JPH03254191A - Manufacture of multilayer wiring board - Google Patents

Abstract

PURPOSE:To improve work efficiency by arranging a resin layer at each upside and/or downside of a required number of inner layer materials where circuits are made, and fastening the whole with a binder, and then arranging outer layer materials at the outermost sides so as to complete a laminate. CONSTITUTION:A resin layer is arranged at each upside and/or downside of a required number of inner layer materials where circuits are made, and the whole is fastened with a binder, and then outer layer materials are arranged at the outermost sides so as to complete a laminate. As the resin layer arranged at the upside and/or downside of the inner layer material, the application layer of resin, the base material impregnated with resin, or the like is used, and the binder is a stapler, staple, or the like such as aluminum, copper, polycarbonate, polypropylene, etc. And as the outer layer material, a laminate whose one side or both sides are lined with a metallic foil or a metallic foil is used, and those are laminated by a press, or the like. Hereby, work efficiency improves.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a multilayer wiring board used in electronic/electrical equipment, computers, communication equipment, etc.

(Prior art) A conventional multilayer wiring board has a resin layer on the top and/or bottom of each inner layer material on which a required number of circuits are formed, and an outer layer material on the outermost side. Misalignment during lamination molding is prevented by storing the product in a molding misalignment prevention container and performing laminated molding, or by punching through holes in the four corners of the laminate and inserting molding misalignment prevention bins. However, for the former, it is necessary to change the frame and container every time the molding size and molding thickness change, and keeping the necessary number at all times reduces work efficiency, and for the latter, it is necessary to change the frame and container every time the molding size and molding thickness change. In addition, it is necessary to prepare forming plates to be placed above and below the laminate, and in addition, the forming plates used at this time are laminated, and changes in the thickness of the laminate before and after forming must be adjusted by plate thickness. The thickness of the molded plate must be large, which poses a problem of lowering workability.

[Problem that the invention seeks to solve]

As described in the prior art section, the conventional method for preventing molding misalignment has the problem of poor working efficiency.

The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a method for manufacturing a multilayer wiring board with high work efficiency.

[Means to solve the problem]

The present invention involves disposing a resin layer on the upper and/or lower surfaces of each inner layer material having a required number of circuits formed thereon, fixing the entire structure with a binding tool, and then laminating and molding a laminate with an outer layer material disposed on the outermost side. The method for manufacturing a multilayer wiring board characterized by the above is used to prevent molding misalignment, is lightweight and simple, and is therefore able to achieve the above objects.The present invention will be described in detail below.

Inner layer materials used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin,
Melamine resin, polyimide, polybutadiene, polyamide, polyamide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyethylene terephthalate, fluorinated resin, etc. alone, modified products, and mixtures of resins, paper, glass cloth, and glass. An electric circuit is formed on a single-sided or double-sided metal foil-clad laminate made of a base material such as nonwoven fabric, synthetic fiber cloth, synthetic fiber nonwoven fabric, or cotton, and single, alloy, or composite foil of copper, aluminum, iron, nickel, zinc, etc. It is something. As the resin layer disposed on the upper surface and/or lower surface of the inner layer material, single or composite layers such as a coating layer of the above resin, a resin-impregnated base material layer, a resin sheet layer, etc. are used, but preferably the resin layer thickness can be easily made uniform. It is desirable to use a resin-impregnated substrate. The fasteners include staplers, staples, hooks, etc. made of metals such as aluminum, copper, nickel, iron, zinc, lead, etc. alone or alloys, or plastics such as polycarbonate, polypropylene, polyester, polyphenylene sulfide, etc. Single-sided metal foil clad laminates or metal foil are used as the outer layer material, and laminated molding methods include press, multi-stage press,
It may be laminated under pressure or pressureless laminated using multi-rolls, double belts, etc., and is not particularly limited.

The present invention will be explained below based on examples.

〔Example〕

Electric circuits are formed on both sides of a double-sided copper-clad glass cloth base epoxy resin laminate with a thickness of 0.811II11 as an inner layer material,
After placing two pieces of epoxy resin-impregnated glass cloth each with a thickness of 0.1 mm on the top and bottom surfaces of the inner layer material, the four corners of the whole were fixed with iron staplers, and then copper foil with a thickness of 35 microns was placed on the outermost side of each piece. The resulting laminate was molded at a pressure of 30 kg/c1iI.
, and laminated at 165° C. for 90 minutes to obtain a four-layer wiring board.

[Comparative Example 1] After placing the same resin-impregnated base material as in the example on the upper and lower surfaces of the same inner layer material as in the example, a laminate in which the same outer layer material as in the example was placed on the outermost side was molded from iron. A four-layer wiring board was obtained by processing in the same manner as in the example except that it was stored in a slip-preventing container.

[Comparative Example 2] A four-layer wiring board was prepared in the same manner as in Example except that through holes were made in the four corners of the same laminate as in Comparative Example 1, molding misalignment prevention pins were inserted, and an appropriate molding plate was used. I got it.

The working efficiency of the four-layer wiring boards of Examples and Comparative Examples 1 and 2 is shown in Table 1.

Table 1 *This is the ratio when Comparative Example 2 is set as 100.

〔Effect of the invention〕

The present invention is constructed as described above. The method for manufacturing a multilayer wiring board having the structure described in the claims has the effect of improving work efficiency.

Claims (1)

[Claims] (1) After placing a resin layer on the upper and/or lower surfaces of each of the required number of inner layer materials on which circuits have been formed, the whole is fixed with a binding tool, and then a laminate with an outer layer material arranged on the outermost side is laminated and molded. A method for manufacturing a multilayer wiring board, characterized by: