JPH02146844U - - Google Patents
Info
- Publication number
- JPH02146844U JPH02146844U JP1989053341U JP5334189U JPH02146844U JP H02146844 U JPH02146844 U JP H02146844U JP 1989053341 U JP1989053341 U JP 1989053341U JP 5334189 U JP5334189 U JP 5334189U JP H02146844 U JPH02146844 U JP H02146844U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- tube
- gas
- liquid
- radiated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989053341U JPH02146844U (enExample) | 1989-05-08 | 1989-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989053341U JPH02146844U (enExample) | 1989-05-08 | 1989-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146844U true JPH02146844U (enExample) | 1990-12-13 |
Family
ID=31574444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989053341U Pending JPH02146844U (enExample) | 1989-05-08 | 1989-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146844U (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060137A (ja) * | 2001-08-08 | 2003-02-28 | Ibiden Co Ltd | モジュール用基板 |
| JP2006303290A (ja) * | 2005-04-22 | 2006-11-02 | Mitsubishi Electric Corp | 半導体装置 |
| JP2008028053A (ja) * | 2006-07-20 | 2008-02-07 | Hitachi Ltd | 樹脂モールド型電力用半導体装置 |
| JP2013183021A (ja) * | 2012-03-01 | 2013-09-12 | Toyota Industries Corp | 冷却器 |
-
1989
- 1989-05-08 JP JP1989053341U patent/JPH02146844U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060137A (ja) * | 2001-08-08 | 2003-02-28 | Ibiden Co Ltd | モジュール用基板 |
| JP2006303290A (ja) * | 2005-04-22 | 2006-11-02 | Mitsubishi Electric Corp | 半導体装置 |
| JP2008028053A (ja) * | 2006-07-20 | 2008-02-07 | Hitachi Ltd | 樹脂モールド型電力用半導体装置 |
| JP2013183021A (ja) * | 2012-03-01 | 2013-09-12 | Toyota Industries Corp | 冷却器 |