ング誘電体形成後の誘電体中に残る溶剤(以下残
留溶剤という)の量、コーテイング誘電体表面粗
さ等が問題となる。例えば、ポリフエニレンオキ
シドを、単一溶媒で溶解し塗布乾固した場合、形
成したコーテイング誘電体膜は、表面粗さが非常
に粗く又ポリフエニレンオキシドを溶解した液も
ポツトライフが短かい等の問題が生じる。 Furthermore, since the coating dielectric formed into a thin film is used as a dielectric, uniformity of the film is important. The characteristics required of the coating film as a dielectric are not only the uniformity mentioned above, but also the amount of solvent remaining in the dielectric after forming the coating dielectric (hereinafter referred to as residual solvent), the surface roughness of the coating dielectric, etc. It becomes a problem. For example, when polyphenylene oxide is dissolved in a single solvent and coated and dried, the resulting coating dielectric film has a very rough surface, and the solution containing polyphenylene oxide also has a short pot life. The problem arises.
次にコーテイング誘電体膜を形成する場合、基
材とコーテイング誘電体膜形成用塗料のぬれ性が
重要であり、ぬれ性が悪い場合は、塗料を基材上
に塗布した場合、塗料がはじき均一な膜が形成で
きない等の問題が生じる。 Next, when forming a coating dielectric film, the wettability of the paint for forming the coating dielectric film with the base material is important. If wettability is poor, the paint will repel and be uniform when applied to the base material Problems arise, such as the inability to form a suitable film.
さらにぬれ性が良く、粘度の低い塗料を使用し
た場合塗布後、乾固されるまでに流れてしまい、
目的とする部分以外に塗布されるという不都合も
起こる。 Furthermore, if you use a paint with good wettability and low viscosity, it will run off before it dries after application.
The inconvenience of being applied to areas other than the intended areas also occurs.
以上の様に目的に適合したコーテイング誘電体
膜を形成しようとした場合多くの問題点がある。
単一溶媒を使用した場合これらすべての問題点を
解決するのは非常に困難であり、多種類の溶媒を
使用しなければならない。多種類の溶媒を混合し
て使用する方法は、例えば家庭用のペンキ等の塗
料で実用化されている。しかし本発明の用途は、
家庭用ペンキ等とは使用用途がまつたく異なり、
本件の場合非常に要求がきびしい。 As described above, there are many problems when attempting to form a coating dielectric film suitable for the purpose.
It is very difficult to solve all these problems when using a single solvent, and many types of solvents must be used. A method of using a mixture of many types of solvents has been put into practical use, for example, for paints such as household paints. However, the application of the present invention is
The usage is very different from household paint etc.
In this case, the demands are very strict.
そこで本発明では、ポリフエニレンオキシドを
溶解しかつ、コーテイング誘電体膜の均一性、残
留溶剤量、ポリフエニレンオキシドを溶解した液
のポツトライフ等を満足する溶媒の組み合せを提
供するものである。 Therefore, the present invention provides a combination of solvents that dissolves polyphenylene oxide and satisfies the uniformity of the coating dielectric film, the amount of residual solvent, the pot life of the solution containing polyphenylene oxide, etc.
問題を解決するための手段
この問題を解決するために本発明は、少なくと
もジクロルメタンとトリクロルエチレンを含む混
合溶剤に、ポリフエニレンオキシドを3重量パー
セント以上溶解してなる塗料を基材上に形成した
ものである。Means for Solving the Problem In order to solve this problem, the present invention forms a coating material on a base material by dissolving at least 3% by weight of polyphenylene oxide in a mixed solvent containing at least dichloromethane and trichloroethylene. It is something.
作 用
本発明では、ポリフエニレンオキシドを溶解し
易い、つまり溶解度の高いトリクロルエチレン
と、ポリフエニレンオキシドを溶解させた塗料の
安定性(ポツトライフ)を増すためのトリクロル
エチレンを主成分にした溶媒系を見いだしたもの
である。またジクロルメタンは、沸点が低く40℃
であるため乾固させる、場合に低エネルギーで良
い。トリクロルエチレンは、沸点が高く乾固時に
はジクロルメタンが蒸着した以降も残留し徐々に
乾燥しコーテイング後の膜表面粗さを最小限にと
どめる。Function The present invention uses trichlorethylene that easily dissolves polyphenylene oxide, that is, has a high solubility, and a solvent that mainly contains trichlorethylene to increase the stability (pot life) of the paint in which polyphenylene oxide is dissolved. This is the result of finding a system. In addition, dichloromethane has a low boiling point of 40℃.
Because of this, it can be dried to dryness, which requires less energy. Trichlorethylene has a high boiling point, and when dried, it remains even after dichloromethane has been deposited and dries gradually, minimizing the roughness of the film surface after coating.
また本発明の用途の場合、基材がアルミニウ
ム、亜鉛等の金属で金属化されたプラスチツクフ
イルムの場合が多く、前記の様な基材の場合、本
発明の塗料では、ぬれ性あるいは、流れ等の問題
も解決できるものである。 Furthermore, in the case of the application of the present invention, the base material is often a plastic film metallized with metal such as aluminum or zinc. This problem can also be solved.
実施例
ポリフエニレンオキシドをジクロルメタン1、
トリクロルエチレン1、トルエン1、の比率で混
合した溶媒に5重量パーセント溶解し、5ミクロ
ン厚のポリエチレンテレフタレートにアルミニウ
ムを真空蒸着した基材上グラビアコート方式で塗
布し、60℃の熱風槽を3秒間通過させ乾固させ
た。この場合の塗布乾固のコーテイング誘導体厚
は約1ミクロンであり、表面粗たは最大厚み1.15
ミクロン、最小厚0.9ミクロンであつた。上記の
様な方法で形成したフイルムを使用し、積層コン
デンサを作成したところ耐圧レベルは、約50で
あり優れたものであつた。Example Polyphenylene oxide was mixed with 1 part of dichloromethane,
It was dissolved at 5% by weight in a solvent mixed with 1 part trichlorethylene and 1 part toluene, and applied by gravure coating onto a 5-micron-thick polyethylene terephthalate substrate with vacuum-deposited aluminum, and heated in a hot air bath at 60°C for 3 seconds. Passed through to dryness. In this case, the thickness of the coating derivative after application and drying is approximately 1 micron, and the surface roughness or maximum thickness is 1.15 μm.
The minimum thickness was 0.9 microns. When a multilayer capacitor was made using the film formed by the method described above, the withstand voltage level was approximately 50, which was excellent.
第1図に本発明の製造方法で作製したコーテイ
ング誘電体膜とジクロルメタン単一で溶解形成し
たコーテイング誘電体膜との耐圧レベルの比較を
示す。 FIG. 1 shows a comparison of breakdown voltage levels between a coating dielectric film produced by the manufacturing method of the present invention and a coating dielectric film formed by dissolving only dichloromethane.
本実施例ではポリフエニレンオキシドを5重量
パーセント溶解したが、3重量パーセント以上で
あれば問題なく、以下の場合溶剤の影響が大きく
均一性、残留溶剤に問題が生じる。さらにコーテ
イング誘電体膜厚も厚く塗布する場合は、本発明
の混合溶剤では、残留溶剤が残りすぎる等の問題
があり、また0.2ミクロン以下の極薄膜となる様
に塗布する場合は、本発明の混合溶剤では溶剤の
乾燥が速くなり過ぎ、得られるコーテイング誘電
体膜の膜厚が不均となる。したがつて、本発明の
混合溶剤ではコーテイング誘電体膜のの膜厚が
0.2〜5ミクロンとなるように塗布する場合には
効果的である。 In this example, 5% by weight of polyphenylene oxide was dissolved, but if it is 3% by weight or more, there is no problem, but in the following cases, the influence of the solvent is large, causing problems with uniformity and residual solvent. Furthermore, when applying a thick coating dielectric film, the mixed solvent of the present invention has problems such as leaving too much residual solvent, and when applying the coating to an extremely thin film of 0.2 microns or less, the present invention If a mixed solvent is used, the solvent dries too quickly and the resulting coating dielectric film has an uneven thickness. Therefore, with the mixed solvent of the present invention, the thickness of the coating dielectric film is
It is effective when applied to a thickness of 0.2 to 5 microns.
発明の効果
以上の様に本発明によれば、ポリフエレンオキ
シドは溶剤に溶解し塗布乾固する方法で薄膜形成
が可能となり、トリクロルエチレンとジクロルメ
タンを溶剤を主成分として使用することにより、
均一でコンデンサ用の誘電体として優れた特性を
得ることができる。Effects of the Invention As described above, according to the present invention, polyphelene oxide can be formed into a thin film by dissolving it in a solvent and applying and drying it, and by using trichlorethylene and dichloromethane as the main components,
It is uniform and has excellent characteristics as a dielectric material for capacitors.
図は本発明のコーテイング誘電体膜の耐圧レベ
ルと単1溶媒で作成したコーテイング誘電体膜の
耐圧レベルを比較して示す図である。
The figure is a diagram showing a comparison between the breakdown voltage level of the coating dielectric film of the present invention and the breakdown voltage level of the coating dielectric film prepared using a single solvent.
Claims (1)
レンを含む混合溶剤にポリフエニレンオキシド樹
脂を3重量パーセント以上溶解してなる塗料を、
金属化フイルム上にポリフエニレンオキシド膜と
して0.2ミクロンから5ミクロン厚で塗布乾固す
ることを特徴とするコーテイング誘電体膜の形成
方法。1 A paint made by dissolving 3% or more of polyphenylene oxide resin in a mixed solvent containing at least dichloromethane and trichloroethylene,
A method for forming a coating dielectric film, which comprises coating a polyphenylene oxide film on a metallized film to a thickness of 0.2 to 5 microns and drying it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4557186A JPS62203318A (en) | 1986-03-03 | 1986-03-03 | Formation of coating dielectric film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4557186A JPS62203318A (en) | 1986-03-03 | 1986-03-03 | Formation of coating dielectric film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62203318A JPS62203318A (en) | 1987-09-08 |
JPH0476487B2 true JPH0476487B2 (en) | 1992-12-03 |
Family
ID=12723030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4557186A Granted JPS62203318A (en) | 1986-03-03 | 1986-03-03 | Formation of coating dielectric film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62203318A (en) |
-
1986
- 1986-03-03 JP JP4557186A patent/JPS62203318A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62203318A (en) | 1987-09-08 |
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