JPH02146759A - Electronic component - Google Patents

Abstract

PURPOSE:To enable an electronic component with an operation element and an IC for driving to be configured so that it can be handled easily and achieve a compact OA equipment incorporating that electronic component by placing the operation element and IC in the direction of thickness of insulation substrate with a specified distance. CONSTITUTION:In electronic components 1 and 19 having insulation substrate 2 and 20, a number of operation elements 3 and 21 which are placed on one surface of the insulation substrates 2 and 20, a large number of IC connection terminals 4a and 22a connected to each of a large number of above operation elements 3 and 21, and IC terminals 7b and 27b which are connected to the IC connection terminals 4a and 22a and where IC 7 and 27 for driving the above operation elements 3 and 21 are modularized, the above operation elements 3 and 21 and IC7 and 27 are placed at a position which is away by certain distance in the direction of thickness of the insulation substrates 2 and 20. For example, the above operation elements 3 and 21 are the heat build-up resistance element 3 in the thermal print head 1 or the photo-electricity conversion element 21 in the image sensor 19. The above insulation substrates 2 and 20 are ceramic substrates.

Description

Detailed Description of the Invention A0 Object of the Invention (1) Industrial Application Field The present invention relates to electronic components used in office automation equipment such as facsimiles, word processors, and personal computers, and particularly relates to electronic components used in office automation equipment such as facsimiles, word processors, and personal computers. The present invention relates to an electronic component including an IC for driving an operating element. Examples of the electronic component including a large number of operating elements include a thermal print head including a large number of heating resistive elements, an image sensor including a large number of photoelectric conversion elements, and the like.

(2) Prior Art Conventionally, thermal print heads have been used as output devices for facsimile machines, thermal transfer printers, and the like. As the thermal print head, one disclosed in Japanese Patent Application Laid-Open No. 62-48571 is known.

As shown in FIG. 9, this thermal print head 01 is equipped with an insulating ceramic substrate 02, and on this substrate 02, a common electrode o3, individual electrodes 04, and a heating resistor element 05 as an operating element are disposed. A large number of rows are arranged in a direction perpendicular to the page.

Further, a driving IC is provided on the ceramic substrate 02, and this IC is connected to the individual electrode o4 and the terminal electrode 06 for external connection by bonding wires 07.08.

A predetermined heating resistor element 05 generates heat in response to an output signal from the IC.

Furthermore, image sensors are used as input devices for facsimile machines, OCRs (optical readers), and the like. As this type of image sensor, the one shown in FIG. 10 is known.

As is clear from FIG. 10, the image sensor 09 is equipped with an insulating ceramic substrate 010, and on this substrate 010, a large number of photoelectric conversion elements 011 as operating elements are arranged in rows in a direction perpendicular to the plane of the paper. There is. The photoelectric conversion element 011 has a Cr electrode layer 01 from the ceramic substrate 010 side.
2, a-3i:H photoconductive layer 013, r T O (I
ndium Tin Oxide) transparent electrode layer 014
are sequentially laminated, and finally the outer surface is covered with a transparent resin protective film 015.
It has a structure coated with Further, a driving IC is provided on the ceramic substrate 010, and this IC is connected to an electrode layer 012 and a terminal electrode 016 for external connection provided on the ceramic substrate vi010 by bonding wires 017 and 01B. has been done.

Then, the amount of light received by the photoelectric conversion element 011 is read by the IC and transmitted to the outside.

(3) Problems to be solved by the invention By the way, such conventional thermal print heads
1 or the electronic component such as the image sensor 09, the heating resistance element 05 or the photoelectric conversion element 011 as an operating element and the driving rc are formed on the same plane.
Electronic components themselves are becoming wider and larger. For this reason, you may find it inconvenient to handle these electronic components, or
In addition, there have been cases where this has become an obstacle in the progress of miniaturization of facsimile machines and the like in which these electronic components are assembled.

In particular, when the electronic component is the thermal print head 01, when printing is performed by pressing the heating resistor element 05 against the platen roll R (see Figure 9), in order to avoid contact between the platen roll R and the IC. Heat generating resistor element 05 and I
Since it is necessary to take a large distance between C, it is difficult to reduce the width of the thermal print head 01.

The present invention has been made in view of the above-mentioned circumstances, and is designed to provide an easy-to-handle electronic component that includes an operating element such as an input element such as an image sensor or an output element such as a thermal print head, and a driving IC. The technical problem is to facilitate the downsizing of office automation equipment into which the electronic components are incorporated.

B0 Structure of the Invention (1) Means for Solving the Problems In order to solve the problems described above, the present invention provides an insulating substrate, a large number of operating elements arranged in a row on one surface of the insulating substrate, and a plurality of operating elements arranged on one surface of the insulating substrate. In an electronic component in which a large number of IC connection terminals each connected to an element and an IC having an IC terminal connected to the IC connection terminal and driving the operation element are modularized, the operation element and the IC are assembled into a module. It is characterized in that it is disposed at a predetermined distance apart in the thickness direction of the insulating substrate.

(2) Function In the electronic component of the present invention having the above-described configuration, a driving IC is installed at a predetermined distance in the thickness direction of the insulating substrate from one surface of the insulating substrate on which the operating elements are disposed. It is arranged. Therefore, compared to arranging the operational elements and the image components of the IC on the same surface of the insulating substrate, it is possible to arrange them closer to each other in the direction along the surface of the insulating substrate. The planar shape of can be made smaller. Note that when the operating elements and ICs are disposed apart in the thickness direction of the insulating substrate, the dimensions of the modularized electronic component as a whole in the thickness direction of the insulating substrate increase; Since the thickness of the electronic component is not so thick, the thickness of the electronic component as a whole does not become very large, and it is possible to configure it into a shape that is easy to handle.

(3) Examples Examples of electronic components according to the present invention will be described below with reference to the drawings.

In the description of each embodiment, components having the same function are given the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 shows a first embodiment of the electronic component of the present invention, and the electronic component of this embodiment is a thermal print head.

As shown in FIG. 1, the thermal print head 1 is equipped with an insulating ceramic substrate 2, on which a heating resistor element 3 as an operating element is provided, and individual electrodes are provided on the substrate 2. 4. The common electrode 5 is formed into a predetermined pattern by photolithography, mask printing, or the like. The individual electrodes 4 are connected to connection terminals 4a disposed on the lower surface of the ceramic substrate 2 through conductive material filled in through holes 6 formed at predetermined positions in the ceramic substrate 2.

Further, the IC 7 for driving the thermal print head 1 is a printed wiring board 8 made of glass epoxy resin material.
External connection wiring 9 made of Cu, Au, or the like is provided on the top surface of printed wiring board 8 .

This wiring 9 and the external connection terminal 7a of the IC 7 are connected by a bonding wire 0.

The two substrates 2 and 8 are arranged vertically at a predetermined interval, and the other terminal 7b of the IC 7 is connected to the bamboo 1.
It is connected to the terminal 4a of the individual electrode 4 by.

A resin layer 12 is formed between the ceramic substrate 2 and the printed wiring board 8 by filling and hardening an insulating resin liquid.

In this way, a thermal print head 1 in which a ceramic substrate 2 provided with a heat generating resistive element 3 as an operating element and a printed wiring board 8 provided with an IC 7 are disposed above and below.
is configured.

Next, a second embodiment of the electronic component of the present invention will be described with reference to FIG. The electronic component of this second embodiment is also a thermal print head.

As shown in FIG. 2, in the second embodiment,
External connection wiring 9 is provided on the lower surface of ceramic substrate 2. Then, this wiring 9 is connected to the IC by a hump 13.
It is connected to the external connection terminal 7a of No.7.

According to the second embodiment, the bump connection eliminates the need for wire bonding, improving workability in manufacturing.

Next, a third embodiment of the electronic component of the present invention will be described with reference to FIG. The electronic component of this third embodiment is also a thermal print head.

As shown in FIG. 3, in the third embodiment,
A heat dissipation section 14 made of a metal material with high thermal conductivity such as aluminum or cast iron is provided on the lower surface of the ceramic substrate 2 corresponding to the position where the heat generating resistor element 3 is installed.

According to this third embodiment, the heat of the heat generating resistor element 3 is efficiently radiated by the heat radiating section 14.

Next, a fourth embodiment of the electronic component of the present invention will be described with reference to FIG. The electronic component of this fourth embodiment is also a thermal print head.

As shown in FIG. 4, in the fourth embodiment,
Connection wiring 15 is formed on the upper surface of the printed wiring board 8, and a ceramic substrate 2 having a thickness of about 1 mm is disposed. One end of the connection wiring 15 (left end in Figure 4)
are soldered to the terminals 4a of the individual electrodes 4 formed on the lower surface of the ceramic substrate 2, and a resin layer 16 filled with and hardened insulating resin liquid is formed between the side substrates 2 and 8. The heating resistor element 3 provided on the upper surface of the ceramic substrate 2 is approximately 1 inch from the upper surface of the printed wiring board 8.
It is placed at a height of mm. On the other hand, the driving IC 7 (about 0.5 mm thick) is disposed on the other end side (on the right side in FIG. 4) of the upper surface of the printed wiring board 8. Terminals 7a and 7b of this IC7 are wire bonded 1
0.17, and is connected to the other end (the right end in FIG. 4) of the external connection wiring 9 and the connection wiring 15 formed on the upper surface of the printed wiring board 8. and IC7
And the wire bonding 10.17 is connected to the protective resin 18 having a thickness of about 1 mm from the top surface of the printed wiring board 8.
is sealed by.

According to this fourth embodiment, as described above, the heating resistor element 3 and the upper surface of the protective resin 18 are arranged at a distance from the upper surface of the printed wiring board 8 (both approximately 1 mm), so that the heating resistor When printing is performed by pressing the element 3 against the platen roll, the position of the platen roll is sealed with the protective resin 18 compared to the conventional example shown in FIG.
move away from the position of Therefore, the heating resistance element 3 and the IC
7 in the width direction (distance in the left-right direction in FIG. 4) can be made shorter than in the conventional example, so both 3.7
can be arranged closely along the width direction of the printed wiring board 8. Therefore, the dimension in the width direction of the printed wiring board of the thermal print head 1 can be reduced. Also, the heights from the upper surface of the protective resin 18 covering the IC 7 and the heights of the ceramic substrate 2 from the upper surface of the printed wiring board 8 are approximately equal. Therefore, the thermal print head 1 as a whole has a shape that is easy to handle without any unevenness.

Next, a fifth embodiment of the electronic component of the present invention will be described with reference to FIG. The electronic component in this embodiment is an image sensor.

As shown in FIG. 5, the image sensor 19 includes a ceramic substrate 20, and on the upper surface of this substrate 20, a large number of photoelectric conversion elements 21, which are active elements, are arranged in rows in a direction perpendicular to the plane of the paper. Each photoelectric conversion element 21 has an individual electrode 22, a formed of Cr from the ceramic substrate 20 side.
-3i: A photoconductive layer 23 of H, a transparent common electrode 24 of ITO, etc. are sequentially laminated, and finally the outer surface is covered with a protective film 2 of transparent resin.
It has a structure coated with 5.

The individual electrodes 22 are connected to connection terminals 22a provided on the lower surface of the ceramic substrate 20 through through holes 26 formed at predetermined positions in the ceramic substrate 20.

Further, an IC 27 for driving the image sensor 19 is provided on the upper surface of a printed wiring board 28 made of glass epoxy material.
External connection wiring 29 made of U, Au, or the like is provided. This external connection wiring 29 and the external connection terminal 27a of the IC 27 are connected by wire bonding 30.

The two substrates 20 and 28 are arranged vertically at a predetermined interval, and the other terminal 27b of the IC 27 is connected to the terminal 22a of the individual electrode 22 by a bump 31.

A resin layer 32 is formed between the two substrates 20 and 28 by injecting and hardening an insulating resin liquid.

In this way, the image sensor 1 has the ceramic substrate 20 provided with the photoelectric conversion element 21 as an operating element and the printed wiring board 28 provided with the IC 27 arranged above and below.
9 are configured.

Next, a sixth embodiment of the electronic component of the present invention will be described with reference to FIG. The electronic component in this embodiment is also an image sensor.

As shown in FIG. 6, in the sixth embodiment,
A connection terminal 22a in which the individual electrode 22 passes through the end surface 20a of the ceramic substrate 2o and is disposed on the lower surface of the substrate 20.
It is connected to the.

According to this sixth embodiment, the end surface 2 of the ceramic substrate 2°
．． By using Oa, there is no need to provide through holes 26 in the ceramic substrate 20.

Next, a seventh embodiment of the electronic component of the present invention will be described with reference to FIG. The electronic component in this embodiment is also an image sensor.

As shown in FIG. 7, in the seventh embodiment,
External connection wiring 29 is provided on the lower surface of ceramic substrate 20. This wiring 29 is connected to an external connection terminal 27a of the IC 27 by a bump 33.

In the seventh embodiment, all the terminals of the IC 27 are bump-connected, so wire bonding is not necessary and work efficiency is improved.

In the electronic components of the first to third embodiments or the fifth to seventh embodiments described above, since the driving IC is disposed between the two substrates 2.8; 8;20,
28 ensures that the IC is protected.

Next, an eighth embodiment of the electronic component of the present invention will be described with reference to FIG. The electronic component in this embodiment is also an image sensor.

As shown in FIG. 8, the image sensor 19 includes a ceramic substrate 20, and a photoelectric conversion element 21, which is an operating element, is formed at one end (left end in FIG. 8) of the upper surface of the substrate 20. has been done. This photoelectric conversion element 21 includes a transparent common electrode 24 made of ITO or the like from the ceramic substrate 20 side;
α-3i: Consisting of a photoconductive layer 23 of H and individual electrodes 22 formed of Cr, which are successively laminated.
An IC connection terminal 22a made of Au is laminated on the upper surface of the individual electrode 22.

Further, at the other end (right end in FIG. 8) of the upper surface of the ceramic substrate 20, an external connection wiring 29 made of Cu, Au, or the like is provided.

The external connection wiring 29 and the rc terminal 27a are connected to the hump 3.
3, and the IC connection terminal 22a and the IC terminal 27
b by a bump 31.

A resin layer 32 is formed between the ceramic substrate 20 and the IC 27 by injecting and hardening an insulating resin liquid.

According to the eighth embodiment, the ceramic substrate 20, the photoelectric conversion element 21 as an operating element, and the IC are modularized in a laminated state, so that the planar shape of the ceramic substrate 20 can be made extremely small. becomes.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the embodiments described above, and various design changes can be made without departing from the scope of the invention described in the claims. Is possible.

For example, in the fifth to seventh embodiments, the photoelectric conversion element 21
It is also possible to arrange the IC 27 and the IC 27 so as to overlap in the thickness direction of the ceramic substrate 20. By doing so, the widthwise dimension of the image sensor can be further reduced.

C1 Effects of the Invention In the modularized electronic component of the present invention described above, an operating element such as an input element or an output element and an IC that drives the operating element are arranged a predetermined distance apart in the thickness direction of an insulating substrate. This makes it possible to arrange the operating element and the IC close to each other in the direction along the insulating substrate. Therefore, since it is possible to reduce the width dimension of the electronic component along the insulating substrate, the electronic component of the present invention can be easily incorporated into OA equipment, and the miniaturization of OA equipment is also promoted. It becomes easier.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of a thermal print head as a first embodiment of an electronic component according to the present invention, and FIG. 2 is a side sectional view of a thermal print head as a second embodiment of an electronic component according to the present invention. FIG. 3 is a side sectional view of a thermal print head as a third embodiment of an electronic component according to the present invention, and FIG. 4 is a side sectional view of a thermal print head as a fourth embodiment of an electronic component according to the present invention. 5 is a side sectional view of an image sensor as a fifth embodiment of an electronic component according to the present invention; FIG. 6 is a side sectional view of an image sensor as a sixth embodiment of an electronic component according to the present invention; 8 is a side sectional view of an image sensor as a seventh embodiment of the electronic component according to the present invention. FIG. 8 is a side sectional view of an image sensor as the eighth embodiment of the electronic component according to the present invention. , a side sectional view of a thermal print head as an example of a conventional electronic component, and FIG. 10 is a side sectional view of an image sensor as an example of a conventional electronic component.

Claims (1)

[Claims] An insulating substrate (2, 20), a large number of operating elements (3, 21) arranged in a row on one surface of the insulating substrate (2, 20), and a plurality of operating elements (3, 21) connected to the plurality of operating elements (3, 21), respectively. A large number of IC connection terminals (4a, 22a) and IC terminals (7b, 27b) connected to these IC connection terminals (4a, 22a).
) for driving the operating element (3, 21);
7, 27) into a module, the operating element (3, 21) and the IC (7, 27) are arranged at positions separated by a predetermined distance in the thickness direction of the insulating substrate (2, 20). An electronic component characterized by: