JPH02154424A - Method of washing semiconductor device and the like - Google Patents
Method of washing semiconductor device and the likeInfo
- Publication number
- JPH02154424A JPH02154424A JP30803488A JP30803488A JPH02154424A JP H02154424 A JPH02154424 A JP H02154424A JP 30803488 A JP30803488 A JP 30803488A JP 30803488 A JP30803488 A JP 30803488A JP H02154424 A JPH02154424 A JP H02154424A
- Authority
- JP
- Japan
- Prior art keywords
- water
- washing
- vessel
- pure water
- cleaning tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 4
- 238000000034 method Methods 0.000 title abstract description 5
- 238000005406 washing Methods 0.000 title abstract 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 238000004140 cleaning Methods 0.000 claims description 29
- 230000005484 gravity Effects 0.000 abstract description 5
- 239000000356 contaminant Substances 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011086 high cleaning Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
半導体装置又は半導体製造用治具を純水を使用して洗浄
する洗浄方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cleaning method for cleaning semiconductor devices or semiconductor manufacturing jigs using pure water.
従来の技術 従来の洗浄方法を第2図を用いて説明する。Conventional technology A conventional cleaning method will be explained using FIG. 2.
1は洗浄槽、2は純水を射出するためのノズル、3は射
出された純水の水流、3′は洗浄槽1に溜っている純水
の水流を示す。1 is a cleaning tank, 2 is a nozzle for injecting pure water, 3 is a stream of the injected pure water, and 3' is a stream of pure water stored in the cleaning tank 1.
発明が解決しようとする課題
従来の構成では、洗浄槽1の表層の流速が速いために洗
浄槽1の中央から下層にかけての溜水は水流3゛のよう
な循環を起こし、比重が大きい汚れは洗浄槽外に排出さ
れにり<、時間と共に洗浄槽内の汚れは増加していく。Problems to be Solved by the Invention In the conventional configuration, since the flow velocity on the surface layer of the cleaning tank 1 is high, the accumulated water from the center to the lower layer of the cleaning tank 1 circulates like a water flow of 3゛, and dirt with a large specific gravity is As the dirt is discharged outside the cleaning tank, the amount of dirt inside the cleaning tank increases over time.
本発明はこのような従来の問題を解決し、比重が大きい
汚れを速やかに洗浄槽から排出てき、そのため高い洗浄
効果が持続して得られる洗浄方法を提供するものである
。The present invention solves these conventional problems and provides a cleaning method that quickly discharges dirt with a high specific gravity from the cleaning tank, thereby providing a sustained high cleaning effect.
課題を解決するための手段
本発明は、洗浄槽の底部近傍にノズルを設()、洗浄槽
の純水の表面とほぼ平行に純水を射出するものである。Means for Solving the Problems In the present invention, a nozzle is provided near the bottom of a cleaning tank, and pure water is injected approximately parallel to the surface of the purified water in the cleaning tank.
作用
本発明によれば、ノズルから射出された純水はまず洗浄
槽底面とほぼ平行に流れ、次にその水圧により洗浄槽内
の溜水を上層に押し」二げるために、下層から上層に向
って水の流れができ、比重の大きい汚れも確実に排出さ
れていく。According to the present invention, the pure water injected from the nozzle first flows almost parallel to the bottom of the cleaning tank, and then the water pressure pushes the accumulated water in the cleaning tank to the upper layer, so that the water flows from the lower layer to the upper layer. This creates a flow of water towards the area, ensuring that even heavy dirt is removed.
実施例
以下、本発明の一実施例について第1図を参照しながら
説明する。第1図において、第2図の従来例と同じ部分
には同一の番号を付与し、説明を詳細する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG. In FIG. 1, the same parts as in the conventional example shown in FIG. 2 are given the same numbers and will be described in detail.
4は純水を射出するためのノズルであり、その射出口は
洗浄槽1の底面付近に位置し、水面と平行に設番」られ
ている。5は射出された純水の水流、5′、5“は洗浄
槽内を循環する水流を示す。Reference numeral 4 denotes a nozzle for injecting pure water, and its injection port is located near the bottom of the cleaning tank 1 and is arranged parallel to the water surface. Reference numeral 5 indicates a stream of injected pure water, and 5' and 5'' indicate water streams circulating within the cleaning tank.
前記構成において、ノズル4から射出された純水は洗浄
槽内を上層から上層に向かって斜めに通過し、洗浄槽1
の端からあふれ出て排出されてい比重が大きい汚れが洗
浄槽1の底面に溜っている場合には、前記底面と平行な
水流によって舞い上げられ、水圧により洗浄槽1の表層
へ運搬されて排出される。又、5′、5“は水流5によ
って引き起こされる循環水流であって、洗浄槽1の内側
壁に付着した汚れを舞い上らせ、やはり水流5にのせて
洗浄槽の表層へ運搬し排出される。In the above configuration, the pure water injected from the nozzle 4 passes obliquely from the upper layer to the upper layer in the cleaning tank 1.
If dirt with a large specific gravity accumulates on the bottom of the cleaning tank 1 and is overflowing from the edge of the cleaning tank 1, it will be lifted up by the water flow parallel to the bottom, carried to the surface of the cleaning tank 1 by water pressure, and discharged. be done. Further, 5' and 5'' are circulating water flows caused by the water flow 5, which lift up dirt adhering to the inner wall of the cleaning tank 1, carry it on the water flow 5 to the surface layer of the cleaning tank, and discharge it. Ru.
発明の効果
本発明によれば、洗浄槽内の溜水が常に入れ換わり、し
かも、洗浄槽内の汚れを効率的に排出てきるので、高い
洗浄力を持続することがてきる。Effects of the Invention According to the present invention, the water stored in the cleaning tank is constantly replaced and the dirt in the cleaning tank is efficiently discharged, so that high cleaning power can be maintained.
第1図は本発明の一実施例の概念図、第2図は従来例の
概念図である。
1・・・・・・洗浄槽、4−・・・・・・ノズル、5・
・・・・・水流、5′、5″・・・・・・槽内を循環す
る水流。FIG. 1 is a conceptual diagram of an embodiment of the present invention, and FIG. 2 is a conceptual diagram of a conventional example. 1...Cleaning tank, 4-...Nozzle, 5.
...Water flow, 5', 5''...Water flow circulating in the tank.
Claims (1)
られたノズルを有し、前記ノズルから前記洗浄槽の純水
の表面とほぼ平行に純水を射出することを特徴とする半
導体装置等の洗浄方法。A semiconductor comprising a cleaning tank filled with pure water and a nozzle provided near the bottom of the cleaning tank, and injecting pure water from the nozzle substantially parallel to the surface of the pure water in the cleaning tank. How to clean equipment, etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30803488A JPH02154424A (en) | 1988-12-06 | 1988-12-06 | Method of washing semiconductor device and the like |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30803488A JPH02154424A (en) | 1988-12-06 | 1988-12-06 | Method of washing semiconductor device and the like |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02154424A true JPH02154424A (en) | 1990-06-13 |
Family
ID=17976091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30803488A Pending JPH02154424A (en) | 1988-12-06 | 1988-12-06 | Method of washing semiconductor device and the like |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02154424A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07100443A (en) * | 1993-10-04 | 1995-04-18 | Sankyo Eng Kk | Method and device for cleaning work |
-
1988
- 1988-12-06 JP JP30803488A patent/JPH02154424A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07100443A (en) * | 1993-10-04 | 1995-04-18 | Sankyo Eng Kk | Method and device for cleaning work |
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