JPS58130582A - Display device - Google Patents
Display deviceInfo
- Publication number
- JPS58130582A JPS58130582A JP57011855A JP1185582A JPS58130582A JP S58130582 A JPS58130582 A JP S58130582A JP 57011855 A JP57011855 A JP 57011855A JP 1185582 A JP1185582 A JP 1185582A JP S58130582 A JPS58130582 A JP S58130582A
- Authority
- JP
- Japan
- Prior art keywords
- wiring body
- pellet
- wiring
- electrode
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 abstract description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052737 gold Inorganic materials 0.000 abstract description 4
- 239000010931 gold Substances 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 18
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- SAOPTAQUONRHEV-UHFFFAOYSA-N gold zinc Chemical compound [Zn].[Au] SAOPTAQUONRHEV-UHFFFAOYSA-N 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の属する技術分野〕
この発明は発光ダイオード（ＬＥＤ）を用いたディスプ
レイ装置に係わり、特にＬＥＤの実装構造を改善したデ
ィスプレイＳｔに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to a display device using light emitting diodes (LEDs), and particularly to a display St with an improved mounting structure of LEDs.
多数のＬＢＤをマトリクス配列し、このＬＩＰＩＤに選
択的な電気信号を送って数字や図形を表示するディスプ
レイ装置ではＬＢＤと配線体との接続方法及び構造を工
夫することが必要である。従来゛ の最も一般的な接続
方法はカンード配線体及びアノード配線体が設けられた
絶縁基板を用い、まずカソード配線体上に導電性ペース
トでＬＢＤペレットを固着し１次いでとのＬＢＤペレッ
ト上の電橋とアノード配線体とをワイヤ・ボンディング
で接続する手法であった。しかしａめて多数のＬｇＤを
用いて高密度で大型のディスプレイ￥＋４を得るにはよ
り簡便な接続方法で且つ簡単な構造にして低廉化を図る
ことが望まれ、る。In a display device that displays numbers and figures by arranging a large number of LBDs in a matrix and sending selective electrical signals to the LIPIDs, it is necessary to devise a connection method and structure between the LBDs and wiring bodies. The most common conventional connection method is to use an insulating substrate provided with a cando wiring body and an anode wiring body, first fix the LBD pellet on the cathode wiring body with conductive paste, and then connect the electric current on the LBD pellet with the first one. The method was to connect the bridge and the anode wiring body using wire bonding. However, in order to obtain a high-density, large-sized display using a large number of LgDs, it is desirable to use a simpler connection method and a simpler structure to reduce the cost.
先に出願した特願昭５５−１２７１８１号のディスプレ
イ装置の製造方法は、このような要求に対処した方法で
、これを簡略して述べると、まず基板上に固着したＬＥ
Ｄペレットの上面電極を粘着性テープの粘着剤で保護す
る。次いで基板と粘着性テープのすき間に絶縁性樹脂例
えばエポキシを充填し硬化する。更に粘着性テープを剥
がして表面にＬＩＤペレット上電極相互を結ぶ配線体を
施こす方法である。又１次いで出願した特願昭５６−１
４８８３７号及び特願昭４５６−１４８８３９号は、上
記方法を更に改良して工程の短縮と連結可節な基板に於
いても配線体の欠陥をなくすなどを目的としたディスプ
レイ￥１！ｆを提供するものである。すなわち第１図の
ようにまずあらかじめ銅箔等をはりつけてエツチング加
工した所望の金属バタンを耐熱性の粘着性テープ上に形
成しておく。The method for manufacturing a display device disclosed in Japanese Patent Application No. 55-127181, which was previously filed, is a method that addresses these requirements.
Protect the top electrode of the D pellet with the adhesive of the adhesive tape. Next, an insulating resin such as epoxy is filled into the gap between the substrate and the adhesive tape and cured. Furthermore, the adhesive tape is peeled off and a wiring body connecting the electrodes on the LID pellet is applied to the surface. Also, a patent application filed in 1982-1
No. 48837 and Japanese Patent Application No. 456-148839 further improve the above-mentioned method to shorten the process and eliminate defects in the wiring even in connectable boards. f. That is, as shown in FIG. 1, a desired metal button is first formed on a heat-resistant adhesive tape by pasting copper foil or the like and etching it.
次にこの粘着性テープで、所定の間隔をもって基板の配
線体上に配列されたＬＥＤペレットの上面に密着させ、
この粘着性テープと基板との間隔領域にエポキシ等の絶
縁性樹脂６を毛細管現象な利用してしみ込ませ硬化した
のち、粘着性テープをはがす。Next, use this adhesive tape to tightly adhere the LED pellets arranged at predetermined intervals on the wiring body of the board,
An insulating resin 6 such as epoxy is infiltrated into the space between the adhesive tape and the substrate using capillary action and cured, and then the adhesive tape is removed.
次いで基板側に一体化された金属バタンとＩＪＤの上部
電極とを銀ペースト等の導電性ペースト礁により接続を
するように構成したものである。Next, the metal tab integrated on the substrate side and the upper electrode of the IJD are connected by a conductive paste layer such as silver paste.
しかしながら４１ ＬＥＤペレットの上面電機３！をエ
ポキシ樹脂６が流れ込まないように粘着性テープの粘着
面で押えつけるときに、粘着剤がＬＢＤペレットの上面
周囲にはみ出し、その結果として図中人で示すようなエ
ポキシのへこみができてしまい、後工程の銀ペースト印
刷による配線体接続工程に於いて、この銀ペーストの断
線がしばしば発生した。この導電性ペースト配線体の断
■れを無くす為の工夫として、金属パタンの一部をＬＥ
Ｄペレット上面電極に延設するように設けておくことが
考えられる。However, 41 LED pellet top electric machine 3! When pressing the epoxy resin 6 with the adhesive side of the adhesive tape to prevent it from flowing in, the adhesive protrudes around the top surface of the LBD pellet, resulting in the creation of epoxy dents as shown by the person in the figure. In the wiring body connection process using silver paste printing in the subsequent process, disconnection of the silver paste often occurred. In order to eliminate the breakage of this conductive paste wiring body, a part of the metal pattern was
It is conceivable to provide it so as to extend to the upper surface electrode of the D pellet.
しかしながら、このような金属バタンかＩＩＤペレット
上面に延設される構造に於いては、ＬＢＤペレット上面
部を粘着性テープの粘着面で保護することが出来ず、Ｌ
ＥＤベレット上面部にエポキシが流れ込む。従って、金
属バタンとＬＩＩＤペレットの上面電機との接触を導電
性ペーストで行うことが不可能となり、先に出願した特
願昭５６−１４８８４６号Ｃ図示せず）のように、あら
かじめ粘着性テープに金属パタンの表面に低融点金属等
を設けておき、溶接により電気的接続をなす工夫がされ
ている。ところがこうした手法は多数のＬＥＤペレット
を均一な高さで構成しなくてはならない事や、又、ＩＩ
Ｄペレット上の電ａの厚みを１０μｍ以上にすることが
必要となり、高価なＬＥＤペレツＦになってしまう事が
ある。更に、ＩＩＤベレット上の電極として一般に用い
られている金や金−亜鉛合金等のオーミック電ａと、低
融点金属とは共晶を起して溶けてしまい、いわゆるゴー
ルド・リーチが発生する等の問題があり、これらの点を
解決する為には高度な技術を必要とするものであった。However, in such a structure in which the metal batt is extended over the top surface of the IID pellet, the top surface of the LBD pellet cannot be protected with the adhesive surface of the adhesive tape, and the
Epoxy flows into the upper surface of the ED pellet. Therefore, it is impossible to make contact between the metal slam and the top electric machine of the LIID pellet using conductive paste, and as in the previously filed Japanese Patent Application No. 148846/1984 (not shown), adhesive tape is used in advance. A method has been devised to provide a low melting point metal or the like on the surface of the metal pattern and to make an electrical connection by welding. However, with this method, a large number of LED pellets must be arranged at uniform heights, and II.
It is necessary to make the thickness of the electrode a on the D pellet 10 μm or more, which may result in an expensive LED pellet F. Furthermore, ohmic electrodes such as gold and gold-zinc alloys, which are commonly used as electrodes on IID pellets, and low-melting point metals form eutectics and melt, resulting in so-called gold reach. There were problems, and solving these problems required advanced technology.
そこでこうした点の解決にあって発明者らは第２図に示
すような実験を試みた。In order to solve these problems, the inventors attempted an experiment as shown in FIG.
すなわち、まず、基板ｌ上に設けられた＠ｌの配線体２
と絶縁されて直交する＠２の配線体５となる金属箔のバ
タンを保持する粘着性テープ８を用意する。この金属箔
のバタンＳはＬＥＤペレット３上を走る延設される部位
をもつもので、その厚みは従来的５０．ａｍであったも
のを５〜４０μｍと薄くした。又、粘着性テープ８の粘
着剤の厚みも約２５μｍであったものを約！ｓＯμｍと
匣＜シた。そしてこの粘着性テープ８を用いて金嘱バタ
ンの延設部位がＬｇＤベレット３上に来るように位鐙合
せしたのち、粘着性テープ８の表面側から平らな板で押
えつけるなどの工程を加えることによって、ＬＩｉＤベ
レット３上に金属バタンを乗せる構造にしても、この金
属バタン以外のＬＥＤベレット表面を粘着剤で覆うこと
に成功した。That is, first, the wiring body 2 of @l provided on the substrate l
An adhesive tape 8 is prepared to hold a metal foil tab that will become the wiring body 5 of @2, which is insulated and perpendicular to the wiring body 5. This metal foil button S has an extended portion that runs above the LED pellet 3, and its thickness is 50 mm compared to the conventional thickness. What used to be am was made thinner to 5 to 40 μm. Also, the thickness of the adhesive of the adhesive tape 8 was about 25 μm, but it was about 25 μm thick! sOμm and box. Then, using this adhesive tape 8, the stirrup is aligned so that the extended part of the metal baton is on the LgD bellet 3, and then a process such as pressing it down with a flat plate from the surface side of the adhesive tape 8 is added. As a result, even with a structure in which a metal button is placed on the LIiD pellet 3, the surface of the LED pellet other than the metal button was successfully covered with adhesive.
しかしながら纂２図のＢに示すように粘着性テープ８と
基板のすき間にエポキシ樹脂６を充填し硬化した後に、
この粘着性テープ８をはがすと。However, as shown in Fig. 2B, after filling the gap between the adhesive tape 8 and the substrate with epoxy resin 6 and curing it,
Peel off this adhesive tape 8.
ＬＥＤベレット３上面に配設された部位から金属パタン
Ｓがはがれてしまうことがわかった。It was found that the metal pattern S was peeled off from a portion disposed on the upper surface of the LED pellet 3.
本発明の目的は、多数個のＬＥＤペレットで。 The object of the present invention is to use a large number of LED pellets.
かつ、連結可能な基板を用いたマ）９ツクス形のディス
プレイ装置の低価格アセンブリを目的とした方法や構造
に於いて前述したような幾多の問題を一挙に解決で傘る
ディスプレイ装置を提供するにある。In addition, the present invention provides a display device that solves all of the aforementioned problems at once in a method and structure aimed at low-cost assembly of matrix-type display devices using connectable substrates. It is in.
すなわち、絶縁性の基板の一主面側にはｊｌｌの１線体
が形成され、この第１の配線体上には導電性ペースト等
で固着配列したＬＥＤベレットがある。That is, a jll single wire body is formed on one main surface side of an insulating substrate, and on this first wiring body there are LED pellets fixed and arranged with conductive paste or the like.
そして、このＬＢＤベレッＦの上面と同じ高さで基板の
表面−帯に充填硬化したエポキシ等の絶縁性樹脂がある
。父、基板の主面に対向した面には所定の部分でＬＥＤ
ペレットを横ぎって配設した＠２の配線体があり、この
第２の配線体はＬＥＤペレット上面を除く他の部分で絶
縁性樹脂に埋設固着されている。An insulating resin such as epoxy is filled and hardened on the surface of the substrate at the same height as the upper surface of the LBD bellet F. Father, on the surface opposite to the main surface of the board, there are LEDs in a predetermined part.
There is a wiring body @2 disposed across the pellet, and this second wiring body is embedded and fixed in the insulating resin in the other part except the upper surface of the LED pellet.
この為に第２の配線体はＬｇＤベレツＦ上面で粘着性テ
ープをはがす工程で引きはがされることはなく、従って
後工程となる導電性ペースト等による第３の配線体形成
工程で第２の配線体とＬＩＤベレット上面の電橋との接
続が簡単で確実に行なえるようになった。For this reason, the second wiring body is not torn off in the process of peeling off the adhesive tape on the top surface of LgD Verets F, and therefore the second wiring body is not peeled off in the process of forming the third wiring body using conductive paste, etc., which is a later process. The wiring body and the electric bridge on the top of the LID pellet can now be easily and reliably connected.
以下＊Ｓ−〜ＩＩ６図を参照して本発明の実施例を詳細
に説明する。Embodiments of the present invention will be described in detail below with reference to *S--II6 figures.
纂３図は本発明の基本構造を示す部分断面囚であり、１
１４図はその部分実体斜視図である。Figure 3 is a partial cross-section showing the basic structure of the present invention.
FIG. 14 is a partial perspective view thereof.
まず、アルミナ等のセラミック基板１に金ぺ一スシを印
刷し５００〜９００”Ｃで焼成する処逼を施こして厚さ
約１０／１ｍ、幅約４ＧＯｐｍの複数本の＠１の配線体
２を形成する１次にこの第１の配線体２の一部分にポツ
ティングでおよそ４００声ｍφ、高さ５０７ｇｍの導電
性ペースト例えば銀ペースト４を形威し、この上から縦
、横、高さがそれぞれ３００声鵬のＬＥＤａレット８を
乗せ。First, a gold paste is printed on a ceramic substrate 1 made of alumina or the like and fired at 500 to 900"C to form a plurality of @1 wiring bodies 2 with a thickness of about 10/1 m and a width of about 4 GOpm. First, a conductive paste, for example, silver paste 4, with a diameter of about 400 mφ and a height of 507 gm is potted onto a part of the first wiring body 2, and from above, the vertical, horizontal, and height are respectively 300 Koeho's LEDalet 8 is installed.
およそ１ｓＯ℃、ｚ時間程度の熱処理を施こすことで基
板ｌの第１の配線体ｚ上に固着する。By performing heat treatment at approximately 1 sO<0>C for approximately z hours, it is fixed onto the first wiring body z of the substrate l.
次に例えば厚さおよそ５０μｍのポリイミド樹脂からな
るテープ支持体に１例えば厚さおよそ５０μｍのシリコ
ーン系粘着剤を一体化してなる粘着性テープに銅箔をは
り合せ、この銅箔を写真蝕刻でバタン形成した第２の配
線体５が準備される。Next, a copper foil is attached to an adhesive tape made by integrating a silicone adhesive with a thickness of about 50 μm to a tape support made of polyimide resin with a thickness of about 50 μm, and the copper foil is stamped with photolithography. The formed second wiring body 5 is prepared.
この＠２の配線体５の厚さは銅箔の厚さで決まり。The thickness of the wiring body 5 of @2 is determined by the thickness of the copper foil.
粘着性テープの粘着剤がＬＥＤベレット上面に密着する
ように薄くシ、一方機械的強賓を備える厚みであること
が必要である。例えば粘着剤の厚みが５０μｍにあって
は２０μｍ程度の厚さが機械的強度からして好ましく、
さらには粘着剤の厚さより＠２の配線を薄くすることが
特に有効である。The adhesive of the adhesive tape needs to be thin enough to adhere to the top surface of the LED pellet, but thick enough to provide mechanical strength. For example, if the thickness of the adhesive is 50 μm, a thickness of about 20 μm is preferable from the viewpoint of mechanical strength.
Furthermore, it is particularly effective to make the @2 wiring thinner than the thickness of the adhesive.
又、この＠２の配線体５は、基板Ｉ Ｃ設けられた＠ｌ
の１線体２と直交し、かつ、ＬＥＤベレット３のない領
域に配設されるように作られた幅１００〜５００戸舅の
主部５１と、この主部５１から枝分れしＬＥＤベレット
上面を横切る幅３０〜１００μｍの創部５２とからなっ
ている。Also, the wiring body 5 of @2 is connected to @l provided with the board IC.
A main part 51 with a width of 100 to 500, which is orthogonal to the linear body 2 and arranged in an area where there is no LED pellet 3, and an LED pellet branched from this main part 51. It consists of a wound 52 with a width of 30 to 100 μm across the upper surface.
次にこの粘着性テープで保持した＠２の配線体５の副Ｉ
Ｉ！＄２が基板１のＬＩＤペレット３の上面のほぼ中央
を横切るように位−合セし、次いで粘着性テープの表面
より平板を用いて押圧を加えることにより、粘着性テー
プの粘着剤で第２の配線体５の副部５２をつつむように
ＬＥＤペレット３の表面と密着保持する。Next, the secondary I of the wiring body 5 of @2 held with this adhesive tape
I! $2 is aligned so that it crosses approximately the center of the upper surface of the LID pellet 3 on the substrate 1, and then by applying pressure using a flat plate from the surface of the adhesive tape, the second The secondary portion 52 of the wiring body 5 is held in close contact with the surface of the LED pellet 3 so as to surround it.
次に粘着性テープで一体化した基板ｌを裏返しにして粘
着性テープと基板１とのすき間に絶縁性樹脂例えばエポ
キシ樹脂６を例えば毛細管現象により充填する。エポキ
シ６を充填した後およそ１２０℃で５時間、更に１５０
℃で１０時間の熱処理を施こしてこのエポキシ６を硬化
する。そしてこの粘着性テープをはがせば、−ＬＥＴ）
ペレッシ３の高さで統一されたエポキＶ６の表面とこの
エポキシ６に埋め込まれた１ｇ２の配線体５の主部５１
及び副部５２が形成される。Next, the substrate 1 integrated with the adhesive tape is turned over, and an insulating resin such as an epoxy resin 6 is filled into the gap between the adhesive tape and the substrate 1 by, for example, capillary action. After filling with epoxy 6, at approximately 120°C for 5 hours, then at 150°C.
This epoxy 6 is cured by heat treatment at .degree. C. for 10 hours. And if you peel off this adhesive tape, -LET)
The surface of the epoxy V6 unified at the height of Peresi 3 and the main part 51 of the 1g2 wiring body 5 embedded in this epoxy 6
and a sub-portion 52 are formed.
次に第２の配線体５の創部５２とＬＥＤペレット３の上
面電−３２とを接続する為、スクリーン印刷法により導
電性ペースシ例えば銀ペーストでＳａの配線体７を形成
し、この後およそ１５０℃で２時間の熱処理を施こして
ディスプレイｅｌｆを完成することができる。Next, in order to connect the wound part 52 of the second wiring body 5 and the upper surface electrode 32 of the LED pellet 3, a wiring body 7 of Sa is formed using a conductive paste, for example, silver paste, by screen printing method, and after this, approximately 150 mm The display ELF can be completed by heat treatment at ℃ for 2 hours.
尚％第２の配線体の形状は上記した実施例にかぎらず例
えば１画素内に発光色の異なる２種類以上のＬＥＤベレ
ットが配設されるような場合にあっては第５図の平面図
に示すような形状や纂６図の平面図に示す（Ｘ） 、
（Ｙ） 、 （Ｚ）のような形状であってもよいつ
以上説明したように本発明の構造を適用することによっ
てディスプレイ５７Ｍ１ｆの製造工程を大幅に短縮し価
格の低減化を計るばかりでなくディスプレイ装置のイキ
頼性を向上させるものである。Note that the shape of the second wiring body is not limited to the above-described embodiment, but for example, in the case where two or more types of LED pellets with different emission colors are arranged in one pixel, the shape of the second wiring body is as shown in the plan view of FIG. 5. The shape as shown in Figure 6 (X) shown in the top view of Figure 6,
(Y) or (Z) As explained above, by applying the structure of the present invention, not only can the manufacturing process of the display 57M1f be significantly shortened and the price can be reduced. This improves the reliability of the display device.
箪１図は従来の技術によるディスプレイ装置の構造を示
す断面因、＠２図は従来の技術を改善工夫した実験例を
示す断面図、８１３図及びｌｌｌ４ｒｌ！Ｊは本発明の
構造を示す断面図及び実体斜視図一部断面図、＠５図及
び＠６図は本発明の変形例を示す平面図である。
ｌ・・・絶縁性基板
２・・・第１の配線体
３．８ｖ＆、８Ｇ・ＬＴ！、Ｄぺｖッ）ｒ３Ｇ緑色Ｌ
ｇＤ。
３重赤色ＬｇＤ）
３重・・・ＬＥｆＤペレットのＰＮ接合部３２・・・Ｌ
ＩＤベレットのアノード電極３３・・・ＬＢＤペレット
のカソード電ｉ４・・・導電性ペースト
５、Ｓｌ、！Ｓｌ−・第２の配線体
６・・・絶縁性樹脂
７・・・第３の配線体
８・・・粘着性テープ
代理人 弁理士 則 近 憲 佑
（ほか１名）
第 １ 図
第２図
第 ８ 図
第４図
／Figure 1 is a cross-sectional view showing the structure of a display device according to the conventional technology, Figure @2 is a cross-sectional view showing an experimental example of improving the conventional technology, Figure 813, and lll4rl! J is a cross-sectional view and an actual perspective view showing the structure of the present invention, and a partial cross-sectional view, and Figures @5 and @6 are plan views showing modified examples of the present invention. l...Insulating substrate 2...First wiring body 3.8v&, 8G・LT! , Dpev) r3G green L
gD. Triple red LgD) Triple...LEfD pellet's PN junction 32...L
Anode electrode 33 of ID pellet... Cathode electrode i4 of LBD pellet... Conductive paste 5, Sl,! Sl-・Second wiring body 6...Insulating resin 7...Third wiring body 8...Adhesive tape Representative Patent attorney Noriyuki Chika (and 1 other person) Figure 1 Figure 2 Figure 8 Figure 4/
Claims (1)
上に１列置着したＬＩＣＤペレットと。 該ＬＥＤベレットの上面と同じ高さで前記基板表面−帯
に充填硬化した絶縁性樹脂と。 該絶縁性樹脂の上面に表面を露出して埋設固着１、り＠
２ノ１Ｆｉ１体と。 該＠２の配線体の表面と前記ＬＥＤベレットの−Ｆ面電
糧とを電気的に接続をなす第３の配線体とで構成するデ
ィスプレイ装置に於いて。 前記第２の配線体の一部が、前記ＬＩＤペレットの上面
を横ぎりかつ該ＬＥＤペレツシの上面に配設される部分
を除き前記絶縁性接脂で埋設固着されていることを特徴
とするディスプレイ装置。 敞のディスプレイ装置。(1) LICD pellets placed in one row on the wLl wiring body provided on one main surface of the insulating substrate. An insulating resin is filled and hardened into the substrate surface band at the same height as the upper surface of the LED pellet. The surface is exposed on the upper surface of the insulating resin and fixed 1.
With one 2-1 Fi. In a display device comprising a third wiring body that electrically connects the surface of the @2 wiring body and the -F side electric current of the LED pellet. A display characterized in that a part of the second wiring body is buried and fixed with the insulating adhesive except for the part that crosses the upper surface of the LID pellet and is disposed on the upper surface of the LED pellet. Device. A display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57011855A JPS58130582A (en) | 1982-01-29 | 1982-01-29 | Display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57011855A JPS58130582A (en) | 1982-01-29 | 1982-01-29 | Display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58130582A true JPS58130582A (en) | 1983-08-04 |
Family
ID=11789334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57011855A Pending JPS58130582A (en) | 1982-01-29 | 1982-01-29 | Display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58130582A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211182A (en) * | 1991-02-04 | 1992-08-03 | Sanyo Electric Co Ltd | Light emitting diode for optical printer |
| JP2002237618A (en) * | 2001-02-08 | 2002-08-23 | Sony Corp | Display device and it manufacturing method |
| JP2003078171A (en) * | 2001-09-03 | 2003-03-14 | Sony Corp | Wiring and its forming method, connection hole and its manufacturing method, wiring body and its forming method, display element and its manufacturing method, and image display device and its manufacturing method |
| JP2015525001A (en) * | 2012-08-15 | 2015-08-27 | 晶元光▲電▼股▲ふん▼有限公司 | Light emitting parts |
| JP2022505543A (en) * | 2018-11-13 | 2022-01-14 | ソウル バイオシス カンパニー リミテッド | Light emitting element |
-
1982
- 1982-01-29 JP JP57011855A patent/JPS58130582A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211182A (en) * | 1991-02-04 | 1992-08-03 | Sanyo Electric Co Ltd | Light emitting diode for optical printer |
| JP2002237618A (en) * | 2001-02-08 | 2002-08-23 | Sony Corp | Display device and it manufacturing method |
| JP4724924B2 (en) * | 2001-02-08 | 2011-07-13 | ソニー株式会社 | Manufacturing method of display device |
| JP2003078171A (en) * | 2001-09-03 | 2003-03-14 | Sony Corp | Wiring and its forming method, connection hole and its manufacturing method, wiring body and its forming method, display element and its manufacturing method, and image display device and its manufacturing method |
| JP2015525001A (en) * | 2012-08-15 | 2015-08-27 | 晶元光▲電▼股▲ふん▼有限公司 | Light emitting parts |
| JP2022505543A (en) * | 2018-11-13 | 2022-01-14 | ソウル バイオシス カンパニー リミテッド | Light emitting element |
| US11967605B2 (en) | 2018-11-13 | 2024-04-23 | Seoul Viosys Co., Ltd. | Light emitting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5519936A (en) | Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | |
| US5633533A (en) | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | |
| JPH0669275A (en) | Semiconductor device | |
| JPH06302653A (en) | Semiconductor device | |
| JPS58130582A (en) | Display device | |
| JP2501953B2 (en) | Semiconductor device | |
| US4258411A (en) | Electronic device packaging arrangement | |
| JPH0831869A (en) | Semiconductor device, manufacture thereof and mounting inspection method therefor | |
| US6208022B1 (en) | Electronic-circuit assembly | |
| JPS5850582A (en) | Display using light emitting diode | |
| WO2008138182A1 (en) | Chip type light-emitting diode | |
| JP2006286679A (en) | Semiconductor device and method of manufacturing it | |
| JPH0744202B2 (en) | Chip mounting method | |
| CN112151489B (en) | Lead frame, method for forming lead frame, and lead frame package | |
| JP3973309B2 (en) | Semiconductor device | |
| JPS58130581A (en) | Display device | |
| US6002164A (en) | Semiconductor lead frame | |
| JPS5850574A (en) | Display | |
| JPH03261153A (en) | Package for semiconductor device | |
| JPH0125973Y2 (en) | ||
| US6057177A (en) | Reinforced leadframe to substrate attachment | |
| JPH0241650Y2 (en) | ||
| JPS62249465A (en) | Semiconductor device | |
| JPH075642Y2 (en) | Integrated circuit package with fixing member | |
| JPS6155247B2 (en) |