JPH02140848U - - Google Patents
Info
- Publication number
- JPH02140848U JPH02140848U JP4911889U JP4911889U JPH02140848U JP H02140848 U JPH02140848 U JP H02140848U JP 4911889 U JP4911889 U JP 4911889U JP 4911889 U JP4911889 U JP 4911889U JP H02140848 U JPH02140848 U JP H02140848U
- Authority
- JP
- Japan
- Prior art keywords
- bonded product
- heater
- bonding
- incorporating
- eliminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の第１の実施例を示す平面図、
第２図はその−断面図、第３図は本考案の第
２の実施例を示す縦断面図、第４図は従来のボン
デイングウインドクランパーを示す平面図、第５
図はその側面図である。 １……ボンデイングウインドクランパー、２…
…発熱体（ヒーター）、３……絶縁材料。
第２図はその−断面図、第３図は本考案の第
２の実施例を示す縦断面図、第４図は従来のボン
デイングウインドクランパーを示す平面図、第５
図はその側面図である。 １……ボンデイングウインドクランパー、２…
…発熱体（ヒーター）、３……絶縁材料。
Claims (1)
- ワイヤーボンデイングの際被ボンデイング品を
押さえるボンデイングウインドクランパーにおい
て、被ボンデイング品との温度差をなくすための
ヒーターを組み込んだことを特徴とするボンデイ
ングウインドクランパー。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4911889U JPH02140848U (ja) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4911889U JPH02140848U (ja) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02140848U true JPH02140848U (ja) | 1990-11-26 |
Family
ID=31566541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4911889U Pending JPH02140848U (ja) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02140848U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012164918A (ja) * | 2011-02-09 | 2012-08-30 | Denso Corp | ワイヤボンディング構造体の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59165429A (ja) * | 1983-03-10 | 1984-09-18 | Toshiba Corp | 還元方法 |
| JPH0237731A (ja) * | 1988-07-27 | 1990-02-07 | Toshiba Corp | ワイヤボンディング装置 |
| JPH0296342A (ja) * | 1988-09-30 | 1990-04-09 | Mitsubishi Electric Corp | ワイヤボンド装置 |
-
1989
- 1989-04-25 JP JP4911889U patent/JPH02140848U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59165429A (ja) * | 1983-03-10 | 1984-09-18 | Toshiba Corp | 還元方法 |
| JPH0237731A (ja) * | 1988-07-27 | 1990-02-07 | Toshiba Corp | ワイヤボンディング装置 |
| JPH0296342A (ja) * | 1988-09-30 | 1990-04-09 | Mitsubishi Electric Corp | ワイヤボンド装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012164918A (ja) * | 2011-02-09 | 2012-08-30 | Denso Corp | ワイヤボンディング構造体の製造方法 |