JPH021376B2 - - Google Patents

Info

Publication number
JPH021376B2
JPH021376B2 JP56181596A JP18159681A JPH021376B2 JP H021376 B2 JPH021376 B2 JP H021376B2 JP 56181596 A JP56181596 A JP 56181596A JP 18159681 A JP18159681 A JP 18159681A JP H021376 B2 JPH021376 B2 JP H021376B2
Authority
JP
Japan
Prior art keywords
lead frame
lead
container base
melting point
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56181596A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5882552A (ja
Inventor
Takekio Mitsunobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP18159681A priority Critical patent/JPS5882552A/ja
Publication of JPS5882552A publication Critical patent/JPS5882552A/ja
Publication of JPH021376B2 publication Critical patent/JPH021376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP18159681A 1981-11-12 1981-11-12 リードフレーム Granted JPS5882552A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18159681A JPS5882552A (ja) 1981-11-12 1981-11-12 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18159681A JPS5882552A (ja) 1981-11-12 1981-11-12 リードフレーム

Publications (2)

Publication Number Publication Date
JPS5882552A JPS5882552A (ja) 1983-05-18
JPH021376B2 true JPH021376B2 (US07223432-20070529-C00017.png) 1990-01-11

Family

ID=16103569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18159681A Granted JPS5882552A (ja) 1981-11-12 1981-11-12 リードフレーム

Country Status (1)

Country Link
JP (1) JPS5882552A (US07223432-20070529-C00017.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0675910U (ja) * 1993-04-08 1994-10-25 小島プレス工業株式会社 車両用収納ボックスのドアロック機構

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4626478A (en) * 1984-03-22 1986-12-02 Unitrode Corporation Electronic circuit device components having integral spacers providing uniform thickness bonding film
US4629824A (en) * 1984-12-24 1986-12-16 Gte Products Corporation IC package sealing technique
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759367A (en) * 1980-09-26 1982-04-09 Fujitsu Ltd Semiconductor container

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759367A (en) * 1980-09-26 1982-04-09 Fujitsu Ltd Semiconductor container

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0675910U (ja) * 1993-04-08 1994-10-25 小島プレス工業株式会社 車両用収納ボックスのドアロック機構

Also Published As

Publication number Publication date
JPS5882552A (ja) 1983-05-18

Similar Documents

Publication Publication Date Title
US4727633A (en) Method of securing metallic members together
US4355463A (en) Process for hermetically encapsulating semiconductor devices
US4514750A (en) Integrated circuit package having interconnected leads adjacent the package ends
US5034350A (en) Semiconductor device package with dies mounted on both sides of the central pad of a metal frame
EP0015111B1 (en) Lead frame and housing for integrated circuit
US3902148A (en) Semiconductor lead structure and assembly and method for fabricating same
US4542259A (en) High density packages
US5102828A (en) Method for manufacturing a semiconductor card with electrical contacts on both faces
US3590328A (en) Module assembly and method of making same
US4025716A (en) Dual in-line package with window frame
US4470507A (en) Assembly tape for hermetic tape packaging semiconductor devices
JPH021376B2 (US07223432-20070529-C00017.png)
US3931922A (en) Apparatus for mounting semiconductor devices
US4415917A (en) Lead frame for integrated circuit devices
JP3127584B2 (ja) 樹脂製中空パッケージを用いた半導体装置
JPH0666354B2 (ja) 半導体装置
JP2875591B2 (ja) 半導体装置及びその製造方法
JP2585362B2 (ja) 封止型半導体装置とその製造方法
JPH0723961Y2 (ja) 半導体素子収納用パッケージ
JPS584959A (ja) 半導体装置
JPH069509Y2 (ja) 半導体素子収納用パッケージ
JPS62263665A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
JPS6155778B2 (US07223432-20070529-C00017.png)
JPS5856428A (ja) 半導体装置
JPH043501Y2 (US07223432-20070529-C00017.png)