JPH021395A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent electrodes from being exfoliated due to thermal strain or the like by covering a plurality of the electrodes by an insulating protective member on one side of the electrodes so as to cover at least a gap between the electrodes and also electrode parts adjacent to the gap in an area other than a region in which the electrodes make contact with external terminals. CONSTITUTION:A lead frame 15 is provided with an insulating protective material 14 such as a polyimide resin for covering a plurality of electrodes 11 on one side 12 thereof so as to cover at least a gap between the electrodes 11 and also electrode parts adjacent to the gap in an area other than a region in which the electrodes make contact with external terminals, and an IC 18 is placed on and adhered to the other side 16 of the lead frame 15 by a die- bonding resin 17. The part including the IC 18, the other side 16 of the electrodes 11 and conductor wires 19 is covered by a sealing resin 20, together with the one side 12. Since the area of the gap between the electrodes 11 is covered by the protective material 14, the electrodes 11 are hardly exfoliated from the sealing resin even in the presence of external forces, thermal strain or the like, and reliability of an IC module is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an integrated circuit device (hereinafter referred to as an IC module) used, for example, in an RC card or the like.

Conventional technology An IC card as a portable information file has an IC module with memory and a microprocessor embedded in a part of the card, and has arithmetic functions to write, read, and erase information via a reader/writer. However, if the thickness of the re card is Is○ standard, the maximum is 0.84
Mi! J, and the IC module is what determines its thickness.

Conventionally, double-sided substrates made of glass epoxy materials have often been used in the structure of IC modules, but due to the poor thickness accuracy of the substrates, the thickness of the finished IC modules also varies greatly.

In order to solve this problem, the applicant previously proposed a lead frame type device with improved thickness accuracy.

Its structure will be explained with reference to FIG.

A band-shaped metallic material is formed into a predetermined shape by punching or photo-etching, and a part 2 of the lead frame 1 is plated with nickel, gold, etc. to form an electrode 3 that is in contact with an external terminal. An integrated circuit (hereinafter referred to as IC) 5 is die-bonded to the surface 4 using a die-bonding resin 6, and the above-mentioned pond surface 4 and the above-mentioned construction C5 are bonded by a wire bonding method using a conductor wire 7 of, for example, gold, aluminum, copper, etc. Connect the input and output ports (not shown).

Then, using a transformer molding method using a molding material such as epoxy, the above IC5° and the above conductor wire 7,
and covers the other surface 4. In this structure, the upper surface of the sealing resin 8 is substantially parallel to the above-mentioned part 2, and the above-mentioned part 2 is exposed.

Problems to be Solved by the Invention When the IC 5 is covered with the sealing resin 8 using a transfer molding method, the sealing resin 8 contains a mold release agent in order to improve the releasability from the mold after molding. material is mixed. Conversely, improving the mold releasability from the mold does not mean that the adhesive force with the lead frame 1 is also weak, and the lead frame 1 may be damaged by external force or thermal strain. This causes a problem of peeling off from the stopper resin 8, which reduces the reliability of the re module.

On the other hand, in the IC module mounting process, since the thickness of the lead frame 1 is as thin as about 0.15 mm, the lead frame 1 may easily become glued or warped between the plurality of electrodes 3. Unevenness in height may occur, causing the IC5 to tilt during heat curing when die-bonding the above-mentioned IC5 with the die-bonding resin 6, and similarly, unevenness in the height between the electrodes 3 may result in poor wire bonding properties ()v
- This will have a large effect on the height, tensile strength, etc.). Also, during transfer molding, the lead frame 1
Since it is very difficult to make the above-mentioned side 2 of the electrode 3 adhere uniformly to the lower mold, the sealing resin 8 surrounds and adheres to the above-mentioned side 2 of the above-mentioned ``electrode 3'', and the contact with the external terminal is caused. Poor contact occurs.

Furthermore, various mounting equipment such as die bond, wire bond, etc.
Baking, transfer molding, cutting.

Due to the structure of the equipment, particularly in transportation systems for inspections, etc., mechanical damage (scratches) is likely to occur on one surface 2 of the electrode, which may cause poor appearance.

Means for Solving the Problem The technical means of the present invention for solving this problem is to cover one surface of the electrodes with an insulating protective material at least between the electrodes other than the contact area where the external terminal contacts. It is covered.

Function: This groove bottom allows the area between the electrodes on one side of the electrode to be covered with an insulating protective material, making it difficult for the electrode to peel off from the sealing resin even under external force or thermal strain, increasing the reliability of the IC module. On the other hand, there is no unevenness in height between the electrodes of the lead frame during the mounting process, so die bonding and wire bonding properties are good, and the sealing resin does not surround the contact area of the electrodes. Furthermore, the mounting yield can be improved because the contact area of the electrodes is less likely to be damaged by mounting equipment or the like.

EXAMPLE An example of the present invention will be described below with reference to the drawings. FIGS. 1a and 1b are a new structural diagram and a top view of an IC module according to an embodiment of the present invention as seen from the electrode section.

The other surface of the lead frame 16 is covered with an insulating protective material 14 such as polyimide resin, extending at least between the electrodes 11 except for the contact area 13 that contacts the external terminal on the one surface 12 side of the plurality of electrodes 11. 16, the IC 1B is bonded and mounted with a die bonding resin 17, and the input/output pads (not shown) of the ICl 3 and the other surface 16 of the electrode 11 are bonded using a wire bonding method using, for example, gold, aluminum, copper, etc. Connect with the conductor wire 19. After that, the above lG1
8, the curved surface 16 of the "7H'M11" and the conductor wire 1
9, the negative surface 12 side of the plate 11 is covered with a sealing resin 2o.The insulating protective material 1
Although polyimide resin is used as material 4 in this embodiment, it is also possible to use a resin material as long as it is heat resistant, has strong adhesion to the lead frame 15, and is thin, for example, 100 microns or less. In the embodiment shown in FIG. 1, one surface 12 of the electrode 11 is shown in a flat state, but the structure is such that a thin step is provided in the region covered with the insulating protective material 14, and the step region is covered with the insulating material 14. The protective material 14 may have a depressed shape.

In addition, the insulating protective material 14 not only extends between the electrodes 11, but also extends from the end surface of the electrode 11 to the entire or 1/i: It may be covered for a predetermined distance.

In this case, the distance between the ends 12 of the electrode 11 covered with the insulating protective material 14 was approximately jO mm from the end face of the electrode 11.

Furthermore, if the size of the ICl 3 is small and a die pad (not shown) for Guibond is provided, the surface 12 of the die pad other than the contact area 13 of the '1 holder 11 is
Needless to say, the insulating protective material 14 covers the entire area. In this case, the entire surface of the die pad or only the outer periphery may be covered with the insulating protective material 14.

In one embodiment of the present invention, the ICl 3 is placed on the other surface 16 of the upper part of the lead frame 15;
Although the die punching method and the wire bonding method are used to connect the 18 input/output pads to the pond surface 16 of the electrode 11, other methods such as wireless bonding using bumps may be used.

The above manufacturing process of the present invention will be explained with reference to FIG. At least one surface 12 of the lead frame 15 other than the contact area 13 in contact with the external terminal is covered with an insulating protective material 1 such as, for example, polyimide resin, across the plurality of electrodes 11.
4 (Figure 2a). In this state, the ends 12 of the lead frame 15 are kept substantially flat by the insulating protection material 14. At this time, the bonding conditions between the insulating protective material 14 and the reprint 11 are, for example, 27Q°C;
After 2 hours, the thickness of the insulating protective material 14 is about 60 microns.

Next, the ICl3 is bonded to the Ba surface 6 of the lead frame 15 using a layer of Guibond resin 17, and the input and output ports of the work C18 and the pond surface 16 of the electrode 11 are bonded.
Using wire bonding method, for example, gold conductor wire 1
9 (Figure 2b).

Furthermore, the contact area 13. Using a lower mold that makes uniform contact with the insulating protective material 14, the surface 16 of the lead frame 15. ICl3 above.

The conductor wire 19 is covered with a sealing resin 20 (
Figure 2C). At this time, the sealing resin 20 is
Needless to say, it also penetrates between the holes 11 and 12 and is formed almost flat with the above-mentioned negative surface 12.

Effects of the Invention Since the IC module of the present invention has a part of one principal surface covered between the electrodes with an insulating protective material, the following effects can be obtained.

(1) The reliability of the IC module is improved because the electrodes do not come off due to external force or thermal strain.

(2) The contact area of the electrode is less likely to be scratched during the mounting process, and the rate of products with good appearance can be improved.

(3) Since the height between the electrodes of the lead frame is almost constant, the bonding and wire bonding properties of the mounting process are good and stable.

(4) Similarly, there is no enclosing of the sealing resin in the contact area of the electrode, and it is possible to improve the mounting yield.

[Brief explanation of the drawing]

Figures 1a and 1b are cross-sectional views of the IC module of the present invention.
FIG. 3, which is a manufacturing flow diagram of the C module, is a cross-sectional structural diagram of an IC module using a conventional lead frame. 11...Electrode, 1 color...Contact area, 1
4... Insulating protective material, 15... Lead frame 18rC12o... Sealing resin. Name of agent: Patent attorney Toshio Nakao and one other person Figure (α) Figure

Claims (1)

[Claims] A plurality of electrodes arranged in a planar manner at intervals, and an insulating protective material coated at least between the electrodes on a portion of one side of these electrodes other than the contact area where an external terminal contacts. , an integrated circuit placed on the other surface of the electrode and having a plurality of input/output pads connected to the other surface of the electrode, and a sealing resin covering at least the integrated circuit on one surface of the electrode. integrated circuit device.