JPH0213764U - - Google Patents
Info
- Publication number
- JPH0213764U JPH0213764U JP9229788U JP9229788U JPH0213764U JP H0213764 U JPH0213764 U JP H0213764U JP 9229788 U JP9229788 U JP 9229788U JP 9229788 U JP9229788 U JP 9229788U JP H0213764 U JPH0213764 U JP H0213764U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- conductors
- window
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 3
- 239000013039 cover film Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000004831 Hot glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9229788U JPH0213764U (US08197722-20120612-C00042.png) | 1988-07-11 | 1988-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9229788U JPH0213764U (US08197722-20120612-C00042.png) | 1988-07-11 | 1988-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213764U true JPH0213764U (US08197722-20120612-C00042.png) | 1990-01-29 |
Family
ID=31316744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9229788U Pending JPH0213764U (US08197722-20120612-C00042.png) | 1988-07-11 | 1988-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213764U (US08197722-20120612-C00042.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250836A (ja) * | 1995-03-08 | 1996-09-27 | Fujitsu Ltd | 印刷配線板の追加部品実装構造 |
| JP2001223465A (ja) * | 1999-11-30 | 2001-08-17 | Denso Corp | プリント配線基板の接続方法及び接続構造 |
| WO2019159463A1 (ja) * | 2018-02-19 | 2019-08-22 | 日本メクトロン株式会社 | 基板接続構造および基板接続構造の製造方法 |
-
1988
- 1988-07-11 JP JP9229788U patent/JPH0213764U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250836A (ja) * | 1995-03-08 | 1996-09-27 | Fujitsu Ltd | 印刷配線板の追加部品実装構造 |
| JP2001223465A (ja) * | 1999-11-30 | 2001-08-17 | Denso Corp | プリント配線基板の接続方法及び接続構造 |
| JP4590689B2 (ja) * | 1999-11-30 | 2010-12-01 | 株式会社デンソー | プリント配線基板の接続方法及び接続構造 |
| WO2019159463A1 (ja) * | 2018-02-19 | 2019-08-22 | 日本メクトロン株式会社 | 基板接続構造および基板接続構造の製造方法 |
| JP2019145624A (ja) * | 2018-02-19 | 2019-08-29 | 日本メクトロン株式会社 | 基板接続構造および基板接続構造の製造方法 |
