JPH07326863A - Manufacture of multilayered copper clad laminate - Google Patents

Abstract

PURPOSE:To protect a circuit pattern against deformation by a method wherein multilayered copper clad laminate inner members are provided in layers onto a copper foil as separated from each other, another copper foil is laid on them and all the laminated components are thermocompressed into a multilayered laminate of integral structure. CONSTITUTION:N sets of prepregs 21, 22... and prepregs 41, 42... as the inner members of a four-layered copper plated laminate are successively piled up in layers in this sequence on a copper foil 1 providing a space (5 to 15mm or so) between them, a copper foil 5 as an outer member is piled up on them, and all the piled up components are thermocompressed as sandwiched in between hot platens. The resin component of prepreg is melted and turned fluid, and as the fluid resin is made to flow to a vacant space provided between the adjacent inner members between the copper foils 1 and 5 by a pressure applied by the hot platens, pressure becomes uniform through a thermocompressed laminate as a whole. The fluid resin is cured by reaction as the compressed laminate is kept in this state, so that n sets of the inner members are turned into a flat plate of integral structure, and an inner circuit pattern is less deformed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a multilayer copper clad laminate.

[0002]

2. Description of the Related Art In order to obtain a multi-layered copper-clad laminate by arranging a number of in-house materials for the multi-layered copper-clad laminate in a plane, a conventional multi-layered copper-clad laminate is manufactured by using the An appropriate number of internal lumbers (two in the figure) on copper foil 6 that is lumber
Of prepregs 7 are stacked, and a plurality of sets of inner-layer double-sided circuit boards 8 ₁ , 8 ₂ , ..., 8 _n, which are inner lumbers, are arranged in a plane on the prepreg 7, and an appropriate number of inner lumbers (not shown) (2 sheets) prepreg 9 is stacked, and copper foil 10 as an external material is stacked on it.
Was used, and the whole was heated and pressed to form a four-layered laminated body. In this manufacturing method, there is a problem that a large number of sets of inner layer circuit boards arranged in a plane radially swell due to temperature and pressure, and the circuit pattern is deformed. The tendency is that the thinner the inner layer circuit board is, the more it deforms. However, there is a problem that the deformation becomes larger as the number of layers becomes higher and the number of layers becomes thinner or thinner, and this directly causes defects.

[0003]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention arranges a plurality of pairs of in-house materials for a multi-layer copper-clad laminate on a copper foil and arranges them in a plane at intervals. The copper foils were stacked on top of each other, and the whole was heated and pressed so that the layers were laminated and integrated.

[0004]

When the prepreg resin is softened and flows in the process of heating and pressurizing the whole and integrating the layers into a multilayer structure, it is located between the lower copper foil and the upper copper foil, which are external materials, and the internal material. By making it flow into the space created by the space between the inner lumber and the inner lumber, pressure unevenness of the applied pressure is less likely to occur,
As a result, the deformation of the inner layer circuit pattern can be reduced. Further, this also makes it possible to reduce misalignment between the high-multilayer layers. If the distance between the inner lumber and the inner lumber is narrow, the positional deviation is large, and the reduction rate of the positional deviation becomes large at the boundary of about 5 mm and decreases to about 15 mm, but beyond that, there is not much change. It will not occur.

The present invention will be described below with reference to the drawings.
FIG. 1 shows a combination of inner and outer lumbers and their arrangement in the case of a four-layer copper clad laminate for explaining the present invention. As the inner timber for 4-layered copper-clad laminate, a prepreg 2 _1, the inner layer double-sided circuit board 3
₁ and prepreg 4 ₁ are stacked in this order to form a first set, and n (n is a positive integer of 2 or more) sets of such internal lumber are flatly spaced on the copper foil 1 as the external lumber ( 5-15m
m) are provided and arranged, and the copper foil 5, which is an externally manufactured material, is stacked on this. When a combination of such internal and external lumber is placed and sandwiched between hot plates and heated and pressed, the resin component of the prepreg melts and softens and flows. Since it also flows into the space between the foil 1 and the upper copper foil 5 and between the inner lumber and the adjacent inner lumber (about 5 to 15 mm), the pressure unevenness of the applied pressure as a whole Since the number of the inner layers is reduced and the reaction curing is performed in this state, it is possible to obtain a four-layer copper-clad laminate in which the inner layer circuit pattern in which the n sets of inner lumbers are integrated in a plane is less deformed. A 4-layer copper-clad laminate in which n sets of in-house lumbers are flatly integrated can be subsequently cut into in- lumber units to obtain n 4-layer copper-clad laminates.

[0006]

As described above, according to the present invention, the inner layer circuit pattern is less deformed at the end of each set of multilayer copper clad laminates in which a large number of internal lumbers are arranged in a plane and laminated and integrated. Further, there is an effect that the positional deviation between the inner layers of the multilayer copper clad laminates of each set is reduced.

[Brief description of drawings]

FIG. 1 is an end view for explaining a combination and arrangement of inner and outer lumber in the case of a four-layer copper clad laminate of the present invention.

FIG. 2 is an end view for explaining a combination and an arrangement of inner and outer lumber in the case of a conventional four-layer copper clad laminate.

[Explanation of symbols]

1 ... Copper foil 2 ₁ , 2 ₂ , ~, 2 _n ... Respective prepreg 3 ₁ , 3 ₂ , ~, 3 _n ... Respective inner-sided double-sided circuit board 4 ₁ , 4 ₂ , ~, 4 _n ... Respective prepreg 5 ... Copper Foil 6 ... Copper foil 7 ... Prepreg 8 ₁ , 8 ₂ , ..., 8 _n ... Double-sided circuit board for inner layer 9 ... Prepreg 10 ... Copper foil

Claims (3)

[Claims] 1. An inner material for a multilayer copper-clad laminate is arranged on a copper foil in a plane with a plurality of sets provided at intervals, the copper foil is stacked on the inner material, and the whole is heated and pressed to form a multilayer laminated laminate. A method for producing a multi-layered copper-clad laminate, comprising: 2. The method for producing a multilayer copper-clad laminate according to claim 1, wherein an appropriate number of inner-layer circuit boards are included as the inner lumber. 3. The method for producing a multilayer copper-clad laminate according to claim 2, wherein the inner-layer circuit board has a thickness of 0.3 mm or less.