JPH02137028U - - Google Patents

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Publication number
JPH02137028U
JPH02137028U JP4312489U JP4312489U JPH02137028U JP H02137028 U JPH02137028 U JP H02137028U JP 4312489 U JP4312489 U JP 4312489U JP 4312489 U JP4312489 U JP 4312489U JP H02137028 U JPH02137028 U JP H02137028U
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JP
Japan
Prior art keywords
data
time
piping
computer
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4312489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0632675Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989043124U priority Critical patent/JPH0632675Y2/ja
Publication of JPH02137028U publication Critical patent/JPH02137028U/ja
Application granted granted Critical
Publication of JPH0632675Y2 publication Critical patent/JPH0632675Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Coating Apparatus (AREA)
JP1989043124U 1989-04-13 1989-04-13 半導体製造用塗布装置 Expired - Lifetime JPH0632675Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989043124U JPH0632675Y2 (ja) 1989-04-13 1989-04-13 半導体製造用塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989043124U JPH0632675Y2 (ja) 1989-04-13 1989-04-13 半導体製造用塗布装置

Publications (2)

Publication Number Publication Date
JPH02137028U true JPH02137028U (enExample) 1990-11-15
JPH0632675Y2 JPH0632675Y2 (ja) 1994-08-24

Family

ID=31555274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989043124U Expired - Lifetime JPH0632675Y2 (ja) 1989-04-13 1989-04-13 半導体製造用塗布装置

Country Status (1)

Country Link
JP (1) JPH0632675Y2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003266006A (ja) * 2002-03-14 2003-09-24 Fujitsu Ltd 薬液塗布装置及びその薬液管理方法
US7638001B2 (en) 2004-05-07 2009-12-29 Kabushiki Kaisha Toshiba Film forming apparatus, manufacturing management system and method of manufacturing semiconductor devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6273715A (ja) * 1985-09-27 1987-04-04 Toshiba Corp レジスト塗布装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6273715A (ja) * 1985-09-27 1987-04-04 Toshiba Corp レジスト塗布装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003266006A (ja) * 2002-03-14 2003-09-24 Fujitsu Ltd 薬液塗布装置及びその薬液管理方法
US7638001B2 (en) 2004-05-07 2009-12-29 Kabushiki Kaisha Toshiba Film forming apparatus, manufacturing management system and method of manufacturing semiconductor devices
US8122848B2 (en) 2004-05-07 2012-02-28 Kabushiki Kaisha Toshiba Film forming apparatus, manufacturing management system and method of manufacturing semiconductor devices

Also Published As

Publication number Publication date
JPH0632675Y2 (ja) 1994-08-24

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