JPH02140796U - - Google Patents

Info

Publication number
JPH02140796U
JPH02140796U JP5085189U JP5085189U JPH02140796U JP H02140796 U JPH02140796 U JP H02140796U JP 5085189 U JP5085189 U JP 5085189U JP 5085189 U JP5085189 U JP 5085189U JP H02140796 U JPH02140796 U JP H02140796U
Authority
JP
Japan
Prior art keywords
moisture
adhesive layer
proof film
electrodes
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5085189U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5085189U priority Critical patent/JPH02140796U/ja
Publication of JPH02140796U publication Critical patent/JPH02140796U/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D7/00—Bending rods, profiles, or tubes
    • B21D7/02—Bending rods, profiles, or tubes over a stationary forming member; by use of a swinging forming member or abutment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D7/00—Bending rods, profiles, or tubes
    • B21D7/06—Bending rods, profiles, or tubes in press brakes or between rams and anvils or abutments; Pliers with forming dies
    • B21D7/063—Pliers with forming dies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るＥＬ素子の実例を示す断
面図、第２図は従来品を示す正面図、第３図は第
２図Ａ−Ｂ線で切断し矢印方向から見た断面図で
ある。 １……透明電極、２……背面電極、３……発光
体層、５……ホツトメルト接着剤層、６……防湿
フイルム、８……接着剤層、９……被覆材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 少なくとも一方が透明な互に対向する電極と、
    両電極間に配置された発光体層を有する素子本体
    がホツトメルト接着剤層付き防湿フイルムで封止
    されており、更に該防湿フイルムの封止端部が接
    着剤層付き被覆材で覆われて成るエレクトロルミ
    ネセンス素子。
JP5085189U 1989-04-28 1989-04-28 Pending JPH02140796U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5085189U JPH02140796U (ja) 1989-04-28 1989-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5085189U JPH02140796U (ja) 1989-04-28 1989-04-28

Publications (1)

Publication Number Publication Date
JPH02140796U true JPH02140796U (ja) 1990-11-26

Family

ID=12870225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5085189U Pending JPH02140796U (ja) 1989-04-28 1989-04-28

Country Status (1)

Country Link
JP (1) JPH02140796U (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093661A (ja) * 1999-09-22 2001-04-06 Semiconductor Energy Lab Co Ltd Ｅｌ表示装置及び電子装置
JP2004006254A (ja) * 2003-02-13 2004-01-08 Semiconductor Energy Lab Co Ltd Ｅｌ表示装置
JP2006196466A (ja) * 2006-03-09 2006-07-27 Semiconductor Energy Lab Co Ltd 表示装置の作製方法
JP2006261123A (ja) * 2006-03-17 2006-09-28 Semiconductor Energy Lab Co Ltd カーオーディオ、表示装置、音響再生装置、及び携帯情報端末
KR100670256B1 (ko) * 2004-12-23 2007-01-16 삼성에스디아이 주식회사 평판 표시장치 및 그 제조방법
JP2010244698A (ja) * 2009-04-01 2010-10-28 Seiko Epson Corp 有機ｅｌ装置、有機ｅｌ装置の製造方法、電子機器
JP2016162485A (ja) * 2015-02-26 2016-09-05 富士フイルム株式会社 有機エレクトロルミネッセンス装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161871B2 (ja) * 1981-03-19 1986-12-27 Nippon Kokan Kk
JPS6325495B2 (ja) * 1981-10-01 1988-05-25 Nippon Electric Co

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161871B2 (ja) * 1981-03-19 1986-12-27 Nippon Kokan Kk
JPS6325495B2 (ja) * 1981-10-01 1988-05-25 Nippon Electric Co

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093661A (ja) * 1999-09-22 2001-04-06 Semiconductor Energy Lab Co Ltd Ｅｌ表示装置及び電子装置
JP2004006254A (ja) * 2003-02-13 2004-01-08 Semiconductor Energy Lab Co Ltd Ｅｌ表示装置
JP4641707B2 (ja) * 2003-02-13 2011-03-02 株式会社半導体エネルギー研究所 表示装置
KR100670256B1 (ko) * 2004-12-23 2007-01-16 삼성에스디아이 주식회사 평판 표시장치 및 그 제조방법
JP2006196466A (ja) * 2006-03-09 2006-07-27 Semiconductor Energy Lab Co Ltd 表示装置の作製方法
JP4663554B2 (ja) * 2006-03-09 2011-04-06 株式会社半導体エネルギー研究所 表示装置の作製方法
JP2006261123A (ja) * 2006-03-17 2006-09-28 Semiconductor Energy Lab Co Ltd カーオーディオ、表示装置、音響再生装置、及び携帯情報端末
JP4663560B2 (ja) * 2006-03-17 2011-04-06 株式会社半導体エネルギー研究所 カーオーディオ、音響再生装置および携帯情報端末
JP2010244698A (ja) * 2009-04-01 2010-10-28 Seiko Epson Corp 有機ｅｌ装置、有機ｅｌ装置の製造方法、電子機器
JP2016162485A (ja) * 2015-02-26 2016-09-05 富士フイルム株式会社 有機エレクトロルミネッセンス装置

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