JPH02146861U - - Google Patents
Info
- Publication number
- JPH02146861U JPH02146861U JP5517889U JP5517889U JPH02146861U JP H02146861 U JPH02146861 U JP H02146861U JP 5517889 U JP5517889 U JP 5517889U JP 5517889 U JP5517889 U JP 5517889U JP H02146861 U JPH02146861 U JP H02146861U
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- slit
- wiring board
- slits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例における切断前の状態
を示す上面図、第２図は接続部の拡大図、第３図
は他の実施例における接続部の拡大図、第４図は
従来の例を示す上面図、第５図は切断部の状態を
示した説明図である。
１……基板材料、２……基板、２ａ……基板外
縁に沿う基準線、３……スリツト、４……接続部
、５……バリ、６……切断部、７……プリント配
線、８……スルーホール、９……被覆である。
Fig. 1 is a top view showing the state before cutting in the embodiment of the present invention, Fig. 2 is an enlarged view of the connection part, Fig. 3 is an enlarged view of the connection part in another embodiment, and Fig. 4 is the conventional FIG. 5, which is a top view showing an example, is an explanatory view showing the state of the cutting section. 1... Board material, 2... Board, 2a... Reference line along the outer edge of the board, 3... Slit, 4... Connecting section, 5... Burr, 6... Cutting section, 7... Printed wiring, 8 ...Through hole, 9...Coating.
Claims (1)
トを設け、このスリツト端相互間の接続部を切断
して得られるプリント配線基板において、基板面
に接続部両側のスリツト端にまたがる導体パター
ンを設けたことを特徴とするプリント配線基板。 ２ 基板の外縁に沿つて複数個に分割したスリツ
トを設け、このスリツト端相互間の接続部を切断
して得られるプリント配線基板において、前記接
続部のスリツト端より基板内側にスルーホールを
設け、基板面に前記接続部両側のスリツト端およ
びスルーホールにまたがる導体パターンを設けた
ことを特徴とするプリント配線基板。[Claims for Utility Model Registration] 1. In a printed wiring board obtained by providing a plurality of divided slits along the outer edge of the board and cutting the connection parts between the ends of the slits, the board surface has a slit on both sides of the connection part. A printed wiring board characterized by having a conductor pattern extending over the slit end. 2. In a printed wiring board obtained by providing a plurality of divided slits along the outer edge of the board and cutting the connecting portions between the ends of the slits, a through hole is provided inside the board from the slit ends of the connecting portions, 1. A printed wiring board, characterized in that a conductor pattern is provided on the board surface spanning the slit ends and the through holes on both sides of the connection part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5517889U JPH02146861U (en) | 1989-05-11 | 1989-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5517889U JPH02146861U (en) | 1989-05-11 | 1989-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146861U true JPH02146861U (en) | 1990-12-13 |
Family
ID=31577898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5517889U Pending JPH02146861U (en) | 1989-05-11 | 1989-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146861U (en) |
-
1989
- 1989-05-11 JP JP5517889U patent/JPH02146861U/ja active Pending