JPH02146844U - - Google Patents
Info
- Publication number
- JPH02146844U JPH02146844U JP1989053341U JP5334189U JPH02146844U JP H02146844 U JPH02146844 U JP H02146844U JP 1989053341 U JP1989053341 U JP 1989053341U JP 5334189 U JP5334189 U JP 5334189U JP H02146844 U JPH02146844 U JP H02146844U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- tube
- gas
- liquid
- radiated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989053341U JPH02146844U (ko) | 1989-05-08 | 1989-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989053341U JPH02146844U (ko) | 1989-05-08 | 1989-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146844U true JPH02146844U (ko) | 1990-12-13 |
Family
ID=31574444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989053341U Pending JPH02146844U (ko) | 1989-05-08 | 1989-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146844U (ko) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060137A (ja) * | 2001-08-08 | 2003-02-28 | Ibiden Co Ltd | モジュール用基板 |
| JP2006303290A (ja) * | 2005-04-22 | 2006-11-02 | Mitsubishi Electric Corp | 半導体装置 |
| JP2008028053A (ja) * | 2006-07-20 | 2008-02-07 | Hitachi Ltd | 樹脂モールド型電力用半導体装置 |
| JP4737885B2 (ja) * | 2001-08-08 | 2011-08-03 | イビデン株式会社 | モジュール用基板 |
| JP2013183021A (ja) * | 2012-03-01 | 2013-09-12 | Toyota Industries Corp | 冷却器 |
-
1989
- 1989-05-08 JP JP1989053341U patent/JPH02146844U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060137A (ja) * | 2001-08-08 | 2003-02-28 | Ibiden Co Ltd | モジュール用基板 |
| JP4737885B2 (ja) * | 2001-08-08 | 2011-08-03 | イビデン株式会社 | モジュール用基板 |
| JP2006303290A (ja) * | 2005-04-22 | 2006-11-02 | Mitsubishi Electric Corp | 半導体装置 |
| JP2008028053A (ja) * | 2006-07-20 | 2008-02-07 | Hitachi Ltd | 樹脂モールド型電力用半導体装置 |
| JP2013183021A (ja) * | 2012-03-01 | 2013-09-12 | Toyota Industries Corp | 冷却器 |