JPH02153736A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPH02153736A JPH02153736A JP30749088A JP30749088A JPH02153736A JP H02153736 A JPH02153736 A JP H02153736A JP 30749088 A JP30749088 A JP 30749088A JP 30749088 A JP30749088 A JP 30749088A JP H02153736 A JPH02153736 A JP H02153736A
- Authority
- JP
- Japan
- Prior art keywords
- prepregs
- prepreg
- laminated board
- laminate
- site
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011889 copper foil Substances 0.000 abstract description 6
- 239000005011 phenolic resin Substances 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 238000000748 compression moulding Methods 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 238000003860 storage Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用すられる積層板の製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a laminate used for electronic equipment, electrical equipment, computers, communication equipment, etc.
従来、積層板は紙や合成繊維、ガラス繊維等の織布、不
織布、ペーパー等にフェノール樹脂、エポキシ樹脂、メ
ラミン樹脂、ポリイミド樹脂、不11al、ilJポリ
エステル樹脂、ポリフェニレンオキサイド、フッ素樹脂
、ボ11ブタジェン等の合成硝脂を含授、乾燥してなる
プリプレグの所要枚数に必要に応じてその上面及び又は
下面に銅箔等の金属箔を配設した積層体を1組とし、2
0〜35段程度の多段プレスの各段間に該積層体8〜1
5組を収納して加熱加圧成形して得られるが、プ11プ
レグは全てを同一種類のプリプレグで構成されるもので
はなく、数穐のプリプレグから構成されてbる。例えば
銅箔接着性向上プリプレグ、製造メーカーマーク入りプ
リプレグ等をメインプリプレグと組合せて用いるが、こ
の組合せは全て人手に頼っている。Conventionally, laminates have been made using phenol resins, epoxy resins, melamine resins, polyimide resins, non-11al, ilj polyester resins, polyphenylene oxides, fluororesins, bo-11-butadiene, etc. on woven fabrics, non-woven fabrics, paper, etc. such as paper, synthetic fibers, and glass fibers. One set consists of a laminate consisting of the required number of prepregs impregnated with synthetic nitric resin and dried, with metal foil such as copper foil arranged on the upper and/or lower surfaces as necessary, and 2
The laminate 8 to 1 is placed between each stage of a multi-stage press of about 0 to 35 stages.
Although it is obtained by storing 5 sets of prepregs and molding them under heat and pressure, the 11 pregs are not all composed of the same type of prepreg, but are composed of several sets of prepregs. For example, a prepreg with improved copper foil adhesion, a prepreg with a manufacturer's mark, etc. are used in combination with the main prepreg, but this combination is all done manually.
従来の技術で述べたように教程のプリプレグを人手で組
合せて多数作成することは複雑で作業効率も低く、乾燥
機からの所要寸法に力・vhされた多量のプリプレグを
保管する恒温恒湿の保管スペース、保管中のプリプレグ
品質の変化は問題となっていた。本発明は従来の技術に
おける上述の問題点に鑑みてなされたもので、その目的
とするところはプ11プレグ組合せ工程の簡略化、動車
アップ及びプ11プレグ保管スペースの縮少化、ブリプ
レグの変質防止が可能となる槓ノー板の製造方法を提供
することにある。As mentioned in the conventional technology section, it is complicated to manually combine and create a large number of prepregs, and the work efficiency is low. Storage space and changes in prepreg quality during storage were problems. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its objectives are to simplify the process of assembling the P11 preg, to increase the size of the moving vehicle and to reduce the storage space of the P11 preg, and to change the quality of the Buri preg. It is an object of the present invention to provide a method for manufacturing a ram no board that can prevent such damage.
本発明はサブプリプレグ1〜2枚上に、乾燥機から連続
的、に移行されてくる所要枚数のメインプリプレググを
重ね、更にその最上面及び又は最下面に金属箔を配設し
たM屠体を加熱加圧成形することを特徴とする積層板の
製造方法のため、和合せ工程の簡略、効率アップができ
、且つ数置の圧倒的に多いメインプリプレグの保管スペ
ースが不要となるため省スペースとプリプレグ変質を防
止することができたもので、以下本発明を図示実施例に
もとづ込て説明する。The present invention is an M carcass in which a required number of main prepregs continuously transferred from a dryer are layered on top of one or two subprepregs, and metal foil is further arranged on the top and/or bottom surfaces of the main prepregs. The manufacturing method of laminates is characterized by heat-pressure molding, which simplifies and improves the efficiency of the joining process, and saves space by eliminating the need for storage space for the overwhelmingly large number of main prepregs. The present invention will be explained below based on the illustrated embodiments.
実施例
第1図は本発明の一実施例にかかわる積層板の製造方法
の簡略工程図である。Embodiment FIG. 1 is a simplified process diagram of a method for manufacturing a laminate according to an embodiment of the present invention.
厚さ0.21m、 1050 X 1050酊の製造
メーカーマーク入すフエノール樹脂プ11プレグの置場
1から該プ11プレグ1枚をスベリ台2で組合せ場3に
送り1次いでその上に乾燥機4から連続的に力”Jター
5で1050 X 1050 flに切断されて移行し
てくる厚す0.2 vrxのフェノール樹脂プリプレグ
6の7枚をベルトコンベア7で重ね、更にその最上面に
厚さ0.03511M 、 1050X 1050
ffの接盾剤付銅箔のta場8から該銅箔1枚を千ヤ、
ソキング方式9で載置した積層体を成形圧力100 K
Q/d、160℃で60分間加熱加圧成形して厚さ1.
6朋の片面銅張槓増板を得た。0.21 m thick, 1050 x 1050 phenol resin resin with manufacturer's mark 11 From the preg storage area 1, one sheet of the phenolic resin preg is sent to the assembly area 3 on the sliding table 2. Seven sheets of phenolic resin prepreg 6 with a thickness of 0.2 vrx, which are continuously cut into 1050 x 1050 fl with a force-cutting machine 5, are piled up on a belt conveyor 7, and a layer with a thickness of 0.0 fl is placed on the top surface. .03511M, 1050X 1050
1000 pieces of copper foil from ta field 8 of copper foil with shielding agent of ff.
The laminate placed by soaking method 9 was molded under a molding pressure of 100 K.
Q/d, heated and pressure molded at 160°C for 60 minutes to a thickness of 1.
I got a 6-inch single-sided copper-clad laminate board.
本発明は上述した如く構成されて粘る。特許請求の範囲
第1項に記載した構成を有するプ11プレグの組合せ方
法におりでは、工程の簡略、効率アップ及びプ電1プレ
グ&管スペースの縮少化、プリプレグの変質を防止する
効果がある。The present invention is constructed and operated as described above. The method of combining prepregs having the structure described in claim 1 has the effect of simplifying the process, increasing efficiency, reducing the space of the prepreg and tube, and preventing deterioration of the prepreg. be.
;8A1図は本発明の績J輪板の製造方法の一実施例を
示す簡略工程図である。
1はマーク入リプ17プレグ置場、2はスペ11台3は
組合せ場、4は乾燥機、5は力・ンター 6はメインプ
リプレグ、7はベルトコンベア、8は銅箔電場、9はチ
ャーjキングである。
第1図Figure 8A1 is a simplified process diagram showing one embodiment of the method for manufacturing a J-wheel plate of the present invention. 1 is marked prepreg 17 preg storage area, 2 is 11 spares, 3 is combination area, 4 is dryer, 5 is power/interval, 6 is main prepreg, 7 is belt conveyor, 8 is copper foil electric field, 9 is charring It is. Figure 1
Claims (1)
に移行されてくる所要枚数のメインプリプレグを重ね、
更にその最上面及び又は最下面に金属箔を配設した積層
体を加熱加圧成形することを特徴とする積層板の製造方
法。(1) Lay the required number of main prepregs that are continuously transferred from the dryer on top of 1 to 2 sub prepregs,
A method for manufacturing a laminate, which further comprises heating and press-molding a laminate having a metal foil disposed on the uppermost surface and/or the lowermost surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30749088A JPH02153736A (en) | 1988-12-05 | 1988-12-05 | Manufacture of laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30749088A JPH02153736A (en) | 1988-12-05 | 1988-12-05 | Manufacture of laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02153736A true JPH02153736A (en) | 1990-06-13 |
Family
ID=17969717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30749088A Pending JPH02153736A (en) | 1988-12-05 | 1988-12-05 | Manufacture of laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02153736A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108207077A (en) * | 2016-12-19 | 2018-06-26 | 台光电子材料股份有限公司 | Combination system and manufacturing method thereof |
-
1988
- 1988-12-05 JP JP30749088A patent/JPH02153736A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108207077A (en) * | 2016-12-19 | 2018-06-26 | 台光电子材料股份有限公司 | Combination system and manufacturing method thereof |
JP2018099877A (en) * | 2016-12-19 | 2018-06-28 | 台光電子材料股▲ふん▼有限公司 | Assembly arrangement system and assembly manufacturing method |
CN108207077B (en) * | 2016-12-19 | 2020-03-10 | 台光电子材料股份有限公司 | Combination system and manufacturing method thereof |
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