JPH02140830U - - Google Patents
Info
- Publication number
- JPH02140830U JPH02140830U JP4978689U JP4978689U JPH02140830U JP H02140830 U JPH02140830 U JP H02140830U JP 4978689 U JP4978689 U JP 4978689U JP 4978689 U JP4978689 U JP 4978689U JP H02140830 U JPH02140830 U JP H02140830U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead member
- external lead
- tip
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 description 3
Landscapes
- Ceramic Capacitors (AREA)
Description
第１図は本考案によるアキシヤル型電子部品（
積層セラミツクコンデンサ）の一実施例の縦断面
図、第２図、第３図は第１図の実施例による積層
セラミツクコンデンサを実際にプリント基板に実
装した例の縦断面図である。第４図は従来の積層
セラミツクコンデンサの構造を説明するための横
断面図、第５図は従来の積層セラミツクコンデン
サのプリント基板実装時における問題点を説明す
るための縦断面図である。
１……電子部品本体（チツプ）、２，３……外
部リード部材、４……外装樹脂材、７，８……外
部電極。
Figure 1 shows an axial type electronic component (
FIGS. 2 and 3 are longitudinal sectional views of an example in which the multilayer ceramic capacitor according to the embodiment of FIG. 1 is actually mounted on a printed circuit board. FIG. 4 is a cross-sectional view for explaining the structure of a conventional multilayer ceramic capacitor, and FIG. 5 is a vertical cross-sectional view for explaining the problems encountered when mounting the conventional multilayer ceramic capacitor on a printed circuit board. 1... Electronic component body (chip), 2, 3... External lead member, 4... Exterior resin material, 7, 8... External electrode.
Claims (1)
ら外部リード部材を反対方向に導出し、電子部品
本体の前周面及び外部リード部材の導出基端部を
外装樹脂材で被覆したアキシヤル型電子部品にお
いて、 前記外部リード部材の先端部をＵ字型あるいは
Ｌ字型に折曲形成し、この先端部を電子部品本体
の端面及び周面に嵌合して接続させたことを特徴
とするアキシヤル型電子部品。[Claims for Utility Model Registration] An external lead member is led out in the opposite direction from an electronic component body with external electrodes formed on both end faces, and the front peripheral surface of the electronic component body and the lead-out base end of the external lead member are covered with exterior resin. In the axial type electronic component covered with a material, the tip of the external lead member is bent into a U-shape or an L-shape, and the tip is fitted and connected to the end surface and circumferential surface of the electronic component main body. An axial type electronic component characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4978689U JPH02140830U (en) | 1989-04-27 | 1989-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4978689U JPH02140830U (en) | 1989-04-27 | 1989-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02140830U true JPH02140830U (en) | 1990-11-26 |
Family
ID=31567773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4978689U Pending JPH02140830U (en) | 1989-04-27 | 1989-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02140830U (en) |
-
1989
- 1989-04-27 JP JP4978689U patent/JPH02140830U/ja active Pending