JPH02146833U - - Google Patents
Info
- Publication number
- JPH02146833U JPH02146833U JP5289989U JP5289989U JPH02146833U JP H02146833 U JPH02146833 U JP H02146833U JP 5289989 U JP5289989 U JP 5289989U JP 5289989 U JP5289989 U JP 5289989U JP H02146833 U JPH02146833 U JP H02146833U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead part
- view
- resin
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5289989U JPH02146833U (sv) | 1989-05-08 | 1989-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5289989U JPH02146833U (sv) | 1989-05-08 | 1989-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146833U true JPH02146833U (sv) | 1990-12-13 |
Family
ID=31573602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5289989U Pending JPH02146833U (sv) | 1989-05-08 | 1989-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146833U (sv) |
-
1989
- 1989-05-08 JP JP5289989U patent/JPH02146833U/ja active Pending
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