JPH02152293A - Printed wiring board of electronic instrument - Google Patents
Printed wiring board of electronic instrumentInfo
- Publication number
- JPH02152293A JPH02152293A JP30644488A JP30644488A JPH02152293A JP H02152293 A JPH02152293 A JP H02152293A JP 30644488 A JP30644488 A JP 30644488A JP 30644488 A JP30644488 A JP 30644488A JP H02152293 A JPH02152293 A JP H02152293A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- board
- parts
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000994 depressogenic effect Effects 0.000 abstract 1
- 239000002699 waste material Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電気機器等に利用するプリント配線基板に関す
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board used in electrical equipment and the like.
従来の技術
従来例として第３図、第４図を説明する。１枚で構成し
たプリント配線基板９内に設けられた複数のプリント配
線基板部１０．１１を互いに分割して使用できるように
構成しである。Ｉ２はスリット、１３は接続部を示す。BACKGROUND ART FIGS. 3 and 4 will be explained as conventional examples. The structure is such that a plurality of printed wiring board parts 10, 11 provided in a single printed wiring board 9 can be used by dividing them from each other. I2 indicates a slit, and 13 indicates a connecting portion.
接続部１３は一般にミシン目又はｖ字型のミゾとし、そ
れぞれのプリント配線基板部をこれらスリット！２と接
続部１３から分割して使用できるようになっている。The connection portion 13 is generally a perforation or a V-shaped groove, and each printed wiring board portion is formed by these slits! 2 and the connecting portion 13 can be separated and used.
発明が解決しようとする課題
しかし、上記のような従来のプリント配線基板９では、
隣接されたプリント配線基板部１０．１１同志において
、ミシン目による接続部１３を公然して、プリント配線
基板部を分割すると、それぞれのプリント配線基板部の
端面に凹凸が生じて出っ張り部が残る。従って、特に小
型を要求されている電気機器においては、この出っ張り
部が存在することによって機器の小型化が制限される。Problems to be Solved by the Invention However, in the conventional printed wiring board 9 as described above,
When adjacent printed wiring board parts 10 and 11 are divided by exposing the connection part 13 by the perforation, unevenness is generated on the end face of each printed wiring board part and a protruding part remains. Therefore, especially in electrical equipment that is required to be compact, the presence of this protrusion restricts the miniaturization of the equipment.
又ミシン目の代りに７字型のミゾによる接続部の場合、
プリント配線基板のプレス打抜き後の工程でＶ字型ミゾ
加工を施すため、プリント配線基板の製造工程数が増加
してしまうという問題点がある。Also, in the case of a connection with a 7-shaped groove instead of a perforation,
Since V-shaped grooves are formed in a process after the printed wiring board is press punched, there is a problem in that the number of manufacturing steps for the printed wiring board increases.
本発明の目的は上記のような従来の問題点を解決し、隣
接したプリント配線基板部のミシン目による接続部の形
体を変えることにより、分割時にそれぞれのプリント配
線基板部の端面より出っ張らないようにし、接続部にす
て基板を設けて、機器の小型化を図ることができるプリ
ント配線基板を提供しようとするものである。The purpose of the present invention is to solve the above-mentioned conventional problems, and by changing the shape of the connection part formed by the perforation of adjacent printed wiring board parts, it is possible to avoid protruding from the end face of each printed wiring board part when dividing. The present invention aims to provide a printed wiring board that can reduce the size of equipment by providing a waste board at the connecting portion.
課題を解決するための手段
本発明は上記目的を達成するために、１枚で構成された
プリント配線基板内に複数のプリント配線基板部を互い
に分割して使用できるように設け、隣接したプリント配
線基板部の接続部に境界線上のスリットから連続して相
対する凹状ミシン目を設けて接続部を有するすて基板と
した電気機器のプリント配線基板とした。Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides a plurality of printed wiring board parts in a single printed wiring board so that they can be divided and used, and adjacent printed wiring board parts are provided so that they can be used separately. A printed wiring board for an electrical device was obtained by providing a concave perforation continuously opposing a slit on the boundary line in the connecting part of the board part, thereby making the base board having the connecting part.
作 用
本発明によれば、隣接したプリント配線基板部をミシン
目から分割した際、分割されたそれぞれのプリント配線
基板部の端面はスリットによる境界線上の直線と、この
直線に連続した凹状ミシン目からの凹部となって出っ張
ることがない。隣接する凹状ミシン目によりすて基板と
なっているので、このすて基板はプリント配線基板部を
分割した舊は捨てられるが、このすて基板上の一つ又は
複数の接続部は分割時に分離し易くする作用がある。According to the present invention, when adjacent printed wiring board parts are divided from a perforation, the end faces of each divided printed wiring board part are formed by a straight line on the boundary line formed by the slit, and a concave perforation continuous to this straight line. There will be no protrusion due to concave parts. Since the adjacent concave perforations make it a waste board, the part of the printed wiring board part of this waste board is discarded, but one or more connections on this waste board are separated when it is separated. It has the effect of making it easier.
実施例
第１図は本発明のプリント配線基板の一実施例を示すも
のである。■は１枚で構成さねたプリント配線基板、２
．３は複数のプリント配線基板部で、プリント配線基板
ｌ内で、それぞれ分割して使用できるよう境界線上にス
リット４を設けである。５は凹状ミシン目で、前記スリ
ット４から連続し、一つ又は複数の接続部６．７を有す
る。８はすて基板で、凹状ミシン目５で囲まれ、分割時
には接続部６．７の個数によって分離し易くなっている
。Embodiment FIG. 1 shows an embodiment of the printed wiring board of the present invention. ■ is a printed wiring board consisting of one piece, two
．． Reference numeral 3 denotes a plurality of printed wiring board sections, each of which has slits 4 on its boundary lines so that the printed wiring board 1 can be divided and used. 5 is a concave perforation which continues from the slit 4 and has one or more connections 6.7. Reference numeral 8 denotes a waste board, which is surrounded by concave perforations 5, and is made easy to separate depending on the number of connecting parts 6 and 7 when dividing.
上記のようにプリント配線基板部２．３はスリット４で
分離可能となっているが、このスリット４に連続した凹
状ミシン目５の接続部６％７とすて基板８により通常は
接続されている。そして、これらプリント配線基板部２
．３を分割した際、それぞれのプリント配線基板部の端
面より、ミシン目の分割部分が出っ張らないように凹状
ミシン目によりそれぞれのプリント配線基板部端面が凹
むようになっている。As mentioned above, the printed wiring board part 2.3 can be separated by the slit 4, but it is usually connected by the board 8 as a connecting part 6%7 of the concave perforation 5 continuous with the slit 4. There is. And these printed wiring board parts 2
．． 3, the end faces of the respective printed wiring board parts are recessed by concave perforations so that the divided parts of the perforations do not protrude from the end faces of the respective printed wiring board parts.
」二記の実施例によれば、複数のプリント配線基板部の
ミシン目による接続部が、それぞれの基板部の端面より
凹むように設けられているため、分割した際、それぞれ
の基板の端面より出っ張ることがなく、基板部側面まで
筐体等を近接させることができるため、従来より一層の
機器の小型化が図れるという効果を有する。According to the embodiment described in 2, the connection portions formed by the perforations of the plurality of printed wiring board parts are provided so as to be recessed from the end faces of each board part, so that when divided, the connection parts by the perforations of the plural printed wiring board parts are recessed from the end faces of each board part. Since there is no protrusion and the casing etc. can be brought close to the side surface of the board part, it has the effect that the device can be further miniaturized than in the past.
叉、この実施例によれば、両基板部のミシン目による接
続部の接続個数をプリント配線箔板部２側について１ケ
所、プリント配線基板部３側については２ケ所とし、基
板分割の際の割りやすさを改良した。実施例では、プリ
ント配線基板部２及び３の間を分割すると先ずプリント
配線箔板部２側と凹状ミシン部５に設けられたすて基板
８との接続部６が１ケ所の側が割れ、プリント配線基板
部３側とすて基板８との接続部７の部分を次のプロセス
によって分割するようにすることにより分割し易いとい
う効果が得られる。According to this embodiment, the number of connections made by the perforations of both board parts is one on the printed wiring foil plate part 2 side and two on the printed wiring board part 3 side, so that the number of connections made by the perforations of both board parts is set to one on the printed wiring foil board part 2 side and two on the printed wiring board part 3 side. Improved ease of splitting. In this embodiment, when the printed wiring board parts 2 and 3 are divided, the connection part 6 between the printed wiring foil board part 2 side and the stub board 8 provided in the concave perforation part 5 breaks at one place, and the printed wiring board parts 2 and 3 are separated. By dividing the connection portion 7 with the substrate 8 on the side of the wiring board portion 3 through the following process, an effect of easy division can be obtained.
発明の効果
本発明は上記のようにプリント配線基板を構成する複数
のプリント配線基板部の接続部がそれぞれの基板の境界
線上より凹んだ凹状ミシン目で構成され、その中にすて
基板を設けている。このすて基板は分割した場合、それ
ぞれの分割面がスリット而より凹み、それぞれのプリン
ト配線基板部の端面より出っ張らない。従って、基板側
面まで筐体等を近接させることができ、従来より一層の
機器の小型化を図ることができる効果を有する。Effects of the Invention As described above, the present invention provides a method in which the connecting portions of a plurality of printed wiring board parts constituting a printed wiring board are configured with concave perforations recessed from the boundary line of each board, and a waste board is provided in the connection parts. ing. When this waste board is divided, each divided surface is recessed from the slit and does not protrude from the end surface of each printed wiring board portion. Therefore, the casing etc. can be brought close to the side surface of the board, which has the effect of making the device even more compact than before.
又、凹状ミシン目による接続部の個数をそれぞれ異にす
ることにより、それぞれの基板部を分割する際に割り易
くする効果もある。Furthermore, by varying the number of connection parts formed by concave perforations, there is an effect of making it easier to divide each board part.
【図面の簡単な説明】
第１図は本発明の一実施例を示すプリント配線基板の平
面図、第２図は分割した状態を示す平面図、第３図は従
来のプリント配線基板の平面図、第４図は同分割した状
態を示す平面図である。
！・・・プリント配線基板
２．３・・・プリント配線基板部[Brief Description of the Drawings] Fig. 1 is a plan view of a printed wiring board showing an embodiment of the present invention, Fig. 2 is a plan view showing a divided state, and Fig. 3 is a plan view of a conventional printed wiring board. , FIG. 4 is a plan view showing the divided state. ! ...Printed wiring board 2.3...Printed wiring board part
Claims (1)
リント配線基板部を互いに分割して使用できるように設
け、隣接したプリント配線基板部の接続部に境界線上の
スリットから連続して相対する凹状ミシン目を設けて接
続部を有するすて基板としたことを特徴とする電気機器
のプリント配線基板。(1) A plurality of printed wiring board parts are provided in a single printed wiring board so that they can be divided and used, and the connecting parts of adjacent printed wiring board parts are connected continuously from the slit on the boundary line. What is claimed is: 1. A printed wiring board for electrical equipment, characterized in that the board is provided with concave perforations and has a connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30644488A JPH02152293A (en) | 1988-12-02 | 1988-12-02 | Printed wiring board of electronic instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30644488A JPH02152293A (en) | 1988-12-02 | 1988-12-02 | Printed wiring board of electronic instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02152293A true JPH02152293A (en) | 1990-06-12 |
Family
ID=17957075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30644488A Pending JPH02152293A (en) | 1988-12-02 | 1988-12-02 | Printed wiring board of electronic instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02152293A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03106771U (en) * | 1990-02-21 | 1991-11-05 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58459B2 (en) * | 1979-01-10 | 1983-01-06 | アキレス株式会社 | Method for producing urethane-modified isocyanurate foam |
| JPS5834759B2 (en) * | 1974-07-17 | 1983-07-28 | シャープ株式会社 | Shitsuki Kokantaino Seizouhouhou |
| JPS6357766B2 (en) * | 1984-07-11 | 1988-11-14 | Sankyo Seiki Seisakusho Kk |
-
1988
- 1988-12-02 JP JP30644488A patent/JPH02152293A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834759B2 (en) * | 1974-07-17 | 1983-07-28 | シャープ株式会社 | Shitsuki Kokantaino Seizouhouhou |
| JPS58459B2 (en) * | 1979-01-10 | 1983-01-06 | アキレス株式会社 | Method for producing urethane-modified isocyanurate foam |
| JPS6357766B2 (en) * | 1984-07-11 | 1988-11-14 | Sankyo Seiki Seisakusho Kk |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03106771U (en) * | 1990-02-21 | 1991-11-05 |
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