JPH02145755A - Manufacture of lead frame material having superior property of joining with resin - Google Patents
Manufacture of lead frame material having superior property of joining with resinInfo
- Publication number
- JPH02145755A JPH02145755A JP30014488A JP30014488A JPH02145755A JP H02145755 A JPH02145755 A JP H02145755A JP 30014488 A JP30014488 A JP 30014488A JP 30014488 A JP30014488 A JP 30014488A JP H02145755 A JPH02145755 A JP H02145755A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin
- frame material
- strength
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000011347 resin Substances 0.000 title abstract description 30
- 229920005989 resin Polymers 0.000 title abstract description 30
- 238000000137 annealing Methods 0.000 claims abstract description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 7
- 238000005097 cold rolling Methods 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims description 31
- 238000007747 plating Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 14
- 229910045601 alloy Inorganic materials 0.000 abstract description 12
- 239000000956 alloy Substances 0.000 abstract description 12
- 230000007547 defect Effects 0.000 abstract description 6
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は樹脂との接合性が良好なリードフレーム材の製
造方法に関し、さらに詳しくは、封止樹脂との接合性が
良好で、半導体装置に優れた耐湿性を付与することが可
能な銅系のリードフレーム材の製造方法に関する。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a method for manufacturing a lead frame material that has good bondability with resin, and more specifically, a method for manufacturing a lead frame material that has good bondability with sealing resin and is suitable for use in semiconductor devices. The present invention relates to a method for manufacturing a copper-based lead frame material that can impart excellent moisture resistance to the material.
［従来の技術］
半導体装置のパッケージは低圧トランスファー方式によ
り成形される樹脂封止タイプが現在主流となっている。[Prior Art] Currently, semiconductor device packages are of the resin-sealed type molded by a low-pressure transfer method.
一方、リードフレームについては熱放散性やコストの面
から従来の４２アロイに替り銅系材料が盛んに使用され
てきている。リードフレームは、半導体装置の組立て工
程において、ダイボンディング、ボストキュア、ワイヤ
ボンディングおよび樹脂封止等の際に加熱を受け、リー
ドフレームの表面には酸化皮膜が形成される。リードフ
レームは酸化皮膜を付けたまま樹脂中に封入されるため
、この酸化皮膜の性質が、例えば母材から剥離し易い性
質であったり、あるいは樹脂との接合性に劣る性質のも
のであった場合には、リードフレームと樹脂との間に形
成されたすき間から水分が侵入し、素子のＡｎ配線を腐
食するいわゆる耐湿性不良を引起すことになる。On the other hand, for lead frames, copper-based materials are increasingly being used in place of the conventional 42 alloy from the standpoint of heat dissipation and cost. The lead frame is heated during die bonding, post curing, wire bonding, resin sealing, etc. in the assembly process of a semiconductor device, and an oxide film is formed on the surface of the lead frame. Lead frames are encapsulated in resin with an oxide film still attached, so the properties of this oxide film may be such that it easily peels off from the base material or has poor bonding properties with the resin. In this case, moisture enters through the gap formed between the lead frame and the resin, causing so-called moisture resistance failure that corrodes the An wiring of the element.
銅系リードフレームはＦｅ−Ｎｉ系の４２アロイに比べ
一般に酸化し易く、耐湿性の面では４２アロイよりも劣
っている。素子の集積度が上り素子からの発熱量が増え
るにつれ、熱放散性に優れる銅系リードフレーム材料の
要求が高まフているが、パッケージは小型化、薄肉化す
るのに対し、素子は大型化していることから、外部と素
子とを隔てる樹脂の厚さは薄くなり、耐湿性に関しては
益々不利になフている。したがって銅系材料にとって耐
湿性の問題は最も重要な特性の一つになってぎている０
例えばメモリー用ＩＣの場合、２５６にビットにおいて
はパッケージ全体の投影面積に対する素子の投影面積の
割合は約３０％であったのに、現在主流の１Ｍビットで
は約４０％、今後主流となる４Ｍビットでは約６０％を
占めるようになり、耐湿性の問題の解決なしには高集化
は出来ない状況にある。一方、強度の面においてもパッ
ケージの小型化、薄肉化に伴ない、リードフレームも薄
板化することから、４２アロイと同様のビッカース硬さ
が１８０以上の高強度が求められている。Copper-based lead frames are generally more easily oxidized than Fe-Ni-based 42 alloy, and are inferior to 42 alloy in terms of moisture resistance. As the degree of integration of devices increases and the amount of heat generated from devices increases, there is an increasing demand for copper-based lead frame materials with excellent heat dissipation properties.However, while packages are becoming smaller and thinner, devices are becoming larger. As a result, the thickness of the resin that separates the outside from the element has become thinner, which has become increasingly disadvantageous in terms of moisture resistance. Therefore, moisture resistance has become one of the most important properties for copper-based materials.
For example, in the case of memory ICs, for 256 bits, the ratio of the projected area of the element to the projected area of the entire package was about 30%, but for the currently mainstream 1M bit, it was about 40%, and for the 4M bit that will become mainstream in the future. It now accounts for about 60% of the total, and we are in a situation where it is impossible to increase the density unless we solve the problem of moisture resistance. On the other hand, in terms of strength, as packages become smaller and thinner, lead frames are also becoming thinner, so high strength with a Vickers hardness of 180 or higher, similar to 42 alloy, is required.
したがフて樹脂との接合性に優れ、耐湿性が良好であり
、かつ４２７０イと同等の高強度を有する銅系リードフ
レーム材料の開発が望まれている。Therefore, it is desired to develop a copper-based lead frame material that has excellent bondability with resin, good moisture resistance, and high strength equivalent to 4270I.
［発明が解決しようとする課題］
本発明は上記に説明した樹脂封止タイプの半導体装置に
銅系リードフレームを適用する際の耐湿性不良の問題に
鑑みなされたものであり、銅系リードフレームとして優
れた導電性と、４２７０イに代替し得る優れた強度、耐
熱性等の機械的性質を有し、かつ樹脂との接合性が良好
で耐湿性に優れるリードフレーム材を安価に提供し得る
リードフレーム材の製造方法を提供することを目的とす
る。[Problems to be Solved by the Invention] The present invention was made in view of the problem of poor moisture resistance when applying a copper lead frame to the resin-sealed semiconductor device described above. It is possible to provide a lead frame material at a low cost, which has excellent electrical conductivity, excellent mechanical properties such as strength and heat resistance that can be used as a substitute for 4270I, and has good bondability with resin and excellent moisture resistance. The object of the present invention is to provide a method for manufacturing lead frame materials.
［０題を解決するための手段］
本発明の要旨は、硬さがビッカース硬さで１８０以上の
銅合金の表面に１μｍ以上１０μｍ以下の厚さのＣｕめ
つきを施した後、１％以上５％以下の冷間圧延を行ない
、さらに２００℃〜４００℃の温度で少なくとも５秒間
の焼鈍を行なうことを特徴とするリードフレーム材料の
製造方法に存在する。[Means for Solving Problem 0] The gist of the present invention is to apply Cu plating to a thickness of 1 μm or more and 10 μm or less on the surface of a copper alloy having a Vickers hardness of 180 or more. There is a method for manufacturing a lead frame material, which is characterized by carrying out cold rolling of 5% or less and further carrying out annealing at a temperature of 200°C to 400°C for at least 5 seconds.
［作用］ 以下に本発明の作用を構成とともに詳細に説明する。[Effect] The operation of the present invention will be explained in detail below along with the configuration.
既に説明したように、樹脂封止タイプの半導体装置にお
ける耐湿性不良は、樹脂とリードフレームの接合性が不
充分な場合に、樹脂とリードフレームの間にできたすき
間から水分が侵入することにより引き起されるが、この
ようなすき間は例えば半導体装置が半田付は等で加熱を
受けた際に、樹脂とリードフレームの熱膨張の差異によ
り生じ得るものである。従って耐湿性を向上させるため
には、樹脂とリードフレームが強固に接合していること
が望ましい。As already explained, poor moisture resistance in resin-sealed semiconductor devices is caused by moisture entering through the gap between the resin and the lead frame when the bonding between the resin and the lead frame is insufficient. However, such a gap can occur due to a difference in thermal expansion between the resin and the lead frame, for example, when a semiconductor device is heated during soldering or the like. Therefore, in order to improve moisture resistance, it is desirable that the resin and lead frame be firmly bonded.
そこで我々は銅系リードフレーム材料と樹脂との接合強
度に及ぼす添加元素や酸化条件等の種々の要因の影響に
ついて詳細な研究を行なった。Therefore, we conducted detailed research on the effects of various factors such as additive elements and oxidation conditions on the bond strength between copper-based lead frame materials and resin.
その結果、機械的性質等、銅系リードフレーム材料の各
種特性を改善するために添加されているＳｎを始めとす
る合金元素はいずれも、樹脂とリードフレームの接合強
度を低下させる方向に作用しており、これらの添加元素
を含まない純銅が接合強度において最も優れていること
が確認された。As a result, alloying elements such as Sn, which are added to improve various properties of copper-based lead frame materials such as mechanical properties, act to reduce the bonding strength between the resin and the lead frame. It was confirmed that pure copper, which does not contain these additive elements, has the best bonding strength.
しかしこれらの添加元素は上述の通り、リードフレーム
材料として必要な特性を付与するために必須のものであ
り、純銅ではたとえ耐湿性が優れていてもその他の特性
、例えば強度や耐熱性において不充分であり、これらが
要求される機種においてはリードフレーム材料として使
用できるものではない。However, as mentioned above, these additive elements are essential to impart the properties necessary for lead frame materials, and even if pure copper has excellent moisture resistance, it may be insufficient in other properties such as strength and heat resistance. Therefore, it cannot be used as a lead frame material in models that require these.
そこで本発明者は、４２アロイ相当の高強度な銅合金を
母材とし表面に純銅層を有するリードフレーム材料につ
いて研究した結果、樹脂との接合性に優れる表面を有し
、かつ４２アロイに代替し得る優れた強度、耐熱性等の
機械的性質を有するリードフレーム材料を開発すること
ができたのである。Therefore, as a result of researching lead frame materials that have a high-strength copper alloy equivalent to 42 alloy as a base material and a pure copper layer on the surface, we found that the material has a surface that has excellent bonding properties with resin and can be used as an alternative to 42 alloy. We were able to develop a lead frame material with excellent mechanical properties such as strength and heat resistance.
まず、母材であるが４２アロイに代替し得る強度を有す
るためにはビッカース硬さで１８０以上は必要である。First, the base material must have a Vickers hardness of 180 or more in order to have enough strength to replace 42 alloy.
そのような銅合金としては、例えば、Ｃｕ−３，２％Ｎ
ｉ−０，７％５ｉ−０，３％Ｚｎ、Ｃｕ−３．２％Ｎｉ
−０，７％５ｉ−１．２５％５ｎ−０．３％Ｚｎあるい
はＣｕ−１，６％Ｎｉ−０，３５％５ｉ−０，３％Ｚｎ
を代表とするＣｕ−Ｎｉ、、Ｓｉ系合金、Ｃｕ−１％５
ｎ−０，１％Ｆｅ−０，０３％Ｐ、Ｃｕ−２％５ｎ−０
，１％Ｆｅ−０，０３％ＰおよびＣｕ−２％５ｎ−０，
２％Ｎｉ−０，０５％Ｐを代表とするＣｕ−５ｎ−Ｐ系
合金を挙げることができる。As such a copper alloy, for example, Cu-3,2%N
i-0,7%5i-0,3%Zn, Cu-3.2%Ni
-0,7%5i-1.25%5n-0.3%Zn or Cu-1,6%Ni-0,35%5i-0,3%Zn
Cu-Ni, Si-based alloys represented by Cu-1%5
n-0,1%Fe-0,03%P,Cu-2%5n-0
,1%Fe-0,03%P and Cu-2%5n-0,
Examples include Cu-5n-P alloys represented by 2%Ni-0.05%P.
次に、Ｃｕ層を得る方法であるが、４２アロイに代替し
得る材料としては安価であることが重要であり、この点
でＣｕめっきを施す方法が他の方法、例えば蒸着法ある
いはクラッド法に比べ優れている。Ｃｕめっきの厚さは
１μｍ未満では母材の銅合金の添加元素が組立工程での
加熱等により表面に拡散し、樹脂との接合性に悪影響を
及ぼすのを防止するという効果が不充分であり、１０μ
ｍｆｔ−越えてＣｕめっぎが施されても、Ｃｕめフきの
スピードダウンによるコストアップの割には効果はあま
り向上しない。よってＣｕめっき厚さは１μｍ以上１０
μｍ以下とする。Next, as for the method for obtaining the Cu layer, it is important that it is inexpensive as a material that can be substituted for 42 alloy, and in this respect, the method of applying Cu plating is different from other methods such as vapor deposition or cladding. It's better than that. If the thickness of the Cu plating is less than 1 μm, the effect of preventing the additive elements of the base copper alloy from diffusing to the surface due to heating during the assembly process and adversely affecting the bondability with the resin is insufficient. , 10μ
Even if Cu plating is applied beyond mft-, the effect will not improve much in spite of the increased cost due to the speed reduction of Cu plating. Therefore, the Cu plating thickness is 1 μm or more.
It should be less than μm.
Ｃｕめっきを施した後１％以上５％以下の冷間圧延を行
なうのは、Ｃｕめフき層が有するボイドやポロシティお
よびＨ２ガス等の内部欠陥を圧着するためである。これ
らの欠陥を有したままのＣｕ層は加熱を受けると剥離し
易い酸化皮膜を形成するため、本発明が目的とする樹脂
との接合性に優れる表面を与えない、冷間圧延の減面率
が１％未満では上記の効果は不充分であり、５％を越え
て圧延されてもその効果の向上はほとんどない上、通常
この種の圧延はスキンバスロールで行なわれることから
、その圧下能力から見ても５％を越えることは望ましく
ない。The reason why cold rolling is performed by 1% or more and 5% or less after applying Cu plating is to compress internal defects such as voids, porosity, and H2 gas that the Cu plating layer has. Since the Cu layer that still has these defects forms an oxide film that easily peels off when heated, the area reduction rate of cold rolling does not provide a surface with excellent bonding properties with the resin, which is the objective of the present invention. If it is less than 1%, the above effect is insufficient, and if it is rolled with more than 5%, there is almost no improvement in the effect, and since this type of rolling is usually done with skin bath rolls, its rolling capacity is low. It is undesirable for it to exceed 5%.
次に、２００℃〜４００℃の温度で少なくとも５秒間の
焼鈍を行なうのは、上記に説明したＣｕめっぎ層が有す
る内部欠陥の除去を完全にするためであり、焼鈍が行な
われない冷間圧延のままでは本発明が目的とする樹脂と
の接合性に優れる表面は得られない、焼鈍温度が２００
℃未満では上記の効果は不充分であり、４００℃を越え
ても効果の向上は少なく、不経済であるし、また母材の
軟化を招く恐れもある。よって焼鈍温度は２００℃〜４
００℃とする。焼鈍時間は５秒未満では温度が２００℃
〜４００℃であっても上記効果が不充分であるので少な
くとも５秒間とする。Next, the reason why annealing is performed at a temperature of 200°C to 400°C for at least 5 seconds is to completely remove the internal defects in the Cu plating layer explained above. If the surface is rolled as it is, it will not be possible to obtain a surface with excellent bonding properties with the resin, which is the objective of the present invention.
If the temperature is lower than 400°C, the above effect is insufficient, and if the temperature exceeds 400°C, the effect will not be improved much, which is uneconomical and may lead to softening of the base material. Therefore, the annealing temperature is 200℃~4
00℃. If the annealing time is less than 5 seconds, the temperature is 200℃.
Since the above effect is insufficient even at temperatures of 400°C to 400°C, the heating time is set to at least 5 seconds.
［実施例］
次に本発明に係るリードフレーム材料について実施例に
より説明する。[Example] Next, the lead frame material according to the present invention will be described with reference to an example.
第１表に示す組成の合金に対し熱間圧延、冷間圧延およ
び焼鈍を行ない０．２５ｍｍ厚さの板を得た。An alloy having the composition shown in Table 1 was hot rolled, cold rolled and annealed to obtain a plate having a thickness of 0.25 mm.
この板に、第２表に示す厚さでＣｕめっきを施した後、
第２表に示す減面率でスキンパス圧延を行ない、さらに
第２表に示す条件で焼鈍を行なった後試験を行ない、第
２表の結果を得た。After applying Cu plating to this plate with the thickness shown in Table 2,
Skin pass rolling was performed at the area reduction ratio shown in Table 2, and further annealing was performed under the conditions shown in Table 2, followed by a test, and the results shown in Table 2 were obtained.
（１）Ｃｕめフ鎗条件及び試験条件を以下に示す。(1) The Cu hammer conditions and test conditions are shown below.
■Ｃｕめフき条件
浴組成：硫酸銅２００ ｇ／ｕ
硫酸５０ｇ／１
ＣＩ−４０ｐｐｍ
浴温度：２５℃
電流密度：５Ａ／ｄゴ
■硬さ
マイクロビッカース硬さ計を用い、荷重０．５ｋｇで測
定した。■Cu cleaning conditions Bath composition: Copper sulfate 200 g/u Sulfuric acid 50 g/1 CI-40 ppm Bath temperature: 25°C Current density: 5 A/d ■Hardness Using a micro Vickers hardness tester, at a load of 0.5 kg It was measured.
■耐熱温度
ソルトバスを用い、各温度で５分間の加熱を行なフた後
硬さを測定し、加熱後の硬さが加熱前の硬さの８０％に
なる温度をもって耐熱温度とした。(2) Heat Resistant Temperature Using a salt bath, the material was heated at each temperature for 5 minutes, and then the hardness was measured, and the heat resistance temperature was defined as the temperature at which the hardness after heating was 80% of the hardness before heating.
■樹脂との接合強度
４ｍｍ巾ｘ２５ｍｍ長さのフレーム試験片を切出した後
、露点−９℃のドライエア中で３００℃Ｘ３０秒の加熱
を行ない酸化させた後、樹脂成型を行ない第１図（ａ）
に示す成型試験片を得た
（２）成型条件を以下に示す。■ Bond strength with resin After cutting out a frame test piece with a width of 4 mm and a length of 25 mm, it was heated at 300 °C for 30 seconds in dry air with a dew point of -9 °C to oxidize it, and then molded with resin. )
(2) The molding conditions for obtaining the molded test piece shown in (2) are shown below.
樹脂：トランスファモールド用エポキシ樹脂（市販品）
金型温度：１ｌ５℃
キュア時間＝９０秒
成型圧カニ１００ｋｇｆ／ｃｍ”
ボストキュア：１７５℃×６時間
（３）接合強度の測定
インストロンタイプの引張試験機を用い、引抜速度１
ｍｍ７分で、第１図（ｂ）に示すようにリードフレーム
を樹脂から引抜き、接合強度を測定した。ｎ数は４とし
、平均を求めた。Resin: Epoxy resin for transfer molding (commercial product) Mold temperature: 1l5℃ Cure time = 90 seconds Molding pressure 100kgf/cm Bost cure: 175℃ x 6 hours (3) Measuring bonding strength Instron type tensile tester using a drawing speed of 1
After 7 minutes, the lead frame was pulled out from the resin as shown in FIG. 1(b), and the bonding strength was measured. The number n was set to 4, and the average was calculated.
第２表に示す通り、本発明に係るリードフレーム材料Ｎ
ｏｔ〜Ｎｏ５は、いずれも４２７０イに相当する高い硬
さおよび耐熱温度を有するとともに高い樹脂との接合強
度を有していることが分る。As shown in Table 2, lead frame material N according to the present invention
It can be seen that all of No. ot to No. 5 have high hardness and heat resistance temperature equivalent to 4270i, as well as high bonding strength with the resin.
これに対し比較例Ｎｏ６〜８は、硬さ、耐熱温度は（優
れているものの表面のＣｕ層が無いが、または薄いため
樹脂との接合強度が劣っている。また比較例Ｎｏ９は、
Ｃｕめっき層は有するもののポロシティやガス等の内部
欠陥を含有するため樹脂との接合強度が劣）ている。On the other hand, Comparative Examples Nos. 6 to 8 have excellent hardness and heat resistance, but the bonding strength with the resin is poor because there is no Cu layer on the surface or it is thin. Also, Comparative Example No. 9 has
Although it has a Cu plating layer, it contains internal defects such as porosity and gas, so the bonding strength with the resin is poor.
また、比較例Ｎｏｌ０およびＮｏ１ｌはＣｕめっき層を
有し、さらに内部欠陥を減少させるために冷間圧延を行
なフているが、その後焼鈍が無いが、または温度が低い
ために樹脂との接合強度の向上は不充分である。In addition, Comparative Examples No. 0 and No. 1l have a Cu plating layer and are cold-rolled to further reduce internal defects, but there is no annealing after that or the bonding with the resin is poor due to the low temperature. The improvement in strength is insufficient.
［発明の効果］
以上説明したように、本発明に係るリードフレーム材料
の製造方法は上記の構成を有しているものであるから、
銅系リードフレーム材としての優れた強度や耐熱性を発
揮し、かつ耐湿性にも優れるリードフレーム材を提供し
得るという効果を有している。[Effects of the Invention] As explained above, since the method for manufacturing a lead frame material according to the present invention has the above configuration,
This has the effect of providing a lead frame material that exhibits excellent strength and heat resistance as a copper-based lead frame material and also has excellent moisture resistance.
第１図は（ａ）は成型試験片を示す斜視図である。第１
図（ｂ）は引ぎ抜き方法を示す成型試験片の断面図であ
る。
すめFIG. 1(a) is a perspective view showing a molded test piece. 1st
Figure (b) is a cross-sectional view of a molded test piece showing the pulling method. Recommended
Claims (1)
μｍ以上１０μｍ以下の厚さのＣｕめっきを施した後、
１％以上５％以下の冷間圧延を行ない、さらに２００℃
〜４００℃の温度で少なくとも５秒間の焼鈍を行なうこ
とを特徴とするリードフレーム材料の製造方法。1 on the surface of a copper alloy with a Vickers hardness of 180 or higher.
After applying Cu plating with a thickness of μm or more and 10 μm or less,
Cold rolling of 1% or more and 5% or less, and further at 200℃
A method for producing a lead frame material, characterized in that annealing is carried out at a temperature of ~400°C for at least 5 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63300144A JP2564633B2 (en) | 1988-11-28 | 1988-11-28 | Method for manufacturing lead frame material having good bondability with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63300144A JP2564633B2 (en) | 1988-11-28 | 1988-11-28 | Method for manufacturing lead frame material having good bondability with resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02145755A true JPH02145755A (en) | 1990-06-05 |
| JP2564633B2 JP2564633B2 (en) | 1996-12-18 |
Family
ID=17881272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63300144A Expired - Fee Related JP2564633B2 (en) | 1988-11-28 | 1988-11-28 | Method for manufacturing lead frame material having good bondability with resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2564633B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4232736A1 (en) * | 1991-09-30 | 1993-04-08 | Uchiya Thermostat | MECHANICAL LOCKER SWITCH AND RELAY |
| JP2005213611A (en) * | 2004-01-30 | 2005-08-11 | Nikko Metal Manufacturing Co Ltd | Material for electronic parts with excellent press blanking property |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61201762A (en) * | 1985-03-05 | 1986-09-06 | Furukawa Electric Co Ltd:The | Manufacture of bar material for electronic equipment part |
| JPS6353958A (en) * | 1986-08-23 | 1988-03-08 | Kobe Steel Ltd | Lead frame material |
| JPS63107054A (en) * | 1986-10-23 | 1988-05-12 | Mitsubishi Electric Corp | Material for lead frame |
-
1988
- 1988-11-28 JP JP63300144A patent/JP2564633B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61201762A (en) * | 1985-03-05 | 1986-09-06 | Furukawa Electric Co Ltd:The | Manufacture of bar material for electronic equipment part |
| JPS6353958A (en) * | 1986-08-23 | 1988-03-08 | Kobe Steel Ltd | Lead frame material |
| JPS63107054A (en) * | 1986-10-23 | 1988-05-12 | Mitsubishi Electric Corp | Material for lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4232736A1 (en) * | 1991-09-30 | 1993-04-08 | Uchiya Thermostat | MECHANICAL LOCKER SWITCH AND RELAY |
| JP2005213611A (en) * | 2004-01-30 | 2005-08-11 | Nikko Metal Manufacturing Co Ltd | Material for electronic parts with excellent press blanking property |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2564633B2 (en) | 1996-12-18 |
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